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    • 17. 发明授权
    • Silicon nanostructure light-emitting diode
    • 硅纳米结构发光二极管
    • US5627386A
    • 1997-05-06
    • US549286
    • 1995-10-27
    • James F. HarveyRobert A. LuxRaphael Tsu
    • James F. HarveyRobert A. LuxRaphael Tsu
    • H01L33/34H01L27/15
    • H01L33/34
    • The invention provides light sources which are easily compatible with standard silicon VLSI processing and can be located directly in the material of the silicon VLSI chip. P-type silicon substrate is processed to produce proturbances, the proturbances preferably having tip dimensions on the order of 5-10 mm. A native oxide film (SiO.sub.2) is caused to develop on the surface of the silicon substrate. A thin, transparent, conductive film is then deposited on top of the SiO.sub.2. Electrical contacts are made to the top of the conductive film and to the bottom of the silicon substrate. The carriers for electroluminescence are supplied by the P-doped silicon substrate (holes) and the conductive film (electrons). When a voltage is applied across the layers via the electrical contacts, the holes are concentrated in the region of the tip of the proturbances because the electric field lines concentrate near a pointed object, and electron current across the SiO.sub.2 barrier in response to the voltage drop will be largest in the vicinity of the tip because the SiO.sub.2 barrier is thinnest there, resulting in strong visible luminescence.
    • 本发明提供了与标准硅VLSI处理容易兼容的光源,并且可以直接位于硅VLSI芯片的材料中。 P型硅衬底被加工以产生温度,其优点是尖端尺寸为5-10mm。 使天然氧化膜(SiO 2)在硅衬底的表面上显影。 然后将薄的,透明的导电膜沉积在SiO 2的顶部上。 电触点被制成导电膜的顶部和硅衬底的底部。 用于电致发光的载体由P掺杂硅衬底(空穴)和导电膜(电子)提供。 当通过电触点跨越层施加电压时,由于电场线集中在尖锐物体附近,所以孔集中在保护尖端的区域中,并且响应于电压降而跨越SiO 2势垒的电子电流 在尖端附近将是最大的,因为SiO 2屏障在那里最薄,导致强烈的可见发光。