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    • 15. 发明授权
    • Cooling apparatus for an electrical substrate
    • 电气基板用冷却装置
    • US08867210B2
    • 2014-10-21
    • US13664823
    • 2012-10-31
    • Deere & Company
    • Gregory K. HarmelinkChristopher J. Schmit
    • H05K7/20H01L23/34H01L23/473
    • H05K7/20254H01L23/473H01L2924/0002H05K7/20927H01L2924/00
    • A cooling apparatus is disclosed. The cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second exterior cooling surface. A second fluid-diverting structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first and second exterior cooling surfaces. An intermediate portion is in a facing relationship with the first and second outer portions. The intermediate portion defines an aperture for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. The fluid absorbs heat from the electrical substrate.
    • 公开了一种冷却装置。 冷却装置包括第一外部部分,其包括流体入口和第一外部冷却表面。 第一流体转向结构与流体入口流体连通。 第二外部部分包括流体出口和第二外部冷却表面。 第二流体转向结构与流体出口流体连通。 电气基板耦合到第一和第二外部冷却表面中的至少一个。 中间部分与第一和第二外部部分处于相对的关系。 中间部分限定用于在第一腔和第二腔之间传送流体的孔。 第一腔被限定在第一外部部分和中间部分之间。 第二腔被限定在第二外部部分和中间部分之间。 流体吸收来自电气基底的热量。