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    • 13. 发明授权
    • Memory cells
    • 记忆单元
    • US08680499B2
    • 2014-03-25
    • US13355904
    • 2012-01-23
    • Davide ErbettaLuca FumagalliInnocenzo TortorelliEnrico Varesi
    • Davide ErbettaLuca FumagalliInnocenzo TortorelliEnrico Varesi
    • H01L29/02
    • H01L45/06H01L45/1233H01L45/126H01L45/144H01L45/148
    • Some embodiments include memory cells which contain chalcogenide material having germanium in combination with one or both of antimony and tellurium. An atomic percentage of the germanium within the chalcogenide material is greater than 50%; and may be, for example, within a range of from greater than or equal to about 52% to less than or equal to about 78%. In some embodiments, the memory cell has a top electrode over the chalcogenide material, a heater element under and directly against the chalcogenide material, and a bottom electrode beneath the heater element. The heater element may be L-shaped, with the L-shape having a vertical pillar region joining with a horizontal leg region. A bottom surface of the horizontal leg region may be directly against the bottom electrode, and a top surface of the vertical pillar region may be directly against the chalcogenide material.
    • 一些实施方案包括含有具有与锑和碲中的一种或两者结合的锗的硫族化物材料的记忆体。 硫族化物材料中锗的原子百分比大于50%; 并且可以例如在大于或等于约52%至小于或等于约78%的范围内。 在一些实施例中,存储器单元具有位于硫属化物材料上的顶部电极,位于硫酸化物材料之下并直接抵靠硫族化物材料的加热器元件,以及加热元件下方的底部电极。 加热元件可以是L形,L形具有与水平支腿区域连接的垂直柱状区域。 水平支腿区域的底面可以直接抵靠底部电极,并且垂直柱状区域的顶表面可以直接抵靠硫族化物材料。
    • 16. 发明申请
    • Process for manufacturing a memory with local electrical contact between the source line and the well
    • 用于制造在源极线和阱之间具有局部电接触的存储器的工艺
    • US20060180850A1
    • 2006-08-17
    • US11331826
    • 2006-01-12
    • Daniela BrazzelliGiorgio ServalliDavide ErbettaMaria Marangon
    • Daniela BrazzelliGiorgio ServalliDavide ErbettaMaria Marangon
    • H01L29/788H01L21/336
    • H01L27/115H01L27/11521
    • A process for manufacturing a memory having a plurality of memory cells includes the steps of forming a well (having a first type of conductivity) within a wafer of semiconductor material, defining active regions within the well extending in a first direction, forming memory cells within the active regions (each memory cell having a source region with a second type of conductivity opposite to the first type of conductivity), and forming lines of electrical contact which electrically contact source regions aligned in a second direction. The step of forming lines of electrical contact includes forming an electrical contact between the source regions and portions of the well adjacent thereto in the second direction. The memory accordingly includes lines of electrical contact, each in electrical contact with source regions aligned along a respective row, wherein the lines of electrical contact further provide an electrical contact between the source regions and portions of the well adjacent thereto along said rows.
    • 一种用于制造具有多个存储单元的存储器的方法包括以下步骤:在半导体材料的晶片内形成阱(具有第一类型的导电性),限定在第一方向上延伸的阱内的有源区,形成存储单元内 有源区(每个存储单元具有与第一类型的导电性相反的第二类型的导电性的源极区),以及形成与第二方向对准的电接触的电接触线。 形成电接触线的步骤包括在第二方向上在源极区域和与其相邻的阱的部分之间形成电接触。 存储器相应地包括电接触线,每条电路与沿着相应行排列的源区电接触,其中电接触线还提供沿着所述行的源极区域和与其相邻的阱的部分之间的电接触。