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    • 16. 发明授权
    • Wire pass through device
    • 电线穿过器件
    • US09065259B2
    • 2015-06-23
    • US13569753
    • 2012-08-08
    • Kevin O'ConnorMike Brown
    • Kevin O'ConnorMike Brown
    • H02G3/22H02G3/02
    • H02G15/013H02G3/02H02G3/088H02G3/22
    • The embodiments herein provide a device for sealing an interface having an opening for a wire to pass through the interface. A pair of sealing blocks may be used where one block contains a protrusion and the opposing block contains a recess. The protrusion and recess preferably have an apex with a round having approximately the same dimension as the radius of the wire. A pair of posts may be positioned on opposing sides of the opening. One sealing block may contain an aperture for accepting one of the posts while the second sealing block may contain an aperture for accepting the opposing post. The posts may be threaded so that they can accept a threaded fastener. Exemplary embodiments may utilize mounting plates which may contain a flange such that squeezing the opposing flanges together can cause inward forces on the sealing blocks.
    • 本文的实施例提供了一种用于密封具有用于导线的开口的接口以穿过界面的装置。 可以使用一对密封块,其中一个块包含突起并且相对的块包含凹部。 突起和凹槽优选地具有具有与线的半径大致相同尺寸的圆形的顶点。 一对柱可以位于开口的相对侧上。 一个密封块可以包含用于接受一个柱的孔,而第二密封块可以包含用于接受相对的柱的孔。 柱可以是螺纹的,使得它们可以接受螺纹紧固件。 示例性实施例可以使用可以包含凸缘的安装板,使得将相对的凸缘挤压在一起可以在密封块上产生向内的力。
    • 20. 发明授权
    • High velocity air cooling for electronic equipment
    • 电子设备的高速空气冷却
    • US07573713B2
    • 2009-08-11
    • US11435355
    • 2006-05-16
    • Christopher J. HoffmanKevin O'Connor
    • Christopher J. HoffmanKevin O'Connor
    • H05K7/20
    • H05K7/20136
    • Systems and methods for cooling electronic components are disclosed herein. Certain aspects of the invention are directed toward an electronic system that includes an electronic module having a container with at least two openings and multiple manufactured electronic components carried in the container. The electronic module is configured to operate reliably at or above a maximum manufacturer's suggested first ambient temperature while still maintaining the first suggested operating core temperature of the internal electronic module. The system further includes a duct in fluid communication with at least one of the openings and an exterior flow device coupled to the duct. The flow device is configured to produce a pressure differential between an interior and an exterior of the container to cause high velocity air to flow through the container such that the electronic module can be operated in the selected mode at a second ambient temperature greater than the maximum first manufacturer's suggested ambient temperature.
    • 本文公开了用于冷却电子部件的系统和方法。 本发明的某些方面涉及一种电子系统,该电子系统包括具有至少两个开口的容器和承载在容器中的多个制造的电子部件的电子模块。 电子模块被配置为在最大制造商建议的第一环境温度下或者高于最高制造商的建议的第一环境温度下可靠地操作,同时仍保持内部电子模块的第一建议的操作 该系统还包括与至少一个开口流体连通的管道和联接到管道的外部流动装置。 流动装置被配置为在容器的内部和外部之间产生压差,以使高速空气流过容器,使得电子模块可以在大于最大值的第二环境温度下以选定的模式操作 第一厂商建议的环境温度。