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11. 发明申请

US20090256891A1 HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHODS OF FABRICATING THE HEATER CHIPS 有权
标题翻译：硅胶衬垫上加热硅胶的加热器及其制作方法
公开(公告)号：US20090256891A1
公开(公告)日：2009-10-15
申请号：US12101215
申请日：2008-04-11
申请人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05 , H01L21/00
CPC分类号： B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/164 , H01L21/6715 , Y10T29/49401
摘要： A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.
摘要翻译：加热器芯片具有基板和至少一个由硅制成的管芯，以及非粘合地连接的管芯。厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。模具具有从背面到表面的墨水流通孔，以及包括与前述表面相邻的加热元件的电路，其中散布着墨水通孔。至少一个管芯叠加在衬底上，使得衬底的供墨通孔与管芯的墨流过孔对准，并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。在衬底和面向芯片的表面部分之间形成的结合是密封的，并且与Si-O键的强度相等。通过对载体和器件晶片的单独处理，可以调整衬底和管芯的尺寸和特征以提供期望的加热器芯片结构。

12. 发明授权

US07959261B2 Micro-fluid ejection devices having reduced input/output addressable heaters 有权
标题翻译：具有减少的输入/输出可寻址加热器的微流体喷射装置
公开(公告)号：US07959261B2
公开(公告)日：2011-06-14
申请号：US11745545
申请日：2007-05-08
申请人： Frank Edward Anderson , Michael John Dixon , Jeanne Marie Saldanha Singh , Timothy Lowell Strunk , George Nelson Woolcott
发明人： Frank Edward Anderson , Michael John Dixon , Jeanne Marie Saldanha Singh , Timothy Lowell Strunk , George Nelson Woolcott
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/14129 , B41J2/14072 , B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1642 , B41J2/1646 , Y10T29/49401
摘要： Micro-fluid ejection devices, methods for making micro-fluid ejection, heads, and micro-fluid ejection heads having N actuators on a first substrate and logic capable of driving the N actuators on a second substrate. The ejection heads also have less than N electrical connections between the first and second substrates.
摘要翻译：微流体喷射装置，用于制造微流体喷射的方法，具有在第一基板上具有N个致动器的微流体喷射头和能够在第二基板上驱动N个致动器的逻辑。喷头在第一和第二基板之间也具有少于N个电连接。

13. 发明授权

US07938513B2 Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips 有权
标题翻译：具有硅芯片的加热芯片粘合在硅衬底上以及制造加热器芯片的方法
公开(公告)号：US07938513B2
公开(公告)日：2011-05-10
申请号：US12101215
申请日：2008-04-11
申请人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05 , B21D53/76
CPC分类号： B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/164 , H01L21/6715 , Y10T29/49401
摘要： A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.
摘要翻译：加热器芯片具有基板和至少一个由硅制成的管芯，以及非粘合地连接的管芯。厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。模具具有从背面到表面的墨水流通孔，以及包括与前述表面相邻的加热元件的电路，其中散布着墨水通孔。至少一个管芯叠加在衬底上，使得衬底的供墨通孔与管芯的墨流过孔对准，并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。在衬底和面向芯片的表面部分之间形成的结合是密封的，并且与Si-O键的强度相等。通过对载体和器件晶片的单独处理，可以调整衬底和管芯的尺寸和特征以提供期望的加热器芯片结构。

14. 发明授权

US07629742B2 Electroluminescent displays, media, and members, and methods associated therewith 有权
标题翻译：电致发光显示器，介质和成员以及与之相关的方法
公开(公告)号：US07629742B2
公开(公告)日：2009-12-08
申请号：US11378980
申请日：2006-03-17
申请人： Frank Edward Anderson , Timothy Lowell Strunk
发明人： Frank Edward Anderson , Timothy Lowell Strunk
IPC分类号： H01J1/62
CPC分类号： C09K9/02 , H01L27/3239 , H01L51/50 , H05B33/10 , H05B33/22
摘要： Electroluminescent (EL) displays, media, and members, and methods associated therewith. One such display includes an EL material, conductor layers, and a reflective image formed by a pattern of imaging substance applied adjacent at least one of the conductor layers. The EL material is between at least two of the conductor layers, and at least one of the conductor layers is applied adjacent the EL material in a pattern to form a conductive image. Upon application of an operational potential to the at least two of the conductor layers having the EL material therebetween, the display can be illuminated in an area corresponding to the conductive image.
摘要翻译：电致发光（EL）显示器，介质和成员以及与之相关的方法。一个这样的显示器包括EL材料，导体层和由邻近至少一个导体层施加的成像物质的图案形成的反射图像。 EL材料在至少两个导体层之间，并且至少一个导体层以图案相邻于EL材料施加以形成导电图像。在对其中具有EL材料的至少两个导体层施加操作电位之后，可以在对应于导电图像的区域中照亮显示器。

15. 发明授权

US08882221B2 Modular micro-fluid ejection head assembly 有权
标题翻译：模块化微流体喷射头组件
公开(公告)号：US08882221B2
公开(公告)日：2014-11-11
申请号：US12195451
申请日：2008-08-21
申请人： David Laurier Bernard , Paul William Dryer , David Golman King , Andrew Lee McNees , Timothy Lowell Strunk
发明人： David Laurier Bernard , Paul William Dryer , David Golman King , Andrew Lee McNees , Timothy Lowell Strunk
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/1623 , B41J2/14072 , B41J2/16 , Y10T29/49401
摘要： A micro-fluid ejection head assembly and methods for fabricating micro-fluid ejection heads using separately fabricated electrical components. The micro-fluid ejection head has at least one base substrate, at least one fluid ejector actuator substrate attached to the base substrate; and at least a first logic component substrate hermetically sealed to the base substrate. The fluid ejector actuator substrate and the first logic component substrate are in electrical communication with each other.
摘要翻译：微流体喷射头组件和使用单独制造的电气部件制造微流体喷射头的方法。微流体喷射头具有至少一个基底基板，至少一个附着在基底基板上的流体喷射致动器基板; 以及至少第一逻辑部件基板，其密封到基底基板。流体喷射器致动器基板和第一逻辑部件基板彼此电连通。

16. 发明授权

US07922297B2 Ink ejection device including a silicon chip having a heater stack positioned over a corresponding power transistor 有权
标题翻译：喷墨装置包括具有位于相应的功率晶体管上的加热器堆的硅芯片
公开(公告)号：US07922297B2
公开(公告)日：2011-04-12
申请号：US11958876
申请日：2007-12-18
申请人： Yimin Guan , Kristi Maggard Rowe , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Yimin Guan , Kristi Maggard Rowe , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05
CPC分类号： B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1626 , B41J2/1632 , B41J2/1642 , B41J2/1645 , B41J2002/14387 , B41J2202/13
摘要： A silicon chip has a plurality of ink jetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.
摘要翻译：硅芯片具有多个喷墨结构。多个喷墨结构的每个喷墨结构包括具有电加热器元件的加热器堆叠。功率晶体管电连接到电加热元件。平坦化层介于功率晶体管和加热器叠层之间。平坦化层具有形成加热器叠层的平面基面。

17. 发明申请

US20090153622A1 INK EJECTION DEVICE INCLUDING A SILICON CHIP HAVING A HEATER STACK POSITIONED OVER A CORRESPONDING POWER TRANSISTOR 有权
标题翻译：墨水喷射装置，包括具有相应功率晶体管定位的加热器堆叠的硅芯片
公开(公告)号：US20090153622A1
公开(公告)日：2009-06-18
申请号：US11958876
申请日：2007-12-18
申请人： Yimin Guan , Kristi Maggard Rowe , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Yimin Guan , Kristi Maggard Rowe , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05
CPC分类号： B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1626 , B41J2/1632 , B41J2/1642 , B41J2/1645 , B41J2002/14387 , B41J2202/13
摘要： A silicon chip has a plurality of inkjetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.
摘要翻译：硅芯片具有多个喷墨结构。多个喷墨结构的每个喷墨结构包括具有电加热器元件的加热器堆叠。功率晶体管电连接到电加热元件。平坦化层介于功率晶体管和加热器叠层之间。平坦化层具有形成加热器叠层的平面基面。

18. 发明授权

US08642249B2 Micro-fluid ejection devices with a polymeric layer having an embedded conductive material 失效
标题翻译：具有聚合物层的微流体喷射装置具有嵌入的导电材料
公开(公告)号：US08642249B2
公开(公告)日：2014-02-04
申请号：US12842329
申请日：2010-07-23
申请人： Frank E Anderson , Yimin Guan , Carl Edmond Sullivan , Timothy Lowell Strunk
发明人： Frank E Anderson , Yimin Guan , Carl Edmond Sullivan , Timothy Lowell Strunk
IPC分类号： B41J2/16
CPC分类号： B41J2/14072 , B41J2202/03
摘要： Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.
摘要翻译：微流体喷射装置，用于制造微流体喷射装置的方法以及用于减小用于微流体喷射头的基底的尺寸的方法。一个这样的微流体喷射装置具有邻近基底的聚合物层和嵌入聚合物层中的至少一个导电层。聚合物层包含至少两层聚合材料。

19. 发明申请

US20120127241A1 SYSTEMS FOR PRIMING FLUID JETTING DEVICES 有权
标题翻译：用于引导流体喷射装置的系统
公开(公告)号：US20120127241A1
公开(公告)日：2012-05-24
申请号：US12948878
申请日：2010-11-18
申请人： JIANDONG FANG , Frank Anderson , Audrey Dale Rodgers , Timothy Lowell Strunk , James Powers
发明人： JIANDONG FANG , Frank Anderson , Audrey Dale Rodgers , Timothy Lowell Strunk , James Powers
IPC分类号： B41J2/175
CPC分类号： B41J2/1707 , B41J2/1404 , B41J2202/12
摘要： Disclosed is a system for priming a fluid jetting device. The system includes a fluid trench configured within a fluid jetting chip of the fluid jetting device and at least one first channel fluidly coupled to the fluid trench. The at least one first channel extends vertically between the fluid jetting chip and a mounting unit adapted to support the fluid jetting chip, and is adapted to supply a priming fluid to the fluid trench. The system further includes at least one second channel fluidly coupled to the fluid trench. The at least one second channel extends vertically between the fluid jetting chip and the mounting unit, and is adapted to drain-out the priming fluid from the fluid trench. Further disclosed are systems for priming a fluid jetting device, in accordance with various embodiments of the present disclosure.
摘要翻译：公开了一种用于启动流体喷射装置的系统。该系统包括配置在流体喷射装置的流体喷射芯片内的流体沟槽和流体耦合到流体沟槽的至少一个第一通道。所述至少一个第一通道在流体喷射芯片和适于支撑流体喷射芯片的安装单元之间垂直延伸，并且适于将启动流体供应到流体沟槽。该系统还包括至少一个流体地联接到流体沟槽的第二通道。所述至少一个第二通道在所述流体喷射芯片和所述安装单元之间垂直延伸，并且适于从所述流体沟槽排出所述起动流体。还公开了根据本公开的各种实施例的用于起动流体喷射装置的系统。

20. 发明申请

US20100045736A1 MODULAR MICRO-FLUID EJECTION HEAD ASSEMBLY 有权
标题翻译：模块化微流体喷射头组件
公开(公告)号：US20100045736A1
公开(公告)日：2010-02-25
申请号：US12195451
申请日：2008-08-21
申请人： David Laurier Bernard , Paul William Dryer , David Golman King , Andrew Lee McNees , Timothy Lowell Strunk
发明人： David Laurier Bernard , Paul William Dryer , David Golman King , Andrew Lee McNees , Timothy Lowell Strunk
IPC分类号： B41J2/14 , B21D53/76
CPC分类号： B41J2/1623 , B41J2/14072 , B41J2/16 , Y10T29/49401
摘要： A micro-fluid ejection head assembly and methods for fabricating micro-fluid ejection heads using separately fabricated electrical components. The micro-fluid ejection head has at least one base substrate, at least one fluid ejector actuator substrate attached to the base substrate; and at least a first logic component substrate hermetically sealed to the base substrate. The fluid ejector actuator substrate and the first logic component substrate are in electrical communication with each other.
摘要翻译：微流体喷射头组件和使用单独制造的电气部件制造微流体喷射头的方法。微流体喷射头具有至少一个基底基板，至少一个附着在基底基板上的流体喷射致动器基板; 以及至少第一逻辑部件基板，其密封到基底基板。流体喷射器致动器基板和第一逻辑部件基板彼此电连通。

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