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11. 发明申请

US20060145302A1 Coating composition for electronic devices 审中-公开
标题翻译：电子设备用涂料组合物
公开(公告)号：US20060145302A1
公开(公告)日：2006-07-06
申请号：US11321771
申请日：2005-12-28
申请人： Sang Kim , Chang Bae , Young Joung , Hyun Kim , Hae Chung
发明人： Sang Kim , Chang Bae , Young Joung , Hyun Kim , Hae Chung
IPC分类号： H01L23/58
CPC分类号： H01L23/552 , C09D5/32 , C09D5/38 , H01B1/22 , H01L2924/0002 , H05K9/0083 , H01L2924/00
摘要： Disclosed herein is an coating composition for electromagnetic wave shielding, which can effectively solve the problems of electromagnetic interference (EMI) and radio frequency interference (RFI) caused by electromagnetic waves generated from the internal elements of various electronic devices. The composition contains a silver-coated copper particles having fine particle size, so that it can greatly improve the durability of an electroconductive film prepared therefrom. The coating composition comprises a polyurethane binder, a metal particles, a solvent and a rheology control agent, in which the metal particles is either a silver-coated copper particles having an average particle size of 2-20 μm or a mixture of the silver-coated particles and a silver particles having an average particle size of 2-10 μm, and the polyurethane binder is a mixture of at least two kinds of polyurethanes.
摘要翻译：本发明公开了一种电磁波屏蔽用涂料组合物，可有效解决由各种电子设备的内部元件产生的电磁波引起的电磁干扰（EMI）和射频干扰（RFI）问题。该组合物含有具有细粒度的银涂覆的铜颗粒，从而可以大大提高由其制备的导电膜的耐久性。涂料组合物包含聚氨酯粘合剂，金属颗粒，溶剂和流变控制剂，其中金属颗粒是平均粒径为2-20μm的银涂覆的铜颗粒或银 - 涂布颗粒和平均粒度为2-10μm的银颗粒，并且聚氨酯粘合剂是至少两种聚氨酯的混合物。

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