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    • 17. 发明申请
    • METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20070148906A1
    • 2007-06-28
    • US11616820
    • 2006-12-27
    • Bong Jun Kim
    • Bong Jun Kim
    • H01L21/76
    • H01L21/823481H01L21/76224H01L29/78
    • Embodiments relate to a semiconductor device and a method for fabricating a semiconductor device. In embodiments, the method may include forming a gate dielectric layer on an active region of a semiconductor substrate defined by an isolation region to form a gate conductive layer pattern, etching the isolation region of the semiconductor substrate where the gate conductive layer pattern is formed, to form an isolation trench, forming a polyoxide layer on the gate conductive layer pattern and a sidewall oxide layer in the trench by carrying out an oxidation process, forming a spacer nitride layer on the polyoxide layer and a liner nitride layer on the sidewall oxide layer by carrying out a nitride layer forming process, and forming a dielectric layer on an entire surface of the resultant structure to fill the trench.
    • 实施例涉及半导体器件和制造半导体器件的方法。 在实施例中,该方法可以包括在由隔离区域限定的半导体衬底的有源区上形成栅极电介质层以形成栅极导电层图案,蚀刻形成栅极导电层图案的半导体衬底的隔离区域, 以形成隔离沟槽,通过进行氧化工艺在栅极导电层图案和沟槽中的侧壁氧化物层形成多环氧化物层,在多孔层上形成间隔氮化物层,在侧壁氧化物层上形成衬里氮化物层 通过进行氮化物层形成工艺,并在所得结构的整个表面上形成电介质层以填充沟槽。