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11. 发明申请

US20130058636A1 Edge Ring For A Thermal Processing Chamber 有权
标题翻译：热处理室的边缘环
公开(公告)号：US20130058636A1
公开(公告)日：2013-03-07
申请号：US13402106
申请日：2012-02-22
申请人： Blake Koelmel , Joseph M. Ranish , Abhilash J. Mayur
发明人： Blake Koelmel , Joseph M. Ranish , Abhilash J. Mayur
IPC分类号： F27D11/00 , F27D5/00
CPC分类号： H01L21/67346 , F27D5/0037 , F27D11/12 , F27D2005/0081 , H01L21/67115 , H01L21/68735
摘要： Embodiments of the present invention provide an edge ring for supporting a substrate with increased temperature uniformity. More particularly, embodiments of the present invention provide an edge ring having one or more fins formed on an energy receiving surface of the edge ring. The fins may have at least one sloped side relative to a main body of the edge ring.
摘要翻译：本发明的实施例提供一种用于支撑具有增加的温度均匀性的基板的边缘环。更具体地，本发明的实施例提供了一种边缘环，其具有形成在边缘环的能量接收表面上的一个或多个翅片。翅片可以相对于边缘环的主体具有至少一个倾斜侧面。

12. 发明申请

US20090296774A1 METHOD AND APPARATUS FOR DETECTING THE SUBSTRATE TEMPERATURE IN A LASER ANNEAL SYSTEM 有权
标题翻译：用于检测激光神经系统中底物温度的方法和装置
公开(公告)号：US20090296774A1
公开(公告)日：2009-12-03
申请号：US12475404
申请日：2009-05-29
申请人： Blake Koelmel , Abhilash J. Mayur
发明人： Blake Koelmel , Abhilash J. Mayur
IPC分类号： G01J5/00
CPC分类号： H01L21/67248 , G01J5/048 , H01L21/67253 , H01L21/68742
摘要： Embodiments of the invention provide a method and an apparatus for detecting the temperature of a substrate surface. In one embodiment, a method for measuring the temperature is provided which includes exposing the surface of the substrate to a laser beam radiating from a laser source, radiating emitted light from a portion of the surface of the substrate, through the shadow ring, and towards a thermal sensor, and determining the temperature of the portion of the surface of the substrate from the emitted light. The substrate may be disposed on a substrate support within a treatment region and a shadow ring may be disposed between the laser source and the surface of the substrate. The shadow ring may be selectively opaque to the laser beam and transparent to the emitted light.
摘要翻译：本发明的实施例提供了一种用于检测衬底表面的温度的方法和装置。在一个实施例中，提供了一种用于测量温度的方法，其包括将衬底的表面暴露于从激光源辐射的激光束，从衬底表面的一部分通过阴影环辐射发射的光，并朝向热传感器，并且从所发射的光确定衬底的表面部分的温度。衬底可以设置在处理区域内的衬底支撑件上，并且阴影环可以设置在激光源和衬底的表面之间。阴影环可以选择性地对激光束不透明并且对于发射的光是透明的。

13. 发明授权

US08755680B2 Edge ring for a thermal processing chamber 有权
标题翻译：用于热处理室的边缘环
公开(公告)号：US08755680B2
公开(公告)日：2014-06-17
申请号：US13402106
申请日：2012-02-22
申请人： Blake Koelmel , Joseph M. Ranish , Abhilash J. Mayur
发明人： Blake Koelmel , Joseph M. Ranish , Abhilash J. Mayur
IPC分类号： F27B5/00 , F27B5/06 , F27D5/00 , H01L21/68 , C23C16/458
CPC分类号： H01L21/67346 , F27D5/0037 , F27D11/12 , F27D2005/0081 , H01L21/67115 , H01L21/68735
摘要： Embodiments of the present invention provide an edge ring for supporting a substrate with increased temperature uniformity. More particularly, embodiments of the present invention provide an edge ring having one or more fins formed on an energy receiving surface of the edge ring. The fins may have at least one sloped side relative to a main body of the edge ring.
摘要翻译：本发明的实施例提供了一种用于支撑具有增加的温度均匀性的基板的边缘环。更具体地，本发明的实施例提供了一种边缘环，其具有形成在边缘环的能量接收表面上的一个或多个翅片。翅片可以相对于边缘环的主体具有至少一个倾斜侧面。

14. 发明申请

US20120213500A1 EDGE RING FOR A THERMAL PROCESSING CHAMBER 有权
标题翻译：用于热处理室的边缘环
公开(公告)号：US20120213500A1
公开(公告)日：2012-08-23
申请号：US13193489
申请日：2011-07-28
申请人： Blake Koelmel , Joseph M. Ranish , Abhilash J. Mayur
发明人： Blake Koelmel , Joseph M. Ranish , Abhilash J. Mayur
IPC分类号： F27D11/12 , B23Q3/00
CPC分类号： H01L21/67346 , F27D5/0037 , F27D11/12 , F27D2005/0081 , H01L21/67115 , H01L21/68735
摘要： Embodiments of the present invention provide an edge ring for supporting a substrate with increased temperature uniformity. More particularly, embodiments of the present invention provide an edge ring having one or more surface area increasing structures formed on an energy receiving surface of the edge ring.
摘要翻译：本发明的实施例提供了一种用于支撑具有增加的温度均匀性的基板的边缘环。更具体地，本发明的实施例提供一种边缘环，其具有形成在边缘环的能量接收表面上的一个或多个表面积增加结构。

15. 发明授权

US08198567B2 High temperature vacuum chuck assembly 有权
标题翻译：高温真空吸盘组件
公开(公告)号：US08198567B2
公开(公告)日：2012-06-12
申请号：US12014535
申请日：2008-01-15
申请人： Alexander N. Lerner , Blake Koelmel , Mehran Behdjat
发明人： Alexander N. Lerner , Blake Koelmel , Mehran Behdjat
IPC分类号： F27B5/06 , F27D5/00 , H01L21/68 , H01L21/683
CPC分类号： B25B11/005 , H01L21/67109 , H01L21/6838 , H01L21/6875 , H01L21/68785 , H01L21/68792 , Y10T279/11
摘要： A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.
摘要翻译：提供了一个真空吸盘和一个装有它的处理室。真空吸盘组件包括支撑体，多个突起，多个通道，支撑支撑体的至少一个支撑构件，与支撑构件联接的至少一个弹性构件，至少支撑支撑体的中空轴通过中空轴设置的一个电连接器和空气冷却装置。支撑体具有用于在其上保持基板（例如晶片）的支撑表面。突起形成在支撑表面上并从支撑表面突出，以在基板和支撑表面之间形成间隙。通道形成在支撑表面上，用于在间隙中产生减压。空气冷却装置用于在电连接器附近提供空气冷却。

16. 发明授权

US08057601B2 Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber 有权
标题翻译：用于在处理室中支撑，定位和旋转衬底的装置和方法
公开(公告)号：US08057601B2
公开(公告)日：2011-11-15
申请号：US11746392
申请日：2007-05-09
申请人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
发明人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
IPC分类号： C23C16/00
CPC分类号： H01L21/6838 , H01L21/67115
摘要： An apparatus and method for supporting, positioning and rotating a substrate are provided. In one embodiment, a support assembly for supporting a substrate includes an upper base plate and a lower base plate. The substrate is floated on a thin layer of air over the upper base plate. A positioning assembly includes a plurality of air bearing edge rollers or air flow pockets used to position the substrate in a desired orientation inside above the upper base plate. A plurality of slanted apertures or air flow pockets are configured in the upper base plate for flowing gas therethrough to rotate the substrate to ensure uniform heating during processing.
摘要翻译：提供了用于支撑，定位和旋转衬底的装置和方法。在一个实施例中，用于支撑衬底的支撑组件包括上基板和下基板。衬底浮在上层底板上的薄层空气上。定位组件包括多个空气轴承边缘辊或气流袋，其用于将衬底定位在上部基板的上方所期望的取向。多个倾斜的孔或气流袋被配置在上基板中，用于使气体流过其中以旋转基板以确保在加工期间的均匀加热。

17. 发明授权

US08490660B2 Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber 有权
标题翻译：用于在处理室中支撑，定位和旋转衬底的装置和方法
公开(公告)号：US08490660B2
公开(公告)日：2013-07-23
申请号：US13294709
申请日：2011-11-11
申请人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
发明人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
IPC分类号： B65B31/04
CPC分类号： H01L21/6838 , H01L21/67115
摘要： An apparatus and method for supporting, positioning and rotating a substrate are provided. In one embodiment, a support assembly for supporting a substrate includes an upper base plate and a lower base plate. The substrate is floated on a thin layer of air over the upper base plate. A positioning assembly includes a plurality of air bearing edge rollers or air flow pockets used to position the substrate in a desired orientation inside above the upper base plate. A plurality of slanted apertures or air flow pockets are configured in the upper base plate for flowing gas therethrough to rotate the substrate to ensure uniform heating during processing.
摘要翻译：提供了用于支撑，定位和旋转衬底的装置和方法。在一个实施例中，用于支撑衬底的支撑组件包括上基板和下基板。衬底浮在上层底板上的薄层空气上。定位组件包括多个空气轴承边缘辊或气流袋，其用于将衬底定位在上部基板的上方所期望的取向。多个倾斜的孔或气流袋被配置在上基板中，用于使气体流过其中以旋转基板以确保在加工期间的均匀加热。

18. 发明申请

US20120205878A1 HIGH TEMPERATURE VACUUM CHUCK ASSEMBLY 有权
标题翻译：高温真空泵组件
公开(公告)号：US20120205878A1
公开(公告)日：2012-08-16
申请号：US13456455
申请日：2012-04-26
申请人： Alexander N. Lerner , Blake Koelmel , Mehran Behdjat
发明人： Alexander N. Lerner , Blake Koelmel , Mehran Behdjat
IPC分类号： H01L21/683 , B23B31/30
CPC分类号： B25B11/005 , H01L21/67109 , H01L21/6838 , H01L21/6875 , H01L21/68785 , H01L21/68792 , Y10T279/11
摘要： A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.
摘要翻译：提供了一个真空吸盘和一个装有它的处理室。真空吸盘组件包括支撑体，多个突起，多个通道，支撑支撑体的至少一个支撑构件，与支撑构件联接的至少一个弹性构件，至少支撑支撑体的中空轴通过中空轴设置的一个电连接器和空气冷却装置。支撑体具有用于在其上保持基板（例如晶片）的支撑表面。突起形成在支撑表面上并从支撑表面突出，以在基板和支撑表面之间形成间隙。通道形成在支撑表面上，用于在间隙中产生减压。空气冷却装置用于在电连接器附近提供空气冷却。

19. 发明授权

US08057602B2 Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber 有权
标题翻译：用于在处理室中支撑，定位和旋转衬底的装置和方法
公开(公告)号：US08057602B2
公开(公告)日：2011-11-15
申请号：US12017293
申请日：2008-01-21
申请人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
发明人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
IPC分类号： C23C16/00
CPC分类号： H01L21/67115 , H01L21/6838 , H01L21/68742 , H01L21/68785 , H01L21/68792
摘要： Embodiments of the invention contemplate a method, apparatus and system that are used to support, position, and rotate a substrate during processing. Embodiments of the invention may also include a method of controlling the transfer of heat between a substrate and substrate support positioned in a processing chamber. The apparatus and methods described herein remove the need for complex, costly and often unreliable components that would be required to accurately position and rotate a substrate during one or more processing steps, such as an rapid thermal processing (RTP) process, a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, atomic layer deposition (ALD) process, dry etching process, wet clean, and/or laser annealing process.
摘要翻译：本发明的实施例考虑了一种用于在处理期间支撑，定位和旋转衬底的方法，装置和系统。本发明的实施例还可以包括控制位于处理室中的衬底和衬底支撑件之间的热传递的方法。本文描述的装置和方法消除了在一个或多个处理步骤（例如快速热处理（RTP）处理，化学气相沉积）中精确定位和旋转衬底所需的复杂，昂贵且经常不可靠的部件的需要（CVD）工艺，物理气相沉积（PVD）工艺，原子层沉积（ALD）工艺，干蚀刻工艺，湿法清洁和/或激光退火工艺。

20. 发明申请

US20090179365A1 HIGH TEMPERATURE VACUUM CHUCK ASSEMBLY 有权
标题翻译：高温真空泵组件
公开(公告)号：US20090179365A1
公开(公告)日：2009-07-16
申请号：US12014535
申请日：2008-01-15
申请人： Alexander N. Lerner , Blake Koelmel , Mehran Behdjat
发明人： Alexander N. Lerner , Blake Koelmel , Mehran Behdjat
IPC分类号： B25B11/00 , B23B31/30
CPC分类号： B25B11/005 , H01L21/67109 , H01L21/6838 , H01L21/6875 , H01L21/68785 , H01L21/68792 , Y10T279/11
摘要： A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.
摘要翻译：提供了一个真空吸盘和一个装有它的处理室。真空吸盘组件包括支撑体，多个突起，多个通道，支撑支撑体的至少一个支撑构件，与支撑构件联接的至少一个弹性构件，至少支撑支撑体的中空轴通过中空轴设置的一个电连接器和空气冷却装置。支撑体具有用于在其上保持基板（例如晶片）的支撑表面。突起形成在支撑表面上并从支撑表面突出，以在基板和支撑表面之间形成间隙。通道形成在支撑表面上，用于在间隙中产生减压。空气冷却装置用于在电连接器附近提供空气冷却。

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