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11. 发明授权

US07563641B2 Laminated light-emitting diode display device and manufacturing method thereof 有权
标题翻译：层压发光二极管显示装置及其制造方法
公开(公告)号：US07563641B2
公开(公告)日：2009-07-21
申请号：US11605425
申请日：2006-11-29
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chao-Yuan Huang
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chao-Yuan Huang
IPC分类号： H01L21/00
CPC分类号： G09F9/302 , G09F9/33 , H05K1/0306 , H05K1/0393 , H05K1/181 , H05K2201/0108 , H05K2201/10106 , Y02P70/611
摘要： A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.
摘要翻译：对层叠型发光二极管显示装置及其制造方法进行说明。层叠发光二极管显示装置具有绝缘体，放置在绝缘体上并具有彼此互连的多个电路的电路装置，以及电连接到电路的电路的多个SMT型发光二极管单元。

12. 发明授权

US07237938B2 Backlight module 有权
标题翻译：背光模组
公开(公告)号：US07237938B2
公开(公告)日：2007-07-03
申请号：US11088791
申请日：2005-03-25
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin
IPC分类号： F21V8/00
CPC分类号： G02B6/0018 , G02B6/005 , G02B6/0083 , G02F1/133615
摘要： A backlight module arranged under a flat display includes a printed circuit board being parallel to the flat display and including a plurality of LEDs, a reflection portion being a reflection wall bent from a fringe of the LEDs to extend over the LEDs, and a guide light plate being parallel to the printed circuit board. The reflection portion includes an orientation wall parallel to the reflection wall and an outlet with a direction parallel to the printed circuit board. The guide light plate has an end connecting inside the outlet of the reflection portion, a light delivering surface adjacent to the flat display, and a reflection surface arranged at a bottom thereof.
摘要翻译：布置在平坦显示器下方的背光模块包括平行于平面显示器并包括多个LED的印刷电路板，反射部分是从LED的边缘弯曲以在LED上延伸的反射壁，以及引导光板平行于印刷电路板。反射部分包括平行于反射壁的定向壁和具有平行于印刷电路板的方向的出口。引导光板具有连接在反射部分的出口内部的端部，与平面显示器相邻的光输送表面和布置在其底部的反射表面。

13. 发明授权

US07803641B2 Mold structure for packaging LED chips and method thereof 有权
标题翻译：包装LED芯片的模具结构及其方法
公开(公告)号：US07803641B2
公开(公告)日：2010-09-28
申请号：US11854066
申请日：2007-09-12
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/66 , H01L21/00
CPC分类号： H01L21/565 , H01L21/561 , H01L2224/97 , H01L2224/85
摘要： A mold structure for packaging LED chips includes a top mold and a bottom mold. The bottom mold is mated with the top mold. The bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold.
摘要翻译：用于封装LED芯片的模具结构包括顶模和底模。底模与上模相配。底模具有主流道，在主流路旁边形成有多个接收空间，分别形成多个用于使接收空间相互横向连通的二次流动通道，以及贯穿底模的多个排出销。

14. 发明授权

US07671374B2 LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same 有权
标题翻译：具有多个厚引导针的LED芯片封装结构及其制造方法
公开(公告)号：US07671374B2
公开(公告)日：2010-03-02
申请号：US11861757
申请日：2007-09-26
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L29/205 , H01L23/495
CPC分类号： H01L25/0753 , H01L24/97 , H01L33/483 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/01082 , H01L2924/12041 , H01L2224/85 , H01L2924/00014
摘要： An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.
摘要翻译：具有厚引导针的LED芯片封装结构包括彼此分离的多个导电引脚，绝缘壳体，多个LED芯片和封装胶体。绝缘壳体覆盖每个导电销的底侧，以形成用于暴露每个导电销的顶表面的注入凹槽。每个导电针的两个侧面从绝缘壳体向外延伸。 LED芯片布置在注入凹槽中，并且每个LED芯片分别具有正极侧和负极侧，并且与不同的导电针电连接。此外，将包装胶体填充到用于覆盖LED芯片的注入凹槽中。

15. 发明授权

US07655997B2 Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same 有权
标题翻译：晶圆级电光半导体制造机构及其制造方法
公开(公告)号：US07655997B2
公开(公告)日：2010-02-02
申请号：US11041952
申请日：2005-01-26
申请人： Bily Wang , Jonnie Chuang , Chuan-Fa Lin , Chi-Wen Hung
发明人： Bily Wang , Jonnie Chuang , Chuan-Fa Lin , Chi-Wen Hung
IPC分类号： H01L27/14
CPC分类号： H01L23/60 , H01L23/544 , H01L24/48 , H01L25/167 , H01L27/0248 , H01L2223/54493 , H01L2224/16145 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/0401 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer, this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.
摘要翻译：一种用于改进传统电光半导体晶粒封装方法的晶片级电光半导体制造机构及其方法。本发明将半导体晶粒与晶片的顶表面上的晶粒电连接，这可以通过丝网印刷或钢板印刷焊料或银浆在晶片上进行。之后，使用以下步骤处理晶片：处理器件，用导线接合，封装晶片并最终切割晶片。使用这种方法提高了生产率，同时降低了生产时间和成本。晶圆级电光半导体制造机构包括：晶片，电光半导体晶粒和导电材料。

16. 发明申请

US20080246397A1 MANUFACTURING METHOD OF WHITE LIGHT LED AND STRUCTURE THEREOF 审中-公开
标题翻译：白光LED及其结构的制造方法
公开(公告)号：US20080246397A1
公开(公告)日：2008-10-09
申请号：US11696220
申请日：2007-04-04
申请人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
发明人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
IPC分类号： H01J99/00 , H01J9/26
CPC分类号： H01L33/505 , H01L33/486 , H01L33/507 , H01L33/52 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A manufacturing method of white light LED and a structure thereof include first, a substrate being prepared to be formed as a consecutively connected holder, on a first electrode of which non-conductive fluorescent glue is coated to form a fluorescent layer, on which a blue light chip is fixed; second, two conducting wires being welded onto the chip and electrically connected to both the first electrode and the second electrode of the holder respectively, finally, glue body encapsulating the holder, the fluorescent layer, the chip, and the two conducting wires to form a photic zone, over which a frame body encloses; furthermore, a window being formed on the frame body and provided for making the photic zone exposed. When blue light chip is excited to generate blue light, which will further excite the fluorescent layer to emit yellow light, then both blue light and yellow light will be dispersed through the photic zone to generate a uniform light source, which may output light longitudinally and collectively, making the output power promoted notably and the lightness enhanced significantly.
摘要翻译：白光LED的制造方法及其结构首先在准备形成为连续保持器的基板上，在其上涂布非导电荧光胶的第一电极上形成荧光层，蓝色光芯片固定; 第二，将两根导线焊接在芯片上，分别与保持器的第一电极和第二电极两者电连接，最后将胶体封装在保持器，荧光层，芯片和两根导线上，形成一个框架主体围绕着它; 此外，窗框形成在框架体上并被设置用于使光区暴露。当蓝光芯片被激发以产生蓝光，这将进一步激发荧光层发出黄光，则蓝光和黄光将通过光区分散以产生均匀的光源，其可以纵向输出光，共同推动输出功率显着提升，亮度明显增强。

17. 发明申请

US20080099778A1 LED package structure for increasing light-emitting effiency and method of packaging the same 有权
标题翻译： LED封装结构，提高发光效率和封装方法
公开(公告)号：US20080099778A1
公开(公告)日：2008-05-01
申请号：US11588399
申请日：2006-10-27
申请人： Bily Wang , Jonnie Chuang , Chi-Wen Hung
发明人： Bily Wang , Jonnie Chuang , Chi-Wen Hung
IPC分类号： H01L33/00 , G09F9/33
CPC分类号： H01L33/56 , H01L25/167 , H01L33/505 , H01L33/54 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An LED package structure for increasing light-emitting efficiency includes: a substrate unit, and a plurality of fluorescence colloid units, LED units, conductive units and opaque units. The substrate unit has a main body and a plurality of through holes passing through the main body. Each fluorescence colloid unit is received in the corresponding through hole and having an installed surface. Each LED unit has a light-emitting surface disposed on the corresponding fluorescence colloid unit and facing the installed surface of the corresponding fluorescence colloid units. Each conductive unit is electrically connected between each two electrode areas that have the same pole and are respectively arranged on each LED unit and the main body. Each opaque unit is disposed on two corresponding lateral faces of the main body for covering the installed surface of the corresponding fluorescence colloid unit, the corresponding LED unit, and the corresponding conductive units.
摘要翻译：用于提高发光效率的LED封装结构包括：基板单元和多个荧光胶体单元，LED单元，导电单元和不透明单元。基板单元具有主体和穿过主体的多个通孔。每个荧光胶体单元被接收在相应的通孔中并具有安装表面。每个LED单元具有设置在相应的荧光胶体单元上并面对相应的荧光胶体单元的安装表面的发光表面。每个导电单元电连接在具有相同极点并且分别布置在每个LED单元和主体上的每个两个电极区域之间。每个不透明单元设置在主体的两个对应的侧面上，用于覆盖相应的荧光胶体单元的安装表面，相应的LED单元和相应的导电单元。

18. 发明授权

US07303984B2 Semiconductor substrate structure and processing method thereof 有权
标题翻译：半导体衬底结构及其加工方法
公开(公告)号：US07303984B2
公开(公告)日：2007-12-04
申请号：US11081527
申请日：2005-03-17
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/4763
CPC分类号： H05K3/445 , H05K1/056 , H05K3/0052 , H05K2201/09881 , H05K2203/0228 , H05K2203/0278 , H05K2203/1536
摘要： A semiconductor substrate structure includes a substrate having a trench formed thereon, a polymer composite material supplied into the trench and an electroplate conductive layer formed on the substrate. Further, a semiconductor substrate processing method includes the steps of: providing a substrate forming a trench thereon, supplying a polymer composite material into the trench, polishing a surface of the substrate and forming a covering material on the surface of the substrate. Therefore, the method is provided for combining the polymer composite material into the substrate, thereby to raise cutting precision and strength of the semiconductor substrate structure.
摘要翻译：半导体衬底结构包括其上形成有沟槽的衬底，提供到沟槽中的聚合物复合材料和形成在衬底上的电镀导电层。此外，半导体衬底处理方法包括以下步骤：提供在其上形成沟槽的衬底，将聚合物复合材料供应到沟槽中，抛光衬底的表面并在衬底的表面上形成覆盖材料。因此，提供了将聚合物复合材料组合到基板中的方法，从而提高半导体基板结构的切割精度和强度。

19. 发明授权

US07211882B2 LED package structure and method for making the same 有权
标题翻译： LED封装结构及制作方法
公开(公告)号：US07211882B2
公开(公告)日：2007-05-01
申请号：US11085100
申请日：2005-03-22
申请人： Bily Wang , Jonnie Chuang , Heng-Yen Lee , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Heng-Yen Lee , Hui-Yen Huang
IPC分类号： H01L23/02
CPC分类号： H01L33/62 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.
摘要翻译：描述了LED封装结构及其制造方法。 LED封装结构具有至少一个LED管芯，至少一个与LED管芯相关的金属框架，以及封装LED管芯和金属框架的绝缘体。金属框架具有对应于LED管芯的第一接触件和相对于第一接触件的第二接触件。绝缘体内的第一和第二触点彼此电隔离。第一接触件具有围绕LED管芯的至少一个凹部，并且第二接触件具有形成在其上的至少一个凹槽。

20. 发明申请

US20060086945A1 Package structure for optical-electrical semiconductor 审中-公开
标题翻译：光电半导体封装结构
公开(公告)号：US20060086945A1
公开(公告)日：2006-04-27
申请号：US10973408
申请日：2004-10-27
申请人： Bily Wang , Jonnie Chuang , Shih-Yu Wu , Ching-Hung Ko , Chun-Cheng Weng
发明人： Bily Wang , Jonnie Chuang , Shih-Yu Wu , Ching-Hung Ko , Chun-Cheng Weng
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L25/0753 , H01L31/0203 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2924/00014
摘要： A package structure for an optical-electrical semiconductor is described. The package structure has a thermal conductive structure for heat transfer and is integrally formed in one piece to improve the structural strength thereof, while the thermal conductive structure prevent over-heating of the LED device for greater longevity. The package structure reduces the failure rate in production and has improved quality. When the present invention is applied in light-emitting diode packages, the special requirement can be reached and has better properties than the prior art.
摘要翻译：描述了一种用于光电半导体的封装结构。封装结构具有用于传热的导热结构，并且整体形成为一体以提高其结构强度，而导热结构防止LED器件的过热延长寿命。封装结构降低了生产中的故障率，并提高了质量。当本发明应用于发光二极管封装中时，可以达到特殊要求并具有比现有技术更好的性能。

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