专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

US20120038046A1 SEMI-CONDUCTOR CHIP WITH COMPRESSIBLE CONTACT STRUCTURE AND ELECTRONIC PACKAGE UTILIZING SAME 有权
标题翻译：具有可接触结构的半导体芯片和使用其的电子封装
公开(公告)号：US20120038046A1
公开(公告)日：2012-02-16
申请号：US12836612
申请日：2010-08-13
申请人： How Lin , Frank Egitto , Voya Markovich
发明人： How Lin , Frank Egitto , Voya Markovich
IPC分类号： H01L23/48 , H01L21/447
CPC分类号： H01L23/3157 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/72 , H01L2224/0226 , H01L2224/02335 , H01L2224/024 , H01L2224/0401 , H01L2224/05147 , H01L2224/05644 , H01L2224/05647 , H01L2224/16225 , H01L2224/16227 , H01L2224/73251 , H01L2224/8121 , H01L2224/81815 , H01L2224/81901 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/351 , H01L2924/00 , H01L2224/16 , H01L2224/72
摘要： A method of forming a compressible contact structure on a semi-conductor chip which comprises bonding a compressible polymer layer to the chip's surface, forming a plurality of openings within the layer, depositing electrically conductive material within the openings to form electrical connections with the chip's contacts, forming a plurality of electrically conductive line elements on the polymer layer extending from a respective opening and each including an end portion, and forming a plurality of contact members each on a respective one of the line segment end portions. The compressible polymer layer allows the contact members to deflect toward (compress) the chip when the contact members are engaged by an external force or forces. A semi-conductor chip including such a compressible contact structure is also provided.
摘要翻译：一种在半导体芯片上形成可压缩接触结构的方法，包括将可压缩的聚合物层粘合到芯片的表面，在该层内形成多个开口，在开口内沉积导电材料以形成与芯片的触点的电连接在聚合物层上形成多个导电线元件，所述多个导电线元件从相应的开口延伸并且各自包括端部，并且在所述线段端部中的相应一个上形成多个接触元件。当可接触构件通过外力或力接合时，可压缩聚合物层允许接触构件偏转（压缩）芯片。还提供了包括这种可压缩接触结构的半导体芯片。

12. 发明申请

US20070249089A1 Method of making circuitized substrate with internal organic memory device 失效
标题翻译：制造具有内部有机存储器件的电路化衬底的方法
公开(公告)号：US20070249089A1
公开(公告)日：2007-10-25
申请号：US11808596
申请日：2007-06-12
申请人： Subahu Desai , How Lin , John Lauffer , Voya Markovich , David Thomas
发明人： Subahu Desai , How Lin , John Lauffer , Voya Markovich , David Thomas
IPC分类号： H01L51/40
CPC分类号： G11C11/22 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H05K1/16 , H05K2201/0166 , H05K2201/0179 , H05K2201/09763 , H05K2201/10159 , H01L2224/0401
摘要： A method of making circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device.
摘要翻译：一种制造电路化衬底的方法，所述电路化衬底由其上具有导电图案的至少一种电介质材料组成。图案的至少一部分被用作有机存储器件的第一层，该有机存储器件还包括在图案上方的至少第二介电层和相对于下部对准的第二图案，用于实现几个接触点，从而形成设备。

13. 发明申请

US20070010064A1 Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate 失效
标题翻译：使用可光成像电介质作为较大电路化基板的一部分制造电容性基板的方法，制造所述电路化基板的方法和制造包括所述电路化基板的信息处理系统的方法
公开(公告)号：US20070010064A1
公开(公告)日：2007-01-11
申请号：US11352276
申请日：2006-02-13
申请人： Rabindra Das , John Lauffer , How Lin , Voya Markovich
发明人： Rabindra Das , John Lauffer , How Lin , Voya Markovich
IPC分类号： H01L21/20 , H01L21/44
CPC分类号： H05K1/162 , H05K1/113 , H05K3/0023 , H05K3/4602 , H05K2201/0187 , H05K2201/0209 , H05K2201/09309 , H05K2201/09509 , H05K2201/09536 , H05K2203/0568
摘要： A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. Photoimageable material is used to facilitate positioning of the capacitive dielectric being printed. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.
摘要翻译：一种形成电容衬底的方法，其中材料的至少一个电容介电层被屏幕或喷墨印刷到导体上，然后进一步处理衬底，包括添加通孔以将所选择的元件耦合到衬底内以形成至少两个电容器作为衬底的内部元件。可光成像材料用于促进正在印刷的电容电介质的定位。电容性衬底可以结合在更大的电路化衬底内，例如以形成电组件。还提供了一种制造包括这种基板的信息处理系统的方法。

14. 发明申请

US20080020566A1 Method of making an interposer 有权
标题翻译：制作插件的方法
公开(公告)号：US20080020566A1
公开(公告)日：2008-01-24
申请号：US11902976
申请日：2007-09-27
申请人： Frank Egitto , How Lin
发明人： Frank Egitto , How Lin
IPC分类号： H01L21/44
CPC分类号： H05K3/4007 , G01R1/06711 , G01R1/0735 , H05K1/0393 , H05K3/365 , H05K2201/0367 , H05K2201/0394 , H05K2201/09627 , H05K2201/09745 , H05K2201/10378
摘要： A method of making an interposer in which at least two dielectric layers are bonded to each other to sandwich a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts which are formed within and protrude from openings which are also formed within the dielectric layers as part of this method. The resulting interposer is ideally suited for use as part of a test apparatus to interconnect highly dense patterns of solder ball contacts of a semiconductor chip to lesser dense arrays of contacts on the apparatus's printed circuit board.
摘要翻译：一种制造其中至少两个电介质层彼此结合以夹在其间的多个导体的插入件的方法。这些导体各自电耦合相应的一对相对的电触点，其形成在也作为该方法的一部分的电介质层内形成的开口内并从其中突出。所得到的内插器非常适合用作测试装置的一部分，以将半导体芯片的高密度图案的焊球接触件与装置的印刷电路板上的较小致密的触点阵列相互连接。

15. 发明申请

US20050152650A1 Method and structure for two-dimensional optical fiber ferrule 失效
标题翻译：二维光纤套圈的方法和结构
公开(公告)号：US20050152650A1
公开(公告)日：2005-07-14
申请号：US10756782
申请日：2004-01-13
申请人： John Knickerbocker , How Lin
发明人： John Knickerbocker , How Lin
IPC分类号： G02B6/36 , G02B6/38
CPC分类号： G02B6/3672 , G02B6/3644 , G02B6/3692 , G02B6/3696 , G02B6/3885
摘要： A method is provided for making ferrules for connecting optical fibers to other optical fibers or to an optical input device such as an optical chip. The method utilizes ceramic greensheets or silicon wafers. In one method, the greensheets are stacked and laminated and then fiber optic through openings are provided in the laminate for holding the fibers. The laminate is then sintered forming the ferrule.
摘要翻译：提供了一种用于制造用于将光纤连接到其它光纤或光输入装置（例如光学芯片）的套圈的方法。该方法采用陶瓷片或硅片。在一种方法中，将绿色纸堆叠并层压，然后在用于保持纤维的层压体中设置光纤通孔。然后将层压体烧结形成套圈。

16. 发明申请

US20050025434A1 Method and apparatus for providing optoelectronic communication with an electronic device 有权
标题翻译：用于与电子设备进行光电通信的方法和设备
公开(公告)号：US20050025434A1
公开(公告)日：2005-02-03
申请号：US10631933
申请日：2003-07-31
申请人： Alan Benner , Evan Colgan , How Lin , John Magerlein , Frank Pompeo , Subhash Shinde , Daniel Stigliani
发明人： Alan Benner , Evan Colgan , How Lin , John Magerlein , Frank Pompeo , Subhash Shinde , Daniel Stigliani
IPC分类号： G02B6/36 , G02B6/42 , G06F1/20 , G06F3/00
CPC分类号： G02B6/4201 , G02B6/4246 , G02B6/4249 , G02B6/4268 , G02B6/4281 , G02B6/4283 , G02B6/4292
摘要： An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.
摘要翻译：用于计算机系统的光电组件包括电子芯片，基板，电信号介质，光电转换器和光耦合引导件。电子芯片与基板通信，该基板与电信号介质的第一端连通。电信令介质的第二端与光电换能器通信，并且包括用于使光信号介质与光电换能器对准的光耦合引导件。来自电子芯片的电信号通过衬底和电信令介质传送到光电换能器。光学传感器和电子芯片共享共同的散热器，并且完成与其他电子芯片组的通信，而不需要通过第二级电气封装进行通信。

17. 发明申请

US20070031084A1 TRAFIC MONITORING SYSTEM 审中-公开
标题翻译： TRAFIC监测系统
公开(公告)号：US20070031084A1
公开(公告)日：2007-02-08
申请号：US11425392
申请日：2006-06-20
申请人： David Wang , John Tsai , How Lin , Le-Heng Wang
发明人： David Wang , John Tsai , How Lin , Le-Heng Wang
IPC分类号： H04B10/08 , G02B6/34
CPC分类号： G01B11/18 , E01F11/00 , G01L1/246 , G02B6/022 , G08G1/02
摘要： A system for monitoring traffic across a structure. A fiber Bragg grating (FBG) reflects a light wavelength. A mounting mechanism connects the FBG to the structure, such that physical change of the structure changes a stress to the FBG that changes the light wavelength. And optical fiber carries a first light beam to the FBG and carries a second light beam from the FGB. This permits first light beam including the light wavelength to be received from a light source, and permits the first light beam to be altered into the second light beam by passing the light wavelength through the FBG, and permits the second light beam to be provided to a detector to sense the light wavelength present in the second light beam. From this the stress in the structure and information about the traffic across a structure can be inferred.
摘要翻译：用于监控跨结构的流量的系统。光纤布拉格光栅（FBG）反射光波长。安装机构将FBG连接到结构，使得结构的物理变化将改变光束波长的FBG的应力。并且光纤将第一光束传送到FBG并携带来自FGB的第二光束。这允许包括光波长的第一光束从光源接收，并且允许通过使光波长通过FBG将第一光束改变为第二光束，并且允许第二光束被提供到用于感测存在于第二光束中的光波长的检测器。从此可以推断结构中的压力和关于结构上的交通的信息。

18. 发明申请

US20050156310A1 Method and apparatus for providing optoelectronic communication with an electronic device 失效
标题翻译：用于与电子设备进行光电通信的方法和设备
公开(公告)号：US20050156310A1
公开(公告)日：2005-07-21
申请号：US10757206
申请日：2004-01-14
申请人： Alan Benner , How Lin , Frank Pompeo , Subhash Shinde
发明人： Alan Benner , How Lin , Frank Pompeo , Subhash Shinde
IPC分类号： H01L31/0232
CPC分类号： G02B6/4249 , G02B6/4212 , G02B6/4214 , G02B6/4231 , G02B6/4246 , G02B6/4269 , G02B6/4292 , H01L2224/16225 , H01L2224/73253
摘要： An optoelectronic assembly for an electronic system includes a transparent substrate having a first surface and an opposite second surface, the transparent substrate being thermally conductive and being metallized on the surface. A support electronic chip set is configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions and is bonded to the second surface of the transparent substrate. A first substrate having a first surface and an opposite second surface, is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set; and an optical signaling medium defined with one end having an optical fiber array aligned with the optoelectronic transducer is substantially normal to the first surface of the transparent substrate, wherein an electrical signal from the support electronic chip set is communicated to the optoelectronic transducer via the metallized second surface of the transparent substrate, and wherein the support electronic chip set and the optoelectronic transducer share a common thermal path for cooling.
摘要翻译：一种用于电子系统的光电组件包括具有第一表面和相对的第二表面的透明衬底，该透明衬底是导热的并且在表面上被金属化。支持电子芯片组被配置用于提供多路复用，解复用，编码，解码和光电转换器驱动和接收功能中的至少一个并且被结合到透明基板的第二表面。具有第一表面和相对的第二表面的第一基板经由金属化的第二表面和其间的支撑芯片与透明基板连通。第二基板与第一基板的第二表面连通并且被配置用于安装数据处理，数据切换和数据存储芯片中的至少一个。光电子传感器与支持电子芯片组进行信号通信; 并且限定有具有与光电换能器对准的光纤阵列的一端的光信号介质基本上垂直于透明基板的第一表面，其中来自支撑电子芯片组的电信号通过金属化的所述透明基板的第二表面，并且其中所述支撑电子芯片组和所述光电转换器共享用于冷却的公共热路径。

19. 发明申请

US20060238207A1 Interposer for use with test apparatus 有权
标题翻译：用于测试设备的插件
公开(公告)号：US20060238207A1
公开(公告)日：2006-10-26
申请号：US11110901
申请日：2005-04-21
申请人： Frank Egitto , How Lin
发明人： Frank Egitto , How Lin
IPC分类号： G01R31/02
CPC分类号： H05K3/4007 , G01R1/06711 , G01R1/0735 , H05K1/0393 , H05K3/365 , H05K2201/0367 , H05K2201/0394 , H05K2201/09627 , H05K2201/09745 , H05K2201/10378
摘要： An interposer comprising at least two dielectric layers bonded to each other, sandwiching a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts formed within and protruding from openings with the dielectric layers. The interposer is ideally suited for use as part of a test apparatus to interconnect highly dense patterns of solder ball contacts of a semiconductor chip to lesser dense arrays of contacts on the apparatus's printed circuit board. The interposer is also capable of being used for other purposes, including as an interconnecting circuitized substrate between a semiconductor chip and a chip carrier substrate or between a chip carrier and a printed circuit board. Various methods of making such an interposer are also provided.
摘要翻译：一种插入器，包括至少两个彼此结合的介电层，在其间夹有多个导体。这些导体各自电连接形成在电介质层的开口内并在其中突出的相应的一对相对的电触点。内插器非常适合用作测试设备的一部分，以将半导体芯片的高度致密图案的焊球接触件与设备的印刷电路板上较小致密的触点阵列相互连接。该插入器还能够用于其它目的，包括作为半导体芯片和芯片载体衬底之间的互连电路化衬底，或者在芯片载体和印刷电路板之间。还提供了制造这种插入件的各种方法。

20. 发明申请

US20060182397A1 METHOD AND APPARATUS FOR PROVIDING OPTOELECTRONIC COMMUNICATION WITH AN ELECTRIC DEVICE 失效
标题翻译：用于通过电气设备提供光电通信的方法和装置
公开(公告)号：US20060182397A1
公开(公告)日：2006-08-17
申请号：US11279276
申请日：2006-04-11
申请人： Alan Benner , How Lin , Frank Pompeo , Subhash Shinde
发明人： Alan Benner , How Lin , Frank Pompeo , Subhash Shinde
IPC分类号： G02B6/36
CPC分类号： G02B6/4249 , G02B6/4212 , G02B6/4214 , G02B6/4231 , G02B6/4246 , G02B6/4269 , G02B6/4292 , H01L2224/16225 , H01L2224/73253
摘要： An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the second surface of the transparent substrate. A first substrate is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.
摘要翻译：用于电子系统的光电组件包括具有第一表面和相对的第二表面的导热金属化透明基板。支撑芯片组结合到透明基板的第二表面。第一衬底经由金属化的第二表面和其间的支撑芯片与透明衬底连通。第二基板与第一基板的第二表面连通并且被配置用于安装数据处理，数据切换和数据存储芯片中的至少一个。光电子传感器与支持芯片组进行信号通信，并且具有与换能器对准的光纤阵列的一端的光信号介质基本上垂直于透明基板的第一表面。支撑芯片组和传感器共享一个共同的冷却路径。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式