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    • 13. 发明授权
    • Viscoelastic material for shock protection in an electronic device
    • 用于电子设备防震的粘弹性材料
    • US09107298B2
    • 2015-08-11
    • US13591196
    • 2012-08-21
    • Christopher Prest
    • Christopher Prest
    • G06F1/16H05K5/02G11B33/08
    • H05K5/0217G11B33/08Y10T29/49002
    • This invention is directed to reducing the effect of shocks on electronic device components. The electronic device component may be surrounded by a boundary element operative to deform in response to impacts. By deforming, the boundary element may be operative to absorb energy received by the shock or impact without passing the energy on to the electronic device component. To maximize the effectiveness of the boundary element over a range of different impacts (e.g., strong, instantaneous impacts and weak impacts over time), a viscoelastic material may be used. The characteristic properties of the viscoelastic material may be selected based on expected impacts to the electronic device component.
    • 本发明旨在减少冲击对电子设备部件的影响。 电子设备部件可以被边界元件围绕,边界元件可以响应于冲击而变形。 通过变形,边界元件可以用于吸收由冲击或冲击接收的能量,而不会将能量传递到电子设备部件。 为了最大限度地提高边界元素在一系列不同影响(例如强烈,瞬间的影响和随时间的弱影响)的效果,可以使用粘弹性材料。 可以基于对电子设备部件的预期影响来选择粘弹性材料的特性。
    • 14. 发明申请
    • Viscoelastic Material for Shock Protection in an Electronic Device
    • 用于电子设备冲击保护的粘弹性材料
    • US20130077278A1
    • 2013-03-28
    • US13591196
    • 2012-08-21
    • Christopher Prest
    • Christopher Prest
    • H05K5/02
    • H05K5/0217G11B33/08Y10T29/49002
    • This invention is directed to reducing the effect of shocks on electronic device components. The electronic device component may be surrounded by a boundary element operative to deform in response to impacts. By deforming, the boundary element may be operative to absorb energy received by the shock or impact without passing the energy on to the electronic device component. To maximize the effectiveness of the boundary element over a range of different impacts (e.g., strong, instantaneous impacts and weak impacts over time), a viscoelastic material may be used. The characteristic properties of the viscoelastic material may be selected based on expected impacts to the electronic device component.
    • 本发明旨在减少冲击对电子设备部件的影响。 电子设备部件可以被边界元件围绕,边界元件可以响应于冲击而变形。 通过变形,边界元件可以用于吸收由冲击或冲击接收的能量,而不会将能量传递到电子设备部件。 为了最大限度地提高边界元素在一系列不同影响(例如强烈,瞬间的影响和随时间的弱影响)的效果,可以使用粘弹性材料。 可以基于对电子设备部件的预期影响来选择粘弹性材料的特性。
    • 15. 发明授权
    • Viscoelastic material for shock protection in an electronic device
    • 用于电子设备防震的粘弹性材料
    • US08248777B2
    • 2012-08-21
    • US12242907
    • 2008-09-30
    • Christopher Prest
    • Christopher Prest
    • G06F1/16
    • H05K5/0217G11B33/08Y10T29/49002
    • This invention is directed to reducing the effect of shocks on electronic device components. The electronic device component may be surrounded by a boundary element operative to deform in response to impacts. By deforming, the boundary element may be operative to absorb energy received by the shock or impact without passing the energy on to the electronic device component. To maximize the effectiveness of the boundary element over a range of different impacts (e.g., strong, instantaneous impacts and weak impacts over time), a viscoelastic material may be used. The characteristic properties of the viscoelastic material may be selected based on expected impacts to the electronic device component.
    • 本发明旨在减少冲击对电子设备部件的影响。 电子设备部件可以被边界元件围绕,边界元件可以响应于冲击而变形。 通过变形,边界元件可以用于吸收由冲击或冲击接收的能量,而不会将能量传递到电子设备部件。 为了最大限度地提高边界元素在一系列不同影响(例如强烈,瞬间的影响和随时间的弱影响)的效果,可以使用粘弹性材料。 可以基于对电子设备部件的预期影响来选择粘弹性材料的特性。
    • 16. 发明授权
    • Dome switch array
    • 圆顶开关阵列
    • US08242390B2
    • 2012-08-14
    • US12552948
    • 2009-09-02
    • Christopher PrestCameron Frazier
    • Christopher PrestCameron Frazier
    • H01H9/26
    • H01H13/86H01H13/705H01H2205/032H01H2215/004H01H2221/002H01H2223/002H01H2231/032
    • An array of domes is constructed from a single sheet of conductive material. For example, several domes can be stamped at a preset distribution within a sheet of metal. The domes can be placed at any suitable position along the surface of the material, including for example at positions defined by the locations of contact pads on a circuit board. The conductive material can be electrically coupled to the circuit board at any suitable location, including for example along an edge of the piece of material. In some embodiments, the sheet of material can extend around the side walls of the circuit board, for example bent around the periphery of the circuit board. The sheet of material can be electrically coupled to the bottom of the circuit board, for example by soldering. This approach may provide a water resistant dome switch, whereby water can be prevented from leaking between the dome and the circuit board.
    • 圆形阵列由一片导电材料构成。 例如,几个圆顶可以在金属片内的预设分布上印上。 圆顶可以放置在沿材料表面的任何合适的位置,包括例如在由电路板上的接触焊盘的位置限定的位置。 导电材料可以在任何合适的位置电耦合到电路板,包括例如沿着该材料片的边缘。 在一些实施例中,该片材料可以围绕电路板的侧壁延伸,例如围绕电路板的周边弯曲。 该片材料可以例如通过焊接电耦合到电路板的底部。 该方法可以提供防水圆顶开关,从而可以防止水在圆顶和电路板之间泄漏。
    • 19. 发明申请
    • VISCOELASTIC MATERIAL FOR SHOCK PROTECTION IN AN ELECTRONIC DEVICE
    • 用于电子设备中的电击保护用粘弹性材料
    • US20090290294A1
    • 2009-11-26
    • US12242907
    • 2008-09-30
    • Christopher Prest
    • Christopher Prest
    • H05K7/00H01S4/00
    • H05K5/0217G11B33/08Y10T29/49002
    • This invention is directed to reducing the effect of shocks on electronic device components. The electronic device component may be surrounded by a boundary element operative to deform in response to impacts. By deforming, the boundary element may be operative to absorb energy received by the shock or impact without passing the energy on to the electronic device component. To maximize the effectiveness of the boundary element over a range of different impacts (e.g., strong, instantaneous impacts and weak impacts over time), a viscoelastic material may be used. The characteristic properties of the viscoelastic material may be selected based on expected impacts to the electronic device component.
    • 本发明旨在减少冲击对电子设备部件的影响。 电子设备部件可以被边界元件围绕,边界元件可以响应于冲击而变形。 通过变形,边界元件可以用于吸收由冲击或冲击接收的能量,而不会将能量传递到电子设备部件。 为了最大限度地提高边界元素在一系列不同影响(例如强烈,瞬间的影响和随时间的弱影响)的效果,可以使用粘弹性材料。 可以基于对电子设备部件的预期影响来选择粘弹性材料的特性。