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11. 发明申请

US20080264603A1 Mounting a Heat Sink in Thermal Contact with an Electronic Component 有权
公开(公告)号：US20080264603A1
公开(公告)日：2008-10-30
申请号：US12164367
申请日：2008-06-30
申请人： John Lee Colbert , Eric Alan Eckberg , Roger Duane Hamilton , Mark Kenneth Hoffmeyer , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： John Lee Colbert , Eric Alan Eckberg , Roger Duane Hamilton , Mark Kenneth Hoffmeyer , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： F28F7/00
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4081 , H01L2924/0002 , H01L2924/3011 , Y10T29/4913 , Y10T29/49826 , H01L2924/00
摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

12. 发明申请

US20080090439A1 Socket and method for compensating for differing coefficients of thermal expansion 失效
标题翻译：用于补偿不同热膨胀系数的插座和方法
公开(公告)号：US20080090439A1
公开(公告)日：2008-04-17
申请号：US11548797
申请日：2006-10-12
申请人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H01R13/15
CPC分类号： H01R12/7052 , H01R12/714 , Y10T29/49144 , Y10T29/49149 , Y10T29/49208 , Y10T29/53174 , Y10T29/53265
摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.
摘要翻译：说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的不同热膨胀系数的方法。插座包括表面安装的触点和细长的外壳。所述细长壳体包括至少两个联接在一起并设置成在所述至少两个构件之间形成孔的构件，其中所述表面安装的触点从所述孔延伸，并且其中所述至少两个构件的至少一个尺寸被选择以补偿插座和印刷电路板之间的热膨胀系数之间的差异。

13. 发明授权

US06718269B2 Apparatus, program product and method of estimating the stress intensity factor ratio of a material 失效
标题翻译：估算材料应力强度因子比的装置，程序产品和方法
公开(公告)号：US06718269B2
公开(公告)日：2004-04-06
申请号：US10022779
申请日：2001-12-13
申请人： Arvind Kumar Sinha
发明人： Arvind Kumar Sinha
IPC分类号： G01L100
CPC分类号： G01N3/20 , G01N2203/0023 , G01N2203/0075 , G01N2203/0623 , G01N2203/0682
摘要： An apparatus, program product, and method for estimating the stress intensity factor ratio (SIFR) of a material. The material is supported on a support and a load is applied to the material using a load member. A pair of strain components are measured using a strain gage attached to the material, and are stored in memory. The strain gage may be a rosette strain gage, for example. A processor calculates a ratio of the stored pair of strain components to thereby provide an estimate of the SIFR of the material. Advantageously, this estimate of the SIFR of the material is readily provided. Also advantageously, the estimate may be provided in a manner that is non-destructive to the material. The processor may additionally calculate the stress level of the material based on the estimated SIFR.
摘要翻译：用于估计材料的应力强度因子比（SIFR）的装置，程序产品和方法。材料支撑在支撑件上，并且使用负载构件将负载施加到材料。使用附着在材料上的应变计来测量一对应变分量，并存储在存储器中。应变计例如可以是玫瑰花应变计。处理器计算存储的一对应变分量的比率，从而提供材料的SIFR的估计。有利地，容易提供材料的SIFR的这种估计。还有利地，估计可以以对材料无损的方式提供。处理器可以基于估计的SIFR另外计算材料的应力水平。

14. 发明申请

US20140242349A1 METHOD AND SYSTEM FOR ALLIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE 有权
标题翻译：用于提高石墨纳米纤维增强热界面材料性能的方法和系统
公开(公告)号：US20140242349A1
公开(公告)日：2014-08-28
申请号：US13775157
申请日：2013-02-23
申请人： JOSEPH KUCZYNSKI , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
发明人： JOSEPH KUCZYNSKI , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
IPC分类号： C09K5/00 , B32B3/14 , C09K5/06
CPC分类号： C09K5/00 , B23B5/12 , B32B3/14 , B32B5/02 , B32B5/12 , B32B5/24 , B32B27/12 , B82Y30/00 , C09K5/06 , C09K5/063 , C23C16/26 , Y10T428/24802 , Y10T428/30
摘要： The exemplary embodiments of the present invention provide an apparatus and a thermal interface material with aligned graphite nanofibers in the thermal interface material to enhance the thermal interface material performance. The thermal interface material having a thickness between a first surface and a second surface opposite the first surface. The comprising thermal interface material includes a plurality of carbon nanofibers (CNFs), wherein a majority of the CNFs are oriented orthogonal to a plane of the first surface. The apparatus includes the thermal interface material, and a first object having a third surface; and a second object having a fourth surface; wherein the thermal interface material is sandwiched between the third surface and the fourth surface.
摘要翻译：本发明的示例性实施例提供了一种在热界面材料中具有对准的石墨纳米纤维的装置和热界面材料，以增强热界面材料性能。所述热界面材料具有在第一表面和与所述第一表面相对的第二表面之间的厚度。包括热界面材料包括多个碳纳米纤维（CNF），其中大部分CNF定向成垂直于第一表面的平面。该装置包括热界面材料和具有第三表面的第一物体; 和具有第四表面的第二物体; 其中所述热界面材料夹在所述第三表面和所述第四表面之间。

15. 发明授权

US08287336B2 Method of manufacturing a venting device for tamper resistant electronic modules 失效
标题翻译：制造防篡改电子模块通风装置的方法
公开(公告)号：US08287336B2
公开(公告)日：2012-10-16
申请号：US11686102
申请日：2007-03-14
申请人： John Richard Dangler , Phillip Duane Isaacs , Arvind Kumar Sinha
发明人： John Richard Dangler , Phillip Duane Isaacs , Arvind Kumar Sinha
IPC分类号： H05K5/00
CPC分类号： H05K5/0213 , H01L23/573 , H01L23/585 , H01L2924/0002 , H05K5/0208 , Y10T29/49885 , H01L2924/00
摘要： A tamper resistant enclosure for an electronic circuit includes an inner copper case, a tamper sensing mesh wrapped around the inner case, an outer copper case enclosing the inner case and the tamper sensing mesh, and a venting device forming a vent channel from inside the inner case to outside the outer case, the vent channel passing between overlapping layers of the tamper sensing mesh and having at least one right angle bend along its length. The venting device consists of two strips of a thin polyamide coverlay material laminated together along their length, and a length of wool yarn sandwiched between the two thin strips and extending from one end of the strips to the other end of the strips to form the vent channel. The length of yarn follows a zig-zag path between the first and second strips, the zig-zag path including at least one right angle bend.
摘要翻译：用于电子电路的防篡改外壳包括内铜壳，围绕内壳缠绕的篡改感测网，包围内壳和篡改感测网的外铜壳，以及从内部内部形成通风通道的排气装置壳体到外壳外部，排气通道在篡改感测网的重叠层之间通过，并且沿其长度具有至少一个直角弯曲。排气装置由沿着其长度层压在一起的两条薄的聚酰胺覆盖层材料组成，并且一长度的羊毛纱线夹在两条薄条之间并从条的一端延伸到条的另一端以形成通风口渠道。纱线的长度遵循第一和第二条带之间的之字形路径，之字形路径包括至少一个直角弯曲部。

16. 发明授权

US07438558B1 Three-dimensional stackable die configuration for an electronic circuit board 失效
标题翻译：电子电路板的三维可堆叠模具配置
公开(公告)号：US07438558B1
公开(公告)日：2008-10-21
申请号：US11939272
申请日：2007-11-13
申请人： Arvind Kumar Sinha
发明人： Arvind Kumar Sinha
IPC分类号： H01R12/00
CPC分类号： H01R13/22 , Y10T29/4913
摘要： A three-dimensional die configuration for mounting electronic components to a circuit board includes a circuit board having at least one circuit board die, a first electronic component mounted at the circuit board die and a first substrate member including a first surface electrically connected to the first chip. The three-dimensional die configuration further includes a double-sided land grid array having a first surface electrically connected to a second surface of the first substrate member. A second substrate member is electrically connected to a second surface of the double-sided land grid array. A second electronic component is electrically connected to a second surface of the second substrate member. A thermal interface member abuts the second chip and is covered by a cap member. The resulting three-dimensional die configuration establishes a multiple electronic component mounting arrangement having a footprint of a single electronic component.
摘要翻译：用于将电子部件安装到电路板的三维管芯构造包括具有至少一个电路板裸片，安装在电路板裸片上的第一电子部件和第一基板部件的电路板，第一基板部件包括电连接到第一芯片。三维管芯配置还包括双面焊盘栅格阵列，其具有电连接到第一衬底构件的第二表面的第一表面。第二基板部件电连接到双面焊盘格栅阵列的第二表面。第二电子部件电连接到第二基板部件的第二表面。热接口构件邻接第二芯片并被盖构件覆盖。所得到的三维模具配置建立了具有单个电子部件的占地面积的多个电子部件安装装置。

17. 发明授权

US07339266B2 Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof 有权
标题翻译：用于实现裸模微电子器件的可靠传热的装置及其方法
公开(公告)号：US07339266B2
公开(公告)日：2008-03-04
申请号：US11013151
申请日：2004-12-15
申请人： John Lee Colbert , Justin Christopher Rogers , Arvind Kumar Sinha
发明人： John Lee Colbert , Justin Christopher Rogers , Arvind Kumar Sinha
IPC分类号： H01L23/10 , H01L23/34 , H05K7/20
CPC分类号： H01L23/4006 , G06F1/20 , H01L2023/4043 , H01L2023/4062 , H01L2023/4087 , H01L2224/73204 , H01L2224/73253
摘要： Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.
摘要翻译：装置和方法包括使用裸模微电子器件; 散热器组件; 散热器安装组件，用于独立于裸露的微电子器件安装散热器组件; 以及施力机构，其在受控的作用力下将裸模的表面在与散热器组件的热界面处直接传热关系。

18. 发明授权

US07317514B2 System and method for optimizing heat management 有权
标题翻译：优化热管理系统和方法
公开(公告)号：US07317514B2
公开(公告)日：2008-01-08
申请号：US11050053
申请日：2005-02-03
申请人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil , Paul Alan Vermilyea
发明人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil , Paul Alan Vermilyea
IPC分类号： G01B11/16
CPC分类号： G01K5/52 , G01K5/72 , G01K11/32 , G05D23/1917 , G05D23/27
摘要： Disclosed are heat management method, and system, and computer program product that include at least one optical strain gauge that is mounted on a printed board in proximity to an object being monitored for temperature changes. Power for controlling heat to the object is modified in response to changes in the optical reference signal of the gauge, whereby such changes are correlated to the rate of strain change in the object as measured relative to predefined temperature changes of the object being monitored.
摘要翻译：公开了热管理方法，系统和计算机程序产品，其包括安装在印刷板上的至少一个光学应变计，所述光学应变计附近被监测用于温度变化的物体。响应于计量器的光学参考信号的变化来修改对对象的热控制的功率，由此这种变化与被测物体相对于被监视物体的预定温度变化测量的物体中的应变变化速率相关。

19. 发明授权

US07298623B1 Organic substrate with integral thermal dissipation channels, and method for producing same 失效
标题翻译：具有整体散热通道的有机基板及其制造方法
公开(公告)号：US07298623B1
公开(公告)日：2007-11-20
申请号：US11427382
申请日：2006-06-29
申请人： Joseph Kuczynski , Arvind Kumar Sinha
发明人： Joseph Kuczynski , Arvind Kumar Sinha
IPC分类号： H05K7/20 , H05K1/00
CPC分类号： H05K1/0203 , H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/09701 , H01L2924/15311 , H05K1/0272 , H05K1/0366 , H05K3/3452 , H05K3/429 , H05K2201/064 , H05K2203/1394 , Y10T29/49126 , Y10T29/49128 , Y10T29/49156 , Y10T29/4935 , H01L2924/00
摘要： A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-out channels formed thereon. A permanent solder mask is laminated over the cut-out channels to form thermal dissipation channels, which are in fluid communication with input and output ports. The C4 solder joints include solder balls that electronically connect terminals on the chips to corresponding attach pads on the substrate that are exposed through the mask. The thermal dissipation channels extend along rows of attach pads. A cooling fluid, such as inert perfluorocarbon fluid, flows through the thermal dissipation channels to remove heat and to mitigate strain on the solder balls due to coefficient of thermal expansion (CTE) mismatch between the chips and the substrate.
摘要翻译：芯片模块传热装置包括一个或多个芯片，通过控制的崩溃芯片连接（C4）焊接点电连接到模块基板。优选为FR-4层叠体或其他有机基板的模块基板在其上形成有切口通道。永久性焊接掩模层叠在切口通道上以形成与输入和输出端口流体连通的散热通道。 C4焊点包括将芯片上的端子电连接到通过掩模暴露的衬底上相应的附接焊盘的焊球。散热通道沿连续焊盘排。诸如惰性全氟化碳流体之类的冷却流体由于散热通道而流过，以便由于芯片和衬底之间的热膨胀系数（CTE）不匹配而消除热量并减轻焊球上的应变。

20. 发明授权

US07071720B2 Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit 失效
标题翻译：用于管理用于现场更换单元的焊盘格栅阵列插入件的对准和耦合的方法和装置
公开(公告)号：US07071720B2
公开(公告)日：2006-07-04
申请号：US10865253
申请日：2004-06-10
申请人： John Lee Colbert , Roger Duane Hamilton , Arvind Kumar Sinha
发明人： John Lee Colbert , Roger Duane Hamilton , Arvind Kumar Sinha
IPC分类号： G01R31/02
CPC分类号： H05K7/1061 , H05K3/301 , H05K3/303
摘要： An apparatus adapted for use in a field replacement unit that is to be coupled to an electronic module. Included in the apparatus are a cover assembly; a biasing assembly disposed within the cover assembly; and, an aligning and coupling mechanism retained in the cover assembly in juxtaposed relation with the biasing assembly for mounting an interposer assembly in a manner, whereby the interposer assembly is generally self-aligned along in-plane axes with respect to the cover assembly for subsequent coupling to an electronic module. A method for use of the apparatus is disclosed.
摘要翻译：一种适用于要耦合到电子模块的现场更换单元的设备。装置中包括盖组件; 设置在所述盖组件内的偏置组件; 以及保持在盖组件中的对准和联接机构，其与偏置组件并置关系，用于以一种方式安装插入件组件，由此插入器组件通常相对于盖组件沿面内轴线自对准，用于随后耦合到电子模块。公开了一种使用该装置的方法。

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