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    • 12. 发明授权
    • Personal speakerphone device
    • 个人扬声器设备
    • US08325911B2
    • 2012-12-04
    • US13051280
    • 2011-03-18
    • David K. Lambert
    • David K. Lambert
    • H04M9/08
    • H04M9/085
    • This disclosure describes a personal speakerphone device for teleconferencing a local participant with near side audio data and a far side participant with far side audio data. The device includes a controller that couples to a speaker and a microphone inside an enclosure that couples the speaker and the microphone within a coupling frequency range, and where the enclosure houses the speaker, the microphone, the controller, analog to digital conversion circuitry, digital to analog conversion circuitry, supporting circuitry, and one or more ports for data through which audio data is transferred. Additionally, the device includes a first frequency band decomposer, a second frequency band decomposer, one or more echo cancellers, and a converger. Further, the device includes a primary doubletalk detector and a secondary doubletalk detector.
    • 本公开描述了一种个人扬声器装置,用于电话会议具有近侧音频数据的本地参与者和具有远端音频数据的远端参与者。 该装置包括控制器,其耦合到耦合在耦合频率范围内的扬声器和麦克风的外壳内的扬声器和麦克风,并且其中外壳容纳扬声器,麦克风,控制器,模数转换电路,数字 到模拟转换电路,支持电路以及一个或多个端口用于通过其传输音频数据的数据。 另外,该设备包括第一频带分解器,第二频带分解器,一个或多个回声消除器和收敛器。 此外,该装置包括主双重检测器和次级双重检测器。
    • 17. 发明授权
    • Monolithically-integrated infrared sensor
    • 单片集成红外传感器
    • US06793389B2
    • 2004-09-21
    • US10065447
    • 2002-10-18
    • Abhijeet V. ChavanJames H. LogsdonDan W. ChilcottHan-Sheng S. LeeDavid K. LambertTimothy A. Vas
    • Abhijeet V. ChavanJames H. LogsdonDan W. ChilcottHan-Sheng S. LeeDavid K. LambertTimothy A. Vas
    • G01K702
    • G01J5/14G01J5/12
    • An integrated sensor comprising a thermopile transducer and signal processing circuitry that are combined on a single semiconductor substrate, such that the transducer output signal is sampled in close vicinity by the processing circuitry. The sensor comprises a frame formed of a semiconductor material that is not heavily doped, and with which a diaphragm is supported. The diaphragm has a first surface for receiving thermal (e.g., infrared) radiation, and comprises multiple layers that include a sensing layer containing at least a pair of interlaced thermopiles. Each thermopile comprises a sequence of thermocouples, each thermocouple comprising dissimilar electrically-resistive materials that define hot junctions located on the diaphragm and cold junctions located on the frame. The signal processing circuitry is located on the frame and electrically interconnected with the thermopiles. The thermopiles are interlaced so that the output of one of the thermopiles increases with increasing temperature difference between the hot and cold junctions thereof, while the output of the second thermopile decreases with increasing temperature difference between its hot and cold junctions.
    • 一种集成传感器,包括组合在单个半导体衬底上的热电堆换能器和信号处理电路,使得换能器输出信号在处理电路附近被采样。 传感器包括由不重掺杂的半导体材料形成的框架,并且隔膜支撑在该框架上。 隔膜具有用于接收热(例如,红外)辐射的第一表面,并且包括多层,其包括含有至少一对隔行热电堆的感测层。 每个热电堆包括一系列热电偶,每个热电偶包括不同的电阻材料,其限定位于隔膜上的热接点和位于框架上的冷接头。 信号处理电路位于框架上并与热电堆电互连。 热电堆交织使得其中一个热电堆的输出随着其热连接点和冷连接点之间温度差的增加而增加,而第二热电堆的输出随着其热连接点和冷连接点之间的温差增加而减小。