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    • 11. 发明授权
    • Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures
    • 在低温下具有改善的耐冲击性的热固化性环氧树脂组合物
    • US09221969B2
    • 2015-12-29
    • US10538877
    • 2003-12-17
    • Andreas KramerJurgen Finter
    • Andreas KramerJurgen Finter
    • C08L63/00C08G59/28C09J163/00
    • C08L63/00C08G59/28C08L2666/22C09J163/00
    • The invention relates to compositions containing at least one epoxide adduct A that comprises an average of more than one epoxide group per molecule, at least one polymer B of formula (I), at least one thixotropic agent C based on a urea derivative in a non-diffusing carrier material, and at least one hardener D for epoxy resins, which is activated at an increased temperature. Said composition is used especially as an adhesive and is provided with an extraordinarily high impact peel working value, especially at low temperatures. The invention further relates to epoxide group-terminal impact strength modifiers of formula (I), which significantly increase the impact resistance in epoxy resin compositions, particularly two-component epoxy resin compositions.
    • 本发明涉及至少一种包含至少一种环氧化物加合物A的组合物,其每分子平均含有多于一个环氧基团,至少一种式(I)的聚合物B,至少一种基于非衍生物的脲衍生物的触变剂C, 以及至少一种用于环氧树脂的硬化剂D,其在升高的温度下被活化。 所述组合物特别用作粘合剂,并且具有特别高的冲击剥离工作值,特别是在低温下。 本发明还涉及式(I)的环氧基团 - 末端冲击强度改性剂,其显着提高了环氧树脂组合物,特别是双组分环氧树脂组合物的耐冲击性。
    • 14. 发明申请
    • REACTION PRODUCTS BASED ON AMPHIPHILIC BLOCK COPOLYMERS AND THEIR USE AS IMPACT MODIFIER
    • 基于嵌段共聚物的反应产物及其作为冲击改性剂的应用
    • US20110114257A1
    • 2011-05-19
    • US13054248
    • 2009-07-17
    • Andreas KramerJurgen Finter
    • Andreas KramerJurgen Finter
    • B32B38/16C08G63/91C08G81/00
    • C08L71/02C08G2650/50C08G2650/58C08L63/00C08L2666/14C09J163/00C08L2666/22
    • Novel impact modifiers obtained by the reaction of amphiphilic block copolymers. These impact modifiers are suitable for use in thermosetting epoxy resin adhesives. The impact modifiers include a carboxylic acid group prepared from the reaction of an intramolecular anhydride of a di- or tricarboxylic acid with at least one amphiphilic block copolymer including at least one hydroxyl group. A method for adhesively binding heat-stable substrates includes applying a single-component thermosetting epoxy resin composition to the surface of a first heat-stable substrate; contacting the epoxy resin composition with the surface of second heat-stable substrate; heating the epoxy resin composition to 20-100° C.; bringing the two substrates and the epoxy resin composition into contact with a wash liquid; and heating the epoxy resin composition to 140-220° C.
    • 通过两亲嵌段共聚物的反应获得的新型冲击改性剂。 这些抗冲改性剂适用于热固性环氧树脂粘合剂。 抗冲改性剂包括由二羧酸或三羧酸的分子内酸酐与至少一种包含至少一个羟基的两亲嵌段共聚物的反应制备的羧酸基团。 用于粘合结合热稳定基板的方法包括将单组分热固性环氧树脂组合物施加到第一热稳定基材的表面; 使环氧树脂组合物与第二热稳定基材的表面接触; 将环氧树脂组合物加热至20-100℃。 使两个基板和环氧树脂组合物与洗涤液接触; 并将环氧树脂组合物加热至140-220℃
    • 15. 发明申请
    • Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures
    • 在低温下具有改善的耐冲击性的热固化性环氧树脂组合物
    • US20070105983A1
    • 2007-05-10
    • US10538877
    • 2003-12-17
    • Andreas KramerJurgen Finter
    • Andreas KramerJurgen Finter
    • C08K5/09
    • C08L63/00C08G59/28C08L2666/22C09J163/00
    • The invention relates to compositions containing at least one epoxide adduct A that comprises an average of more than one epoxide group per molecule, at least one polymer B of formula (I), at least one thixotropic agent C based on a urea derivative in a non-diffusing carrier material, and at least one hardener D for epoxy resins, which is activated at an increased temperature. Said composition is used especially as an adhesive and is provided with an extraordinarily high impact peel working value, especially at low temperatures. The invention further relates to epoxide group-terminal impact strength modifiers of formula (I), which significantly increase the impact resistance in epoxy resin compositions, particularly two-component epoxy resin compositions.
    • 本发明涉及至少一种包含至少一种环氧化物加合物A的组合物,其每分子平均含有多于一个环氧基团,至少一种式(I)的聚合物B,至少一种基于非衍生物的脲衍生物的触变剂C, 以及至少一种用于环氧树脂的硬化剂D,其在升高的温度下被活化。 所述组合物特别用作粘合剂,并且具有特别高的冲击剥离工作值,特别是在低温下。 本发明还涉及式(I)的环氧基团 - 末端冲击强度改性剂,其显着提高了环氧树脂组合物,特别是双组分环氧树脂组合物的耐冲击性。
    • 17. 发明授权
    • Electrically conductive thermoplastic polymer formulations and the use
thereof
    • 导电热塑性聚合物配方及其用途
    • US5482655A
    • 1996-01-09
    • US075658
    • 1993-06-11
    • Thomas VogelJurgen FinterHartmut BleierPatrice Bujard
    • Thomas VogelJurgen FinterHartmut BleierPatrice Bujard
    • C08G61/10C08G61/12C08L41/00C08L65/00H01B1/12H01B1/00H01B1/06
    • C08G61/126C08L65/00H01B1/127H01G11/48H01G11/56C08G2261/1424C08G2261/3223Y02E60/13
    • A formulation comprisinga) at least one polythiophene in oxidised polycationic form and containing structural repeating units of formula I ##STR1## wherein R.sub.1 and R.sub.2 are each independently of the other linear or branched C.sub.1 -C.sub.18 alkyl or C.sub.2 -C.sub.18 alkoxyalkyl; or are C.sub.3 -C.sub.8 cycloalkyl, phenyl or benzyl which are unsubstituted or substituted by C.sub.1 -C.sub.6 alkyl, C.sub.1 -C.sub.6 alkoxy or halogen; or R.sub.1 and R.sub.2, taken together, are linear C.sub.1 -C.sub.8 alkylene which is unsubstituted or substituted by C.sub.1 -C.sub.6 alkyl, C.sub.1 -C.sub.6 alkoxy, halogen, C.sub.3 -C.sub.8 cycloalkyl, phenyl, benzyl, C.sub.1 -C.sub.4 alkylphenyl, C.sub.1 -C.sub.4 alkoxyphenyl, halophenyl, C.sub.1 -C.sub.4 alkylbenzyl, C.sub.1 -C.sub.4 alkoxybenzyl or halobenzyl; andb) at least one polyanion of a film-forming thermoplastic polymer containing sulfated alcohol groups ##STR2## and/or sulfonatoalkylated alcohol groups ##STR3## in structural repeating units, wherein the group --(C.sub.n H.sub.2n)-- is linear or branched C.sub.2 -C.sub.12 alkylene which contains 2 to 5 carbon atoms in the carbon chain and is unsubstituted or substituted by C.sub.1 -C.sub.4 alkoxy. The formulation is an intrinsically electrically conductive themoformable material.
    • 一种制剂,其包含a)至少一种氧化聚阳离子形式的聚噻吩,并含有另一个直链或支链C 1 -C 18烷基或C 2 -C 18烷氧基烷基的结构式I重复单元; 或未取代或被C 1 -C 6烷基,C 1 -C 6烷氧基或卤素取代的C 3 -C 8环烷基,苯基或苄基; 或者R 1和R 2一起是未被取代或被C 1 -C 6烷基,C 1 -C 6烷氧基,卤素,C 3 -C 8环烷基,苯基,苄基,C 1 -C 4烷基苯基,C 1 -C 4烷氧基苯基,卤代苯基,C 1 -C 4烷基苄基 ,C 1 -C 4烷氧基苄基或卤代苄基; 和b)在结构重复单元中含有硫酸化醇基团和/或磺化烷基化醇基团的成膜热塑性聚合物的至少一种聚阴离子,其中 - (C n H 2n) - 为直链或支链C 2 -C 12亚烷基 其在碳链中含有2至5个碳原子且未被取代或被C 1 -C 4烷氧基取代。 制剂是本征导电的可变形材料。