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11. 发明授权

US06945856B2 Subaperture chemical mechanical planarization with polishing pad conditioning 有权
标题翻译：亚光化学机械平面化与抛光垫调理
公开(公告)号：US06945856B2
公开(公告)日：2005-09-20
申请号：US10374494
申请日：2003-02-25
申请人： John M. Boyd , Michael S. Lacy , David G. Halley
发明人： John M. Boyd , Michael S. Lacy , David G. Halley
IPC分类号： B24B37/20 , B24B37/24 , B24B37/26 , B24B7/22 , B24B53/00
CPC分类号： B24B37/245 , B24B37/20 , B24B37/26 , B24D9/085
摘要： Embodiments of the present invention are directed to polishing an object with polishing pad conditioning. In one embodiment, a method for polishing an object comprises placing a contact portion of a polishing pad in contact with a target surface of the object to be planarized over a contact area which is smaller in area than the target surface; conditioning a noncontact portion of the polishing pad which is not in contact with the target surface of the object; and moving the polishing pad relative to the target surface of the object to move the noncontact portion in contact with the target surface of the object and move the contact portion out of contact with the target surface of the object.
摘要翻译：本发明的实施例涉及用抛光垫调理来抛光物体。在一个实施例中，用于抛光物体的方法包括将抛光垫的接触部分与待平坦化的物体的目标表面接触在比目标表面小的面积的接触区域上; 调节抛光垫的不与物体的目标表面接触的非接触部分; 并且相对于物体的目标表面移动抛光垫，以移动与物体的目标表面接触的非接触部分，并使接触部分脱离与物体的目标表面接触。

12. 发明授权

US06936133B2 Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool 失效
标题翻译：固定磨料基材的制备方法和装置，并用于集束CMP工具
公开(公告)号：US06936133B2
公开(公告)日：2005-08-30
申请号：US10255403
申请日：2002-09-26
申请人： John M. Boyd , Michael S. Lacy
发明人： John M. Boyd , Michael S. Lacy
IPC分类号： B24B7/22 , B24D11/00 , C23F1/00 , H01L21/302 , H01L21/306 , H01L21/461
CPC分类号： B24D11/001 , B24B7/228
摘要： A method of creating and using a polishing substrate having a coating layer is described. The method that includes providing a substrate having one or more predetermined patterns disposed on a surface of the substrate and coating the surface of the substrate with an abrasive to form a coated substrate conforming to the predetermined pattern. An apparatus enabling preparation and use of a fixed abrasive polishing member is described. The apparatus includes a patterned substrate, an abrasive coating a surface of the patterned substrate and a vacuum deposition chamber in which the abrasive is applied to the surface of the substrate. In addition, rather than a fixed abrasive, non-abrasive material may be applied to the surface of the patterned substrate, in which case, a conventional slurry may be used in planarization of an applied semiconductor wafer.
摘要翻译：描述了制造和使用具有涂层的抛光衬底的方法。该方法包括提供具有设置在基板的表面上的一个或多个预定图案的基板，并用磨料涂覆基板的表面以形成符合预定图案的涂覆基板。描述了能够准备和使用固定研磨抛光构件的装置。该装置包括图案化衬底，对图案化衬底的表面进行磨料涂层和真空沉积室，其中磨料施加到衬底的表面。此外，可以将非研磨材料施加到图案化衬底的表面上，而不是固定的研磨剂，在这种情况下，常规的浆料可用于所施加的半导体晶片的平坦化。

13. 发明授权

US06733615B2 Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool 失效
标题翻译：固定磨料基材的制备方法和装置，并用于集束CMP工具
公开(公告)号：US06733615B2
公开(公告)日：2004-05-11
申请号：US10254810
申请日：2002-09-25
申请人： John M. Boyd , Michael S. Lacy
发明人： John M. Boyd , Michael S. Lacy
IPC分类号： H01L21306
CPC分类号： B24D11/001 , B24B7/228
摘要： An apparatus enabling preparation and use of a fixed abrasive polishing member is described. The apparatus includes a patterned three-dimensional substrate, an abrasive coating a surface of the patterned substrate and a vacuum deposition chamber in which the abrasive is applied to the surface of the substrate. In addition, rather than a fixed abrasive, non-abrasive material may be applied to the surface of the patterned substrate, in which case, a conventional slurry may be used in planarization of an applied semiconductor wafer.
摘要翻译：描述了能够准备和使用固定研磨抛光构件的装置。该设备包括图案化三维基板，磨料涂层图案化基板的表面和真空沉积室，其中研磨剂施加到基板的表面。此外，可以将非研磨材料施加到图案化衬底的表面上，而不是固定的研磨剂，在这种情况下，常规的浆料可用于所施加的半导体晶片的平坦化。

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