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    • 11. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR ITS PRODUCTION
    • 半导体器件及其制造方法
    • US20100301387A1
    • 2010-12-02
    • US12733775
    • 2008-09-17
    • Ning QuAlfred Goerlach
    • Ning QuAlfred Goerlach
    • H01L29/866H01L29/739
    • H01L29/868H01L29/0611H01L29/0623H01L29/161H01L29/861H01L29/872H01L2924/0002H01L2924/00
    • A semiconductor system is described, which is made up of a highly n-doped silicon substrate and a first n-silicon epitaxial layer, which is directly contiguous to the highly n-doped silicon substrate, and having a p-doped SiGe layer, which is contiguous to a second n-doped silicon epitaxial layer and forms a heterojunction diode, which is situated above the first n-doped silicon epitaxial layer and in which the pn-junction is situated within the p-doped SiGe layer. The first n-silicon epitaxial layer has a higher doping concentration than the second n-silicon epitaxial layer. Situated between the two n-doped epitaxial layers is at least one p-doped emitter trough, which forms a buried emitter, a pn-junction both to the first n-doped silicon epitaxial layer and also to the second n-doped silicon epitaxial layer being formed, and the at least one emitter trough being completely enclosed by the two epitaxial layers.
    • 描述了半导体系统,其由高度n掺杂的硅衬底和与第一n型硅衬底直接相邻并具有p掺杂的SiGe层的第一n型硅外延层组成,其中 与第二n掺杂硅外延层邻接并形成异质结二极管,其位于第一n掺杂硅外延层之上,并且其中pn结位于p掺杂SiGe层内。 第一n硅外延层具有比第二n硅外延层更高的掺杂浓度。 位于两个n掺杂外延层之间的是至少一个p掺杂的发射极沟槽,其形成掩埋发射极,pn结与第一n掺杂硅外延层以及第二n掺杂硅外延层 并且所述至少一个发射极槽被两个外延层完全包围。
    • 13. 发明授权
    • Semiconductor arrangement having a Schottky diode
    • 具有肖特基二极管的半导体装置
    • US09263597B2
    • 2016-02-16
    • US13882412
    • 2011-09-09
    • Ning QuAlfred Goerlach
    • Ning QuAlfred Goerlach
    • H01L29/872H01L29/40H01L29/417
    • H01L29/872H01L29/404H01L29/417
    • A semiconductor assemblage of a super-trench Schottky barrier diode (STSBD) made up of an n+ substrate, an n-epilayer, trenches etched into the n-epilayer that have a width and a distance from the n+ substrate, mesa regions between the adjacent trenches having a width, a metal layer on the front side of the chip that is a Schottky contact and serves as an anode electrode, and a metal layer on the back side of the chip that is an ohmic contact and serves as a cathode electrode, wherein multiple Schottky contacts having a width or distance and a distance between the Schottky contacts, and between the Schottky contact as anode electrode and the first Schottky contact, are located on the trench wall.
    • 由n +衬底,n-外延层,蚀刻到n-外延层中的与n +衬底具有宽度和距离的沟槽组成的超沟槽肖特基势垒二极管(STSBD)的半导体组件,相邻的n +衬底之间的台面区域 具有宽度的沟槽,作为肖特基接触的芯片的前侧上的金属层,用作阳极电极,以及作为欧姆接触并用作阴极电极的芯片背面的金属层, 其中具有宽度或距离以及肖特基接触之间以及作为阳极电极的肖特基接触和第一肖特基接触之间的多个肖特基接触位于沟槽壁上。
    • 15. 发明授权
    • Semiconductor system including a schottky diode
    • 包括肖特基二极管的半导体系统
    • US08836072B2
    • 2014-09-16
    • US13382982
    • 2010-06-09
    • Ning QuAlfred Goerlach
    • Ning QuAlfred Goerlach
    • H01L29/66
    • H01L29/872H01L29/0619H01L29/66143
    • A semiconductor system is described, which includes a trench junction barrier Schottky diode having an integrated p-n type diode as a clamping element, which is suitable for use in motor vehicle generator system, in particular as a Zener diode having a breakdown voltage of approximately 20V. In this case, the TJBS is a combination of a Schottky diode and a p-n type diode. Where the breakdown voltages are concerned, the breakdown voltage of the p-n type diode is lower than the breakdown voltage of Schottky diode. The semiconductor system may therefore be operated using high currents at breakdown.
    • 描述了一种半导体系统,其包括具有集成p-n型二极管作为钳位元件的沟槽结屏障肖特基二极管,其适用于机动车辆发电机系统,特别是作为击穿电压为约20V的齐纳二极管。 在这种情况下,TJBS是肖特基二极管和p-n型二极管的组合。 在击穿电压的情况下,p-n型二极管的击穿电压低于肖特基二极管的击穿电压。 因此,半导体系统可以在击穿时使用大电流来操作。
    • 18. 发明授权
    • Super-junction schottky PIN diode
    • 超结肖特基PIN二极管
    • US09263515B2
    • 2016-02-16
    • US14236604
    • 2012-07-19
    • Ning QuAlfred Goerlach
    • Ning QuAlfred Goerlach
    • H01L29/872H01L29/06H01L29/66H01L29/868
    • H01L29/0634H01L29/0649H01L29/66143H01L29/868H01L29/872
    • A semiconductor chip has an n+-doped substrate, above which an n-doped epilayer having trenches is introduced, the trenches being filled with p-doped semiconductor material and in each case having a highly p-doped region at their top side, such that an alternating arrangement of n-doped regions having a first width and p-doped regions having a second width is present. A first metal layer functioning as an anode is provided on the front side of the chip and forms a Schottky contact with the n-doped epilayer and forms an ohmic contact with the highly p-doped regions. A second metal layer which represents an ohmic contact and functioning as a cathode is formed on the rear side of the semiconductor chip. A dielectric layer is provided between each n-doped region and an adjacent p-doped region.
    • 半导体芯片具有n +掺杂的衬底,其上引入具有沟槽的n掺杂外延层,沟槽被p掺杂半导体材料填充,并且在每种情况下在其顶侧具有高p掺杂区域,使得 存在具有第一宽度的n掺杂区域和具有第二宽度的p掺杂区域的交替布置。 用作阳极的第一金属层设置在芯片的正面,并与n掺杂的外延层形成肖特基接触,并与高p掺杂区形成欧姆接触。 表示欧姆接触并用作阴极的第二金属层形成在半导体芯片的后侧。 在每个n掺杂区域和相邻的p掺杂区域之间提供介电层。