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11. 发明申请

US20070108628A1 MOUNTING SUBSTRATE AND SEMICONDUCTOR DEVICE 有权
标题翻译：安装基板和半导体器件
公开(公告)号：US20070108628A1
公开(公告)日：2007-05-17
申请号：US11560076
申请日：2006-11-15
申请人： Takashi Ozawa , Yasushi Araki , Masatoshi Nakamura , Seiji Sato
发明人： Takashi Ozawa , Yasushi Araki , Masatoshi Nakamura , Seiji Sato
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L23/49811 , H01L23/49838 , H01L2224/73203 , H05K3/305 , H05K2201/09772 , H05K2201/09781 , H05K2201/10674 , H05K2201/10977 , Y02P70/613
摘要： A mounting substrate for mounting a semiconductor chip in a flip chip manner, having a plurality of connection pads to which the semiconductor chip is connected, an insulating pattern formed so as to cover a part of the connection pads, and a plurality of dummy patterns for controlling a flow of an underfill infiltrated below the semiconductor chip, characterized in that the plurality of dummy patterns are arranged in staggered lattice shape.
摘要翻译：一种用于以倒装芯片方式安装半导体芯片的安装基板，具有连接半导体芯片的多个连接焊盘，形成为覆盖连接焊盘的一部分的绝缘图案，以及多个用于控制渗透在半导体芯片下方的底部填充物的流动，其特征在于，所述多个虚拟图案以交错的格子形状布置。

12. 发明授权

US06692794B2 Composite and manufacturing method therefor 失效
标题翻译：复合制造方法
公开(公告)号：US06692794B2
公开(公告)日：2004-02-17
申请号：US10217113
申请日：2002-08-12
申请人： Masatoshi Nakamura , Yoshinori Hatanaka
发明人： Masatoshi Nakamura , Yoshinori Hatanaka
IPC分类号： H05H124
CPC分类号： C23C16/509 , B32B15/04 , C03C17/256 , C03C2217/212 , C03C2218/113 , C23C16/405 , C23C16/452 , Y10T428/31504 , Y10T428/31725
摘要： This invention provides a composite having a hydrophilic film made of amorphous titanium oxide. A film is deposited on a substrate made of, for example, glass or synthetic resin. The film is composed of amorphous titanium oxide partially having structures in which a network of Ti—O—Ti bond is broken to give Ti—OH bond terminals.
摘要翻译：本发明提供一种具有由无定形氧化钛制成的亲水膜的复合体。将膜沉积在由例如玻璃或合成树脂制成的基板上。该膜由部分具有Ti-O-Ti键网络断裂以得到Ti-OH键末端的结构的无定形氧化钛组成。

13. 发明授权

US5854708A Anti-fog element 失效
标题翻译：防雾元素
公开(公告)号：US5854708A
公开(公告)日：1998-12-29
申请号：US897291
申请日：1997-07-21
申请人： Toru Komatsu , Masatoshi Nakamura
发明人： Toru Komatsu , Masatoshi Nakamura
IPC分类号： B60S1/02 , B01J35/02 , B60J1/00 , B60J1/20 , B60R1/06 , B60S1/60 , C03C17/25 , C03C17/34 , G02B5/08
CPC分类号： C03C17/3417 , C03C17/256 , C03C17/3411 , C03C2217/71 , C03C2218/365
摘要： An anti-fog element includes a transparent substrate such as a glass substrate, a transparent film of a photocatalyzer such as TiO.sub.2 catalyzing a photocatalytic reaction on the transparent substrate, and a film of a transparent porous inorganic oxide such as SiO.sub.2 formed on the film of the photocatalyzer and having a surface exhibiting a hydrophilic property. Organic matters etc. deposited in openings of the porous inorganic oxide film are dissolved and removed by a photocatalytic reaction caused by light excitation of the photocatalyzer film whereby the anti-fog property of the anti-fog element can be maintained over a long period of time.
摘要翻译：防雾元件包括诸如玻璃基板的透明基板，在透明基板上催化光催化反应的诸如TiO 2的光催化剂的透明膜，以及形成在透明基板上的透明多孔无机氧化物如SiO 2的膜该光催化剂具有表现出亲水性的表面。通过由光催化剂膜的光激发引起的光催化反应将沉积在多孔无机氧化物膜的开口中的有机物质溶解并除去，由此能够长时间保持防雾元件的防雾性。

14. 发明授权

US5299443A Slide adjusting device for use in forging press 失效
标题翻译：用于锻压机的滑动调节装置
公开(公告)号：US5299443A
公开(公告)日：1994-04-05
申请号：US922223
申请日：1992-07-31
申请人： Masatoshi Nakamura
发明人： Masatoshi Nakamura
IPC分类号： B30B15/06 , B21J9/00 , B21J9/18 , B30B1/26 , B30B15/00
CPC分类号： B21J9/18 , B30B1/263 , B30B15/0035
摘要： The present invention provides a small-sized slide adjusting device for use in a forging press manufactured by a simplified manufacturing process. An adjusting lever is provided with a nut receiving section, and a nut to be received in the nut receiving section is provided with turning shafts in axial alignment. A mounting hole is provided through two sides of the receiving section, a disc having an eccentric through hole is fitted in each mounting hole, and the turning shafts of the nut are fitted in a respective through hole. In one embodiment the nut is provided with a female screw situated at a right angle to the axial alignment direction of the turning shafts, and one end of the screw is connected to a motor mounted on a slide. In the slide adjusting device of this construction, a variation in height occurs due to the circular arc motion at the time of inclined movement of the adjusting lever making a center of a wrist pin a fulcrum followed by turning movement of the disc and turning shafts. Every slide adjusting movement which occurs is performed in a turning slide manner, whereby concentration of stress is alleviated resulting in a small-sized device.
摘要翻译：本发明提供一种用于通过简化的制造工艺制造的锻造压力机中的小型滑块调节装置。调节杆设置有螺母接收部，并且容纳在螺母接收部中的螺母设置有轴向对准的转动轴。安装孔通过接收部分的两侧设置，每个安装孔装有一个具有偏心通孔的盘，螺母的转动轴嵌入相应的通孔中。在一个实施例中，螺母设置有与旋转轴的轴向对齐方向成直角的内螺纹，并且螺钉的一端连接到安装在滑块上的马达。在这种结构的滑块调节装置中，由于调节杆的倾斜运动时的圆弧运动发生了高度变化，从而使得腕销的中心成为支点，随后转盘和转动轴的转动。发生的每个滑块调节运动以转动滑动方式进行，由此减轻了应力集中，从而导致小型装置。

15. 发明授权

US09175142B2 Transportation method for water-absorbing resin powder substance 有权
标题翻译：吸水树脂粉料的运输方式
公开(公告)号：US09175142B2
公开(公告)日：2015-11-03
申请号：US12935052
申请日：2009-03-26
申请人： Kozo Nogi , Masatoshi Nakamura , Koji Matsumoto , Kazuma Awai
发明人： Kozo Nogi , Masatoshi Nakamura , Koji Matsumoto , Kazuma Awai
IPC分类号： B65G53/00 , C08J3/12
CPC分类号： C08J3/12 , C08F6/008 , C08J3/075 , C08J3/245 , C08J2333/02
摘要： [PROBLEM] Provided is a transportation method for a water-absorbing resin powder substance, which is capable of suppressing property decrease of the water-absorbing resin powder substance while suppressing blocking phenomenon and is suitable for long distance transportation.[SOLUTION] The present invention is a transportation method for a water-absorbing resin powder substance during a production step by pneumatic transportation via a transportation pipeline. In this transportation method, two or more pneumatic transportation apparatuses (A, B, C) are provided in one transportation section, and these pneumatic transportation apparatuses (A, B, C) are connected by the transportation pipelines (P1, P2, P3) in series.
摘要翻译： [问题]提供一种吸水性树脂粉末物质的输送方法，其能够抑制吸水性树脂粉末物质的特性降低同时抑制堵塞现象，适用于长距离运输。 [解决方案]本发明是一种通过运输管线气动输送的生产步骤中的吸水性树脂粉末物质的输送方法。在该运送方法中，在一个运送部中设置有两个以上的气动运送装置（A，B，C），这些气动运送装置（A，B，C）通过输送管道（P1，P2，P3）连接，系列。

16. 发明授权

US09096732B2 Conveyance method for water-absorbing resin powder substance 有权
标题翻译：吸水树脂粉料的输送方法
公开(公告)号：US09096732B2
公开(公告)日：2015-08-04
申请号：US12935133
申请日：2009-03-26
申请人： Kozo Nogi , Masatoshi Nakamura , Koji Matsumoto , Kazuma Awai
发明人： Kozo Nogi , Masatoshi Nakamura , Koji Matsumoto , Kazuma Awai
IPC分类号： B65G53/00 , C08J3/12
CPC分类号： C08J3/12 , C08F6/008 , C08J3/075 , C08J3/245 , C08J2333/02
摘要： [Problem] To provide a pneumatic conveyance method for a water-absorbing resin powder substance, which is capable of suppressing property decrease of the water-absorbing resin powder substance, while suppressing obstruction phenomenon.[Solution] A conveyance method for a water-absorbing resin powder substance by pneumatic conveyance of the water-absorbing resin powder substance during a production step via a transportation pipeline, wherein a variation of a solid-gas ratio (R1/R2) exceeds 1 and is equal to or smaller than 7, provided that R1 (kg-resin/kg-air) stands for an initial solid-gas ratio at a start point of the transportation pipeline, and R2 (kg-resin/kg-air) stands for a terminal solid-gas ratio at a terminal point of the transportation pipeline is provided.
摘要翻译：本发明提供一种能够抑制吸水性树脂粉末物质的降低的同时抑制阻塞现象的吸水性树脂粉末物质的气动输送方法。 [解决方案]一种吸水性树脂粉末物质的输送方法，其特征在于，在制造工序中，通过输送管线气动输送吸水性树脂粉末物质，其中固体气体比（R1 / R2）的变化超过1 并且等于或小于7，条件是R1（kg-树脂/ kg-空气）表示在输送管线的起点处的初始固气比，R2（kg-树脂/ kg-空气）提供了在输送管线的终点处的终端固体气体比。

17. 发明授权

US08846823B2 Water absorbing agent and production method thereof 有权
标题翻译：吸水剂及其制备方法
公开(公告)号：US08846823B2
公开(公告)日：2014-09-30
申请号：US11579603
申请日：2005-04-28
申请人： Masatoshi Nakamura , Koji Miyake , Hirofumi Shibata
发明人： Masatoshi Nakamura , Koji Miyake , Hirofumi Shibata
IPC分类号： C08F283/00 , A61L15/60 , C08J3/24
CPC分类号： C08J3/245 , A61L15/60 , C08J2300/14 , C08L33/00
摘要： A water absorbing agent and a method for producing the water absorbing agent are disclosed. Water absorbent resin particles having an internal cross-linked structure obtained by polymerizing a water-soluble unsaturated monomer, organic acid, and water-soluble multivalent metal salt are mixed, so that it is possible to provide a water absorbing agent which suppresses permeation of metal components into the water absorbent resin particles and enables the metal components to evenly adhere to an entire surface of the water absorbent resin in a dot manner.
摘要翻译：公开了吸水剂和吸水剂的制造方法。将通过聚合水溶性不饱和单体，有机酸和水溶性多价金属盐获得的内部交联结构的吸水性树脂颗粒混合，从而可以提供抑制金属渗透的吸水剂组分进入吸水性树脂颗粒中，使得金属组分能够以点的方式均匀地附着在吸水性树脂的整个表面上。

18. 发明授权

US08771014B2 Connector housing with mat seal 有权
标题翻译：连接器外壳带垫密封
公开(公告)号：US08771014B2
公开(公告)日：2014-07-08
申请号：US13576729
申请日：2011-02-04
申请人： Masatoshi Nakamura , Naoki Goto , Madoka Ooishi
发明人： Masatoshi Nakamura , Naoki Goto , Madoka Ooishi
IPC分类号： H01R13/40 , H01R13/52 , H01R13/504 , H01R43/18
CPC分类号： H01R13/5208 , H01R13/504 , H01R43/18
摘要： A connector housing with a mat seal, includes a connector housing a mat seal. At an outer surface of a rear wall of the connector housing, a plurality of passages for a silicone gum forming material are provided outside an area where a plurality of terminal insertion holes are formed. On the outer surface of the rear wall and outside the passages, an annular rib is protruded and surrounds an area inside the annular rib. The mat seal is molded by using the area inside the annular rib as a reservoir space in which the silicone gum forming material overflowing from the seal forming cavity is retained, and using at least one of the passages as a passage for a gate through which the silicone gum forming material is injected into the seal forming cavity, and the other of the passages as passages for overflow.
摘要翻译：具有垫密封件的连接器壳体包括容纳垫密封件的连接器。在连接器壳体的后壁的外表面上，在形成有多个端子插入孔的区域的外部设置多个用于硅橡胶形成材料的通道。在后壁的外表面和通道外侧，环形肋突出并围绕环形肋内的区域。通过使用环形肋内部的区域作为储存空间来模制垫密封件，其中保持从密封形成腔溢出的硅酮胶形成材料，并且使用至少一个通道作为浇口的通道，通过该密封件硅胶成型材料注入到密封成型腔中，另一个通道作为溢流通道。

19. 发明授权

US08596931B2 Particulate water absorbing agent and method for producing the same 有权
标题翻译：颗粒状吸水剂及其制造方法
公开(公告)号：US08596931B2
公开(公告)日：2013-12-03
申请号：US12593443
申请日：2008-03-28
申请人： Teruhisa Nagashima , Masatoshi Nakamura , Yusuke Watanabe , Kozo Nogi , Kunihiko Ishizaki
发明人： Teruhisa Nagashima , Masatoshi Nakamura , Yusuke Watanabe , Kozo Nogi , Kunihiko Ishizaki
IPC分类号： B65G53/00
CPC分类号： C08J3/12 , A61L15/60 , B01J20/267 , B01J2220/68 , C08J2301/00 , C08J2303/00
摘要： A method includes the steps of: adding an organic surface cross-linking agent to a water absorbent resin having a cross-linked structure; adding a liquid permeability improving agent to the water absorbent resin concurrently with or after the addition of the organic surface cross-linking agent; and then adding a lubrication improving agent to the water absorbent resin. This provides a particulate water absorbing agent and a method for producing it, the particulate water absorbing agent being suitable for pneumatic transportation, suffering no decrease in the effect of the liquid permeability improving agent, and excelling in properties such as fluidity and damage resistance after the pneumatic transportation.
摘要翻译：一种方法包括以下步骤：向具有交联结构的吸水性树脂中加入有机表面交联剂; 在添加有机表面交联剂的同时或之后向吸水性树脂中加入透液性改进剂; 然后向吸水性树脂中添加润滑改善剂。这提供了一种颗粒状吸水剂及其制造方法，该颗粒状吸水剂适用于气动输送，不会降低透液性改善剂的作用，并且在其后的流动性和耐损伤性等性能方面优异气动运输。

20. 发明授权

US07838998B2 Mounting substrate and semiconductor device 有权
标题翻译：安装基板和半导体器件
公开(公告)号：US07838998B2
公开(公告)日：2010-11-23
申请号：US11560076
申请日：2006-11-15
申请人： Takashi Ozawa , Yasushi Araki , Masatoshi Nakamura , Seiji Sato
发明人： Takashi Ozawa , Yasushi Araki , Masatoshi Nakamura , Seiji Sato
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L23/49811 , H01L23/49838 , H01L2224/73203 , H05K3/305 , H05K2201/09772 , H05K2201/09781 , H05K2201/10674 , H05K2201/10977 , Y02P70/613
摘要： A mounting substrate for mounting a semiconductor chip in a flip chip manner, having a plurality of connection pads to which the semiconductor chip is connected, an insulating pattern formed so as to cover a part of the connection pads, and a plurality of dummy patterns for controlling a flow of an underfill infiltrated below the semiconductor chip, characterized in that the plurality of dummy patterns are arranged in staggered lattice shape.
摘要翻译：一种用于以倒装芯片方式安装半导体芯片的安装基板，具有连接半导体芯片的多个连接焊盘，形成为覆盖连接焊盘的一部分的绝缘图案，以及多个用于控制渗透在半导体芯片下方的底部填充物的流动，其特征在于，所述多个虚拟图案以交错的格子形状布置。

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