会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 12. 发明授权
    • Circuit assembly
    • 电路组装
    • US3883682A
    • 1975-05-13
    • US46736074
    • 1974-05-06
    • WESTERN ELECTRIC CO
    • CAGLE ALBERT WGREER WAYNE EWEIGHT WILBUR J
    • H04M1/02H05K3/22H05K7/14H05K1/12
    • H04M1/02H05K3/222H05K7/1417Y10S411/908Y10S411/947Y10S411/966
    • In a telephone repeater assembly, a plurality of fasteners is maintained in a self-supporting array by a framework of attached runners. The fasteners are aligned with and joined to a mating part in a pattern which substantially corresponds to the array. Flexibility of the runners permits minor adjustments to the positions of the fasteners in the array to align the fasteners precisely to the pattern on the mating part. Handling the fasteners in such an array facilitates assembly of the fasteners into the mating part. A circuit board is mounted to such part with one side thereof contiguous to the array of fasteners. The board has a plurality of apertures in addition to its mounting holes for the insertion of wide-headed contact screws. The screws are retained by the fasteners. Upon full insertion of the contact screws the head of the screws bridges a gap between two separate conductors on the board and establishes electrical continuity therebetween.
    • 在电话中继器组件中,多个紧固件通过附接的跑道的框架保持在自支撑阵列中。 紧固件以基本对应于阵列的图案对齐并与配合部件接合。 跑步者的灵活性允许对阵列中的紧固件的位置进行微调,以将紧固件精确地对准配合部件上的图案。 以这种阵列处理紧固件有助于将紧固件组装到配合部件中。 电路板安装到这样的部件上,其一侧与紧固件阵列相邻。 除了用于插入宽头接触螺钉的安装孔之外,该板还具有多个孔。 螺钉由紧固件保持。 在完全插入接触螺钉后,螺钉的头部桥接在板上的两个分开的导体之间的间隙,并在它们之间建立电连续性。
    • 13. 发明授权
    • Wire cutting and insulation stripping apparatus
    • 线切割和绝缘剥离装置
    • US3880022A
    • 1975-04-29
    • US34538373
    • 1973-03-27
    • WESTERN ELECTRIC CO
    • MILLER HARRY E
    • H02G1/12
    • H02G1/1214
    • A wire cutting and insulation stripping apparatus is mounted on a hand-held, portable, wire-wrapping tool and includes a pair of wire cutting blades, a first and second pair of insulation cutting blades and a cylinder such as an air cylinder or solenoid for extending and retracting a rod. In a first embodiment, the wire cutting blades and the first insulation cutting blades are mounted on the cylinder and the second insulation cutting blades are mounted on the rod with the first and second insulation cutting blades directly adjacent each other when the rod is retracted. In operation, an insulated wire is inserted between the wire cutting blades and the first and second insulation cutting blades. This cuts the insulation. The wire cutting blades are then closed to cut the insulated wire and the rod is then extended to displace the second insulation cutting blades away from the first insulation cutting blades. This strips the cut insulation from the insulated wire. In the second embodiment, the first insulation cutting blades are mounted on the rod rather than the second insulation cutting blades and the first and second insulation cutting blades are directly adjacent to each other when the rod is extended. The operation of the second embodiment is essentially the same as the first except that the rod is retracted by the cylinder to strip the insulation from the insulated wire.
    • 线切割和绝缘剥离装置安装在手持式便携式电线包裹工具上,并且包括一对线切割刀片,第一和第二对绝缘切割刀片和诸如气缸或螺线管的气缸, 延伸和缩回杆。 在第一实施例中,当切割杆缩回时,线切割刀片和第一绝缘切割刀片安装在圆筒上,第二绝缘切割刀片安装在杆上,第一和第二绝缘切割刀片彼此直接相邻。 在操作中,绝缘线插入在线切割刀片与第一和第二绝缘切割刀片之间。 这切断绝缘。 然后关闭线切割刀片以切割绝缘线,然后延伸杆以使第二绝缘切割刀片离开第一绝缘切割刀片。 这会从绝缘电线上剥下绝缘层。 在第二实施例中,第一绝缘切割刀片安装在杆而不是第二绝缘切割刀片上,并且当杆延伸时,第一和第二绝缘切割刀片彼此直接相邻。 第二实施例的操作基本上与第一实施例相同,除了杆被气缸缩回以从绝缘电线剥离绝缘体。
    • 14. 发明授权
    • Method of isothermally heating articles with radiation
    • 用辐射等温加热制品的方法
    • US3879164A
    • 1975-04-22
    • US48768974
    • 1974-07-11
    • WESTERN ELECTRIC CO
    • HALDOPOULOS PETERJAYACHANDRA YEMMANUR
    • F26B3/30F26B3/28
    • F26B3/30
    • To uniformly heat a surface with a source of radiation, the surface having varying thermal heating characteristics in response to irradiation, a filter having radiation absorption characteristics which vary in accordance with the thermal heating characteristics of the surface is positioned between the surface and the source of radiation, such that areas of the filter which have a maximum radiation absorption characteristic overlie areas of the surface which experience maximum thermal heating in response to radiation, and vice versa. Radiation passing through the filter and impinging on the surface is modulated in accordance with the thermal heating characteristics of the surface to uniformly, or isothermally, heat the surface.
    • 为了均匀地加热具有辐射源的表面,该表面响应于照射具有不同的热加热特性,具有根据表面的热加热特性变化的辐射吸收特性的过滤器位于表面和源的 使得具有最大辐射吸收特性的滤波器的区域覆盖表面的响应于辐射而经历最大热加热的区域,反之亦然。 通过过滤器并撞击在表面上的辐射根据表面的热加热特性进行调制以均匀地或等温地加热表面。
    • 17. 发明授权
    • Method of depositing a metal on a surface of a substrate
    • 在基板的表面上沉积金属的方法
    • US3873360A
    • 1975-03-25
    • US38884473
    • 1973-08-16
    • WESTERN ELECTRIC CO
    • LANDO DAVID JACOB
    • C23C18/16C23C18/28H05K3/18B44D1/18B32B15/00
    • C23C18/30C23C18/1608H05K3/182
    • A method of depositing a metal on a surface of a substrate is disclosed. A suitable colloidal sensitizing solution, comprising insoluble hydrous oxide particles, selected from among solutions revealed in application Ser. No. 8,022, filed Feb. 2, 1970, is applied to a surface of a substrate. The sensitized substrate surface is then treated with a suitable redox agent to delineate a pattern capable of reducing an activating metal ion to an activating metal. Alternatively, a positive colloidal sensitizing solution, i.e., a solution comprising ions capable of reducing an activating metal ion to an activating metal is applied to the surface and the sensitized surface is then treated with an activating metal ion containing solution to deposit an activating metal pattern thereon. Alternatively, a colloidal activating metal solution is applied to the surface and the surface is then treated with a solution comprising an ion capable of reducing an activating metal ion to deposit an activating metal pattern thereon.
    • 公开了一种在衬底的表面上沉积金属的方法。 一种合适的胶体敏化溶液,其包含不溶性水合氧化物颗粒,其选自应用Ser。 1970年2月2日提交的No.8,022被应用于基板的表面。 然后用合适的氧化还原剂处理致敏底物表面,以描绘能够将活化金属离子还原成活化金属的图案。 或者,将正性胶体致敏溶液,即包含能够将活化金属离子还原成活化金属的离子的溶液施加到表面,然后用活化金属离子溶液处理敏化表面以沉积激活金属图案 上。 或者,将胶体活化金属溶液施加到表面,然后用包含能够还原活化金属离子的离子的溶液处理表面以在其上沉积激活金属图案。
    • 18. 发明授权
    • Method of depositing a metal on a surface of a substrate
    • 在基板的表面上沉积金属的方法
    • US3873357A
    • 1975-03-25
    • US38886673
    • 1973-08-16
    • WESTERN ELECTRIC CO
    • LANDO DAVID JACOB
    • C23C18/16C23C18/28H05K3/18B44D1/18
    • H05K3/182C23C18/1608C23C18/30Y10T428/24917
    • A method of depositing a metal on a surface of a substrate is disclosed. A suitable colloidal sensitizing soltuion, comprising insoluble hydrous oxide particles, selected from among solutions revealed in application Ser. No. 8,022, filed Feb. 2, 1970, is applied to a surface of a substrate. The sensitized substrate surface is then treated with a suitable redox agent to delineate a pattern capable of reducing an activating metal ion to an activating metal. Alternatively, a positive colloidal sensitizing solution, i.e., a solution comprising ions capable of reducing an activating metal ion to an activating metal is applied to the surface and the sensitized surface is then treated with an activating metal ion containing solution to deposit an activating metal pattern thereon. Alternatively, a colloidal activating metal solution is applied to the surface and the surface is then treated with a solution comprising an ion capable of reducing an activating metal ion to deposit an activating metal pattern thereon.
    • 公开了一种在衬底的表面上沉积金属的方法。 一种合适的胶体致敏溶液,其包含不溶性水合氧化物颗粒,其选自应用Ser。 1970年2月2日提交的No.8,022被应用于基板的表面。 然后用合适的氧化还原剂处理致敏底物表面,以描绘能够将活化金属离子还原成活化金属的图案。 或者,将正性胶体致敏溶液,即包含能够将活化金属离子还原成活化金属的离子的溶液施加到表面,然后用活化金属离子溶液处理敏化表面以沉积激活金属图案 上。 或者,将胶体活化金属溶液施加到表面,然后用包含能够还原活化金属离子的离子的溶液处理表面以在其上沉积激活金属图案。
    • 20. 发明授权
    • Test probe for integrated circuit chips
    • 集成电路板测试探针
    • US3867698A
    • 1975-02-18
    • US43831874
    • 1974-01-31
    • WESTERN ELECTRIC CO
    • BELTZ RICHARD KHURST JERRY C
    • G01R1/073G01R31/28G01R1/06G01R31/02
    • G01R1/07342G01R31/2886
    • A test probe for semiconductor chips is made, starting with a generally flat array of converging sets of leads, whose outer ends are attached to a frame via expansion elements and whose inner ends are attached to each other. In this lead array, there is formed a pyramidal protrusion consisting of the attached inner ends and the portions of the leads nearest thereto. Other lead portions are then embedded in the surface of a plastic frame. Next, the outer ends of the leads are severed from the expansion elements, and the inner ends are severed from each other. The outer lead ends constitute the contacts between the probe and associated external test equipment, while the pyramidally protruding inner lead ends constitute the probe fingers for contacting the semiconductor chips. Preferably, a second protrusion, which provides a pedestal for pyramidal protrusion, is also formed in the lead array. In that case, lead portions forming the pedestal are also embedded in the plastic frame surface. The lead displacements involved in forming the two protrusions are accompanied by compensating movements of the expansion elements, thereby preventing stretching of the leads themselves.
    • 制造用于半导体芯片的测试探针,从大致平坦的会聚的引线组开始,其外端经由膨胀元件附接到框架并且其内端彼此附接。 在该引线阵列中,形成有由附接的内端和最靠近的引线的部分组成的金字塔形突起。 然后将其它引线部分嵌入在塑料框架的表面中。 接下来,引线的外端从膨胀元件断开,并且内端彼此断开。 外引线端构成探针与相关的外部测试设备之间的接触,而锥形突出的内引线端构成用于接触半导体芯片的探针。