专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

US20160226260A1 BATTERY-DRIVEN ELECTRONIC DEVICE 有权
标题翻译：电池驱动电子设备
公开(公告)号：US20160226260A1
公开(公告)日：2016-08-04
申请号：US14789695
申请日：2015-07-01
申请人： UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
发明人： HANN-DONG WU
IPC分类号： H02J7/00
CPC分类号： G06F1/30 , G06F1/3212 , H02J7/0031 , H02J7/0063 , H02J2007/004 , H02J2007/0067 , Y02D10/174
摘要： A battery-driven electronic device includes a battery for outputting a battery voltage, a plurality of loads, a system unit, and a battery energy manager which is electrically connected with the battery, the loads and the system unit. The battery energy manager is adapted for detecting the battery voltage and set with a cutoff threshold, and a low-voltage threshold higher than the cutoff threshold. When the battery voltage is equal to or lower than the low-voltage threshold, the battery energy manager stops supplying power from the battery to at least one of the loads, and outputs a suspension command for the system unit to perform suspension process. When the battery voltage is equal to or lower than the cutoff threshold, the battery energy manager stops supplying power to the loads and the system unit.
摘要翻译：电池驱动的电子设备包括用于输出电池电压的电池，多个负载，系统单元和与电池，负载和系统单元电连接的电池能量管理器。电池能量管理器适于检测电池电压并设置有截止阈值，以及高于截止阈值的低电压阈值。当电池电压等于或低于低电压阈值时，电池能量管理器停止从电池向至少一个负载供电，并输出系统单元的暂停命令以进行暂停处理。当电池电压等于或低于截止阈值时，电池能量管理器停止向负载和系统单元供电。

12. 发明申请

US20160212863A1 HOUSING ASSEMBLY AND SOLID STATE DRIVE HAVING THE SAME 有权
标题翻译：外壳组件和固体驱动装置
公开(公告)号：US20160212863A1
公开(公告)日：2016-07-21
申请号：US14689556
申请日：2015-04-17
申请人： UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
发明人： Chun-Chi YIN , Dao-Wei FAN
IPC分类号： H05K5/00 , H05K5/02
CPC分类号： H05K5/006 , H05K5/0004 , H05K5/0217 , H05K5/0221 , H05K5/026
摘要： A housing assembly, including a top housing, a bottom housing and an accommodation, is provided. The top housing has a top plate, and a first sidewall extending therefrom. The bottom housing has a bottom plate, and a second sidewall extending therefrom. The engagement slit is defined by an upper edge and a lower edge in order to mate with a printed circuit board. The second sidewall includes an inclination wall extending from the lower edge of the engagement slit and distancing from the accommodation outwardly and downwardly, and an slot being adjacent to the inclination wall. The first sidewall includes a fringe protrusion, which slides along the inclination wall of the second sidewall to engage with a distal end of the inclination wall, and the top housing connects to the bottom housing thereby. The housing assembly is advantageous of easy and convenient assembly and disassembly.
摘要翻译：提供了包括顶部壳体，底部壳体和容纳物的壳体组件。顶部壳体具有顶板和从其延伸的第一侧壁。底部壳体具有底板和从其延伸的第二侧壁。接合狭缝由上边缘和下边缘限定，以便与印刷电路板配合。第二侧壁包括从接合狭缝的下边缘延伸并从外壳向外和向下偏离的倾斜壁，以及与倾斜壁相邻的槽。第一侧壁包括边缘突起，其沿着第二侧壁的倾斜壁滑动以与倾斜壁的远端接合，并且顶部壳体由此连接到底部壳体。外壳组件有利于易于方便的组装和拆卸。

13. 发明申请

US20160188348A1 SMART MODULE CARD AND USING METHOD THEREOF 有权
标题翻译：智能模块卡及其使用方法
公开(公告)号：US20160188348A1
公开(公告)日：2016-06-30
申请号：US14662324
申请日：2015-03-19
申请人： UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.
发明人： CHIN-HSING HUNG , CHIN-YANG CHANG , CHUN-HSUAN SHIH
IPC分类号： G06F9/44 , G06F13/40 , G06F13/38 , G06F3/06
CPC分类号： G06F9/4411 , G06F3/0625 , G06F3/0653 , G06F3/0679 , G06F9/4403 , G06F13/385 , G06F13/4081
摘要： A smart module card and using method thereof are provided. The smart module card can be implemented in a peripheral platform having a transmitting port. The smart module includes a connecting port and a processing unit electrically connected thereto. The connecting port corresponds to the transmitting port, and the processing unit includes a plurality of functional chips. When the connecting port is electrically connected to the transmitting port, the processing unit receives an identification data provided by the peripheral platform to determine a plurality of predetermined operating functions required by the peripheral platform to be enabled, and the processing unit executes some of the functional chips to correspondingly enable the predetermined operating functions.
摘要翻译：提供了智能模块卡及其使用方法。智能模块卡可以在具有发送端口的外围平台中实现。智能模块包括连接端口和与其电连接的处理单元。连接端口对应于发送端口，并且处理单元包括多个功能芯片。当连接端口与发送端口电连接时，处理单元接收由外围平台提供的识别数据，以确定外围平台所需的多个预定的操作功能，并且处理单元执行一些功能芯片以相应地实现预定的操作功能。

14. 发明申请

US20160035206A1 MOTION MONITORING METHOD AND DEVICE 有权
标题翻译：运动监测方法和装置
公开(公告)号：US20160035206A1
公开(公告)日：2016-02-04
申请号：US14536181
申请日：2014-11-07
申请人： Universal Scientific Industrial (Shanghai) Co., Ltd.
发明人： Huang-Chi PAI , Jung-Hui PAI
IPC分类号： G08B21/04
CPC分类号： G08B21/0446 , A61B1/00 , A61B5/0002 , A61B5/0205 , A61B5/1117 , G06K1/00 , G08B21/0415 , G08B21/043
摘要： Provided is a motion monitoring method for monitoring a user's motion state with a motion monitoring device, sending an alert signal from the motion monitoring device to remind the user and displaying user data for recognizing the user when the motion monitoring device detects that the user's motion state does not generate any variation within a predetermined period of time or a generated variation is less than a standard value, and sending a distress signal from the motion monitoring device to specific and/or nonspecific persons if the alert signal is not turned off after the motion monitoring device having sent the alert signal continuously for a while, so as to lend a helping hand to the user as soon as possible.
摘要翻译：提供了一种运动监视方法，用于利用运动监视装置监视用户的运动状态，当运动监视装置检测到用户的运动状态时，从运动监视装置发送警报信号以提醒用户并显示用于识别用户的用户数据在预定时间段内不产生任何变化或产生的变化小于标准值，并且如果警报信号在运动之后没有关闭，则将运动监控设备的遇险信号发送到特定和/或非特定人员监视装置已经连续发送警报信号一段时间，以便尽快向用户提供帮助。

15. 发明申请

US20150214075A1 MANUFACTURING METHOD OF SELECTIVE ELECTRONIC PACKAGING DEVICE 审中-公开
标题翻译：选择性电子包装装置的制造方法
公开(公告)号：US20150214075A1
公开(公告)日：2015-07-30
申请号：US14246114
申请日：2014-04-06
申请人： UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
发明人： JEN-CHUN CHEN , SHIH-CHIEN CHEN , PAI-SHENG CHENG
IPC分类号： H01L21/56
CPC分类号： H01L21/56 , H01L2224/16227 , H01L2224/48227 , H01L2924/1421 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025
摘要： A manufacturing method of selective electronic packaging device includes the following. A plurality of electronic components is disposed on a surface of a substrate. A photo-sensitive resin material is formed on the surface of the substrate. UV-light is irradiated to the photo-sensitive resin material to form an embankment structure. An encapsulating material is filled a protective area surrounded by the embankment structure. The encapsulating material covers at least one electronic component. The encapsulating material is solidified to form an encapsulating member, and the encapsulating member covers at least one electronic component.
摘要翻译：选择性电子包装装置的制造方法包括以下。多个电子部件设置在基板的表面上。在基板的表面上形成感光树脂材料。紫外线照射到感光树脂材料上以形成路堤结构。封装材料填充有由路堤结构包围的保护区域。封装材料覆盖至少一个电子部件。封装材料固化以形成封装构件，并且封装构件覆盖至少一个电子部件。

16. 发明授权

US09089046B2 Electronic module and method for same 有权
标题翻译：电子模块及方法相同
公开(公告)号：US09089046B2
公开(公告)日：2015-07-21
申请号：US13747979
申请日：2013-01-23
申请人： UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD. , UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
发明人： Jen-Chun Chen , Pai-Sheng Shih , Hsin-Chin Chang
IPC分类号： H05K1/18 , H05K9/00 , H05K3/10 , H05K1/02 , H05K3/28 , H01L23/31 , H01L23/498 , H01L23/552 , H01L25/16 , H01L23/00
CPC分类号： H05K9/002 , H01L23/3121 , H01L23/49805 , H01L23/49811 , H01L23/552 , H01L23/562 , H01L25/16 , H01L2224/16 , H01L2224/16227 , H01L2224/48227 , H01L2924/1815 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K3/107 , H05K3/284 , H05K9/0037 , H05K2201/0715 , H05K2201/0919 , H05K2201/09509 , H05K2203/1316
摘要： An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane. The electronic components are mounted on the first plane and electrically connected with the circuit board. The molding layers cover the electronic components and the first plane. The trench appears between two adjacent molding layers. The grounding pad is positioned at the bottom of the trench. The first conductive layer covers the sidewall of the trench and the grounding pad. The grounding pad electrically connected with the first conductive layer. The insulating filler is positioned in the trench. The second conductive layer covers the molding layers and the insulating filler, and electrically connects with the first conductive layer.
摘要翻译：电子模块包括电路板，多个电子部件，多个成型层，至少一个第一导电层，至少一个绝缘填料和一个第二导电层。电路板具有第一平面和在第一平面上的至少一个接地垫。电子部件安装在第一平面上并与电路板电连接。成型层覆盖电子部件和第一平面。沟槽出现在两个相邻的成型层之间。接地垫位于沟槽的底部。第一导电层覆盖沟槽的侧壁和接地垫。接地垫与第一导电层电连接。绝缘填料位于沟槽中。第二导电层覆盖模制层和绝缘填料，并与第一导电层电连接。

17. 发明申请

US20140366829A1 STARTER PROTECTOR HAVING DELAY CIRCUIT, DELAY CIRCUIT THEREOF AND MOBILE VEHICLE 审中-公开
标题翻译：具有延迟电路，延迟电路和移动车辆的起动保护器
公开(公告)号：US20140366829A1
公开(公告)日：2014-12-18
申请号：US14261052
申请日：2014-04-24
申请人： UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD. , UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
发明人： HSIN-HUNG WU
IPC分类号： H02H7/20
CPC分类号： F02N11/10 , F02N11/08 , F02N11/087 , F02N11/106 , F02N2011/0874 , F02N2300/2011
摘要： A delay circuit is coupled to an electromagnetic coil and includes a power input end coupled to a first end of the electromagnetic coil, a first switch module coupled to the power input end, a second switch module coupled to a second end of the electromagnetic coil, a first timing module coupled to the power input end and the first switch module, and a second timing module coupled to the power input end and the second switch module. The second switch module turns on when the power input end supplies power. The first timing module is configured to count time when the power input end supplies power and turns on the first switch module after a first predetermined time. The second timing module is configured to count time after the first switch module turns on and turns on the second switch module after a second predetermined time.
摘要翻译：延迟电路耦合到电磁线圈并且包括耦合到电磁线圈的第一端的功率输入端，耦合到电力输入端的第一开关模块，耦合到电磁线圈的第二端的第二开关模块，耦合到电力输入端和第一开关模块的第一定时模块，以及耦合到电力输入端和第二开关模块的第二定时模块。电源输入端供电时，第二个开关模块接通。第一定时模块被配置为计算电力输入端提供电力的时间，并且在第一预定时间之后接通第一开关模块。第二定时模块被配置为对第一开关模块接通之后的时间进行计数，并且在第二预定时间之后接通第二开关模块。

18. 发明申请

US20140159819A1 ELECTRONIC SYSTEM, RF POWER AMPLIFIER AND OUTPUT POWER COMPENSATION METHOD THEREOF 有权
标题翻译：电子系统，射频功率放大器及其输出功率补偿方法
公开(公告)号：US20140159819A1
公开(公告)日：2014-06-12
申请号：US13750164
申请日：2013-01-25
申请人： Universal Scientific Industrial (Shanghai) Co., Ltd. , UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
发明人： JAW-MING DING , WEI-HSUAN LEE
IPC分类号： H03F3/19 , H03F3/21
CPC分类号： H03F3/21 , H03F1/0272 , H03F3/19 , H03F3/245 , H03F3/3066
摘要： A radio frequency (RF) power amplifier is disclosed. The power amplifier includes an output stage circuit, an exponential type bias circuit and a voltage-current transformation circuit. The output stage circuit receives a first system voltage and outputs an output current. The exponential type bias circuit receives a bias current, wherein a relationship between the bias current and output current is exponential, and when the bias current is zero current, and the output current is zero current. The voltage-current transformation circuit transforms the first system voltage into a second current so that the bias current is in proportion to the first system voltage, and thus the relationship between the output current and the first system voltage is exponential. The bias current is equal to times of the sum of the first current and the second current.
摘要翻译：公开了射频（RF）功率放大器。功率放大器包括输出级电路，指数型偏置电路和电压 - 电流变换电路。输出级电路接收第一系统电压并输出输出电流。指数型偏置电路接收偏置电流，其中偏置电流和输出电流之间的关系为指数，当偏置电流为零电流时，输出电流为零电流。电压 - 电流变换电路将第一系统电压转换成第二电流，使得偏置电流与第一系统电压成比例，因此输出电流与第一系统电压之间的关系是指数的。偏置电流等于第一电流和第二电流之和的次数。

19. 发明授权

US08742573B2 Package structure and manufacturing method thereof 有权
标题翻译：包装结构及其制造方法
公开(公告)号：US08742573B2
公开(公告)日：2014-06-03
申请号：US13744033
申请日：2013-01-17
申请人： Universal Scientific Industrial (Shanghai) Co., Ltd. , Universal Global Scientific Industrial Co., Ltd.
发明人： Jenchun Chen , Hsin Chin Chang
IPC分类号： H01L23/34
CPC分类号： H01L21/82 , H01L21/561 , H01L23/3135 , H01L23/5384 , H01L23/5389 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/97 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/12042 , H01L2924/19105 , H01L2924/00012 , H01L2224/81 , H01L2924/00
摘要： A package structure comprises a substrate, a plurality of first electronic components, at least a second electronic component, a first covering layer and a wiring layer. A surface of the substrate includes a first region and a second region. The first electronic components are disposed in the first region, wherein at least one of the first electronic components has a first conductive contact. The second electronic component is disposed in the second region. The first covering layer includes a recess and a first exposing region for exposing the first conductive contact. The wiring layer is formed on the recess and electronically coupled to the first conductive contact.
摘要翻译：封装结构包括基板，多个第一电子部件，至少第二电子部件，第一覆盖层和布线层。衬底的表面包括第一区域和第二区域。第一电子部件设置在第一区域中，其中第一电子部件中的至少一个具有第一导电接触。第二电子部件设置在第二区域中。第一覆盖层包括凹部和用于暴露第一导电接触件的第一曝光区域。布线层形成在凹槽上并电耦合到第一导电接触。

20. 发明申请

US20140126161A1 ELECTRONIC PACAKGE MODULE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电子PACAKGE模块及其制造方法
公开(公告)号：US20140126161A1
公开(公告)日：2014-05-08
申请号：US13745766
申请日：2013-01-19
申请人： UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD. , UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
发明人： JEN-CHUN CHEN , HSIN-CHIN CHANG
IPC分类号： H05K3/30 , H05K1/18
CPC分类号： H05K1/186 , H01L23/3135 , H01L23/552 , H01L25/16 , H01L2224/48091 , H01L2924/0002 , H01L2924/1531 , H01L2924/181 , H05K3/284 , H05K3/30 , H05K2201/1056 , H05K2203/1316 , H05K2203/1327 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.
摘要翻译：电子封装模块包括具有支撑表面的电路板，至少一个第一电子部件，至少一个第二电子部件和至少一个模制化合物。第一和第二电子部件安装在支撑表面上。模制化合物设置在支撑表面上并且部分地覆盖支撑表面。模制化合物封装第一电子部件而不是第二电子部件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式