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11. 发明申请

US20050191004A1 Opto-electronic integrated circuit device, opto-electronic integrated circuit system and transmission method 有权
标题翻译：光电集成电路器件，光电集成电路系统及传输方式
公开(公告)号：US20050191004A1
公开(公告)日：2005-09-01
申请号：US11062663
申请日：2005-02-23
申请人： Masataka Hosino , Tomotoshi Sato
发明人： Masataka Hosino , Tomotoshi Sato
IPC分类号： G02B6/42 , G02B6/122 , H01L31/12 , H04B10/27 , H04B10/29 , H04B10/80 , H04J14/02 , H04Q11/00 , G02B6/12
CPC分类号： H04Q11/0005 , H01L2224/16225 , H04Q2011/0058
摘要： The opto-electronic integrated circuit device comprises an optical switch 18 provided in an input port 12a of a first input/output port 36a over a substrate 10 and changing over an optical path of an optical signal inputted from the input port 12a and outputting the optical signal through one of a plurality of output terminals 24a-24d; an opto-electric conversion element 26a optically connected to one of the plural output terminals of the optical switch 18, and converting the optical signal outputted from one of the output terminals 24a-24d of the optical switch 18 to an electric signal and inputting the converted electric signal in a semiconductor element 30 mounted over the substrate 10; and an optical waveguide 50 optically connected to another of the plural output terminal 24d of the optical switch 18 and outputting the optical signal outputted from said another output terminal 24d of the optical switch 18 through an output port 32b of a second input/output port 36b over the substrate 10.
摘要翻译：光电集成电路装置包括设置在基板10上的第一输入/输出端口36a的输入端口12a中的光开关18，并且改变从输入端口12a输入的光信号的光路，通过多个输出端子24a--24d中的一个输出光信号; 光电转换元件26，光学连接到光开关18的多个输出端之一，并将从光开关18的输出端子24a至24d之一输出的光信号转换为电信号，在安装在基板10上的半导体元件30中输入转换后的电信号; 以及与光开关18的多个输出端子24d的另一个光学连接的光波导路50，并通过第二输入/输出端口的输出端口32b输出从光开关18的另一输出端子24d输出的光信号，输出端口36b。

12. 发明授权

US06441500B1 Semiconductor device having resin members provided separately corresponding to externally connecting electrodes 失效
标题翻译：具有与外部连接电极分开设置的树脂部件的半导体装置
公开(公告)号：US06441500B1
公开(公告)日：2002-08-27
申请号：US09660477
申请日：2000-09-12
申请人： Masato Sumikawa , Kazumi Tanaka , Tomotoshi Sato
发明人： Masato Sumikawa , Kazumi Tanaka , Tomotoshi Sato
IPC分类号： H01L2940
CPC分类号： H01L24/10 , H01L24/13 , H01L2224/02125 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/05548 , H01L2224/05569 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/94 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19043 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2224/03 , H01L2224/11
摘要： A semiconductor device having a plurality of externally connecting electrodes arranged on a semiconductor chip includes on-chip electrodes, resin members formed separately from each other and provided corresponding to the plurality of externally connecting electrodes, and interconnections connecting the corresponding on-chip electrode and the corresponding externally connecting electrode. Such separately formed resin members for the externally connecting electrodes allow relaxation of thermal stress produced in the externally connecting electrodes.
摘要翻译：布置在半导体芯片上的具有多个外部连接电极的半导体器件包括：片上电极，与多个外部连接电极相对应设置的彼此分开形成的树脂部件，以及连接相应的片上电极和相应的外部连接电极。用于外部连接电极的这种单独形成的树脂构件允许释放在外部连接电极中产生的热应力。

13. 发明申请

US20180139386A1 SERVICE SYSTEM, INFORMATION PROCESSING APPARATUS, AND SERVICE PROVIDING METHOD 审中-公开
公开(公告)号：US20180139386A1
公开(公告)日：2018-05-17
申请号：US15869953
申请日：2018-01-12
申请人： Satoshi MITSUI , Kei KUSHIMOTO , Kohichi NISHIDE , Tomotoshi SATO
发明人： Satoshi MITSUI , Kei KUSHIMOTO , Kohichi NISHIDE , Tomotoshi SATO
IPC分类号： H04N5/232 , H04N21/81 , H04N21/45 , H04N21/4223 , H04N21/2743 , H04N1/00 , H04N21/258 , H04N1/21 , H04N5/225
CPC分类号： H04N5/23238 , H04N1/00103 , H04N1/00244 , H04N1/2112 , H04N1/32128 , H04N5/2258 , H04N5/23229 , H04N21/25841 , H04N21/2743 , H04N21/4223 , H04N21/4524 , H04N21/812 , H04N21/816 , H04N2201/3247 , H04N2201/3252 , H04N2201/3273 , H04N2201/3278
摘要： A service system includes a mobile terminal and an information processing device capable of communication via a network. The mobile terminal includes a first transmission unit that transmits spherical images taken in respective imaging locations and positional information about the imaging locations to the information processing device. The information processing device includes a reception unit that receives the spherical images transmitted by the first transmission unit; a map data obtaining unit that obtains map data from a map data storage, the map data including the imaging locations of the spherical images; a path information creation unit that creates information about a path made by connecting the imaging locations in the map data obtained by the map data obtaining unit; and a content providing unit that makes content available for a request through the network, the content including the map data, the information about the path, and the spherical images.

14. 发明申请

US20050116330A1 Semiconductor module and method for mounting the same 失效
标题翻译：半导体模块及其安装方法
公开(公告)号：US20050116330A1
公开(公告)日：2005-06-02
申请号：US10985848
申请日：2004-11-10
申请人： Rina Murayama , Tomotoshi Sato
发明人： Rina Murayama , Tomotoshi Sato
IPC分类号： H01L25/18 , H01L23/538 , H01L25/065 , H01L25/07 , H05K1/18 , H01L23/02 , H01L21/48
CPC分类号： H01L23/5385 , H01L2224/16225 , H01L2924/3011 , H05K1/189
摘要： A semiconductor module that can realize a substantially fixed transmission time of signals transmitted through electric wirings disposed on a board via each semiconductor device mounted on a board and can reduce reflection of high-frequency signals and a method for mounting the same is provided. A plurality of semiconductor devices are mounted on a flexible board, and a semiconductor module is formed by folding the board so that the plurality of semiconductor devices are stacked. In an input signal line electrically and mechanically connected to each of the semiconductor devices and an output signal line electrically and mechanically connected to each of the semiconductor devices which signal lines are formed on the board, the sum of a first line length of the input signal line and a second line length of the output signal line for each of the semiconductor devices is set to a substantially fixed length.
摘要翻译：提供一种半导体模块，其可以实现通过安装在板上的每个半导体器件布置在电路板上的电气布线传输的信号的基本上固定的传输时间，并且可以减少高频信号的反射及其安装方法。多个半导体器件安装在柔性板上，并且通过折叠板来形成半导体模块，使得多个半导体器件堆叠。在电气和机械连接到每个半导体器件的输入信号线中，以及电和机械地连接到在板上形成信号线的每个半导体器件的输出信号线，输入信号的第一线路长度之和并且每个半导体器件的输出信号线的第二线长度被设定为基本上固定的长度。

15. 发明申请

US20200382701A1 SERVICE SYSTEM, INFORMATION PROCESSING APPARATUS, AND SERVICE PROVIDING METHOD 审中-公开
公开(公告)号：US20200382701A1
公开(公告)日：2020-12-03
申请号：US16995328
申请日：2020-08-17
申请人： Satoshi MITSUI , Kei KUSHIMOTO , Kohichi NISHIDE , Tomotoshi SATO
发明人： Satoshi MITSUI , Kei KUSHIMOTO , Kohichi NISHIDE , Tomotoshi SATO
IPC分类号： H04N5/232 , H04N21/2743 , H04N21/4223 , H04N21/81 , H04N1/00 , H04N1/21 , H04N21/258 , H04N21/45 , H04N1/32
摘要： A service system includes a mobile terminal and an information processing device capable of communication via a network. The mobile terminal includes a first transmission unit that transmits spherical images taken in respective imaging locations and positional information about the imaging locations to the information processing device. The information processing device includes a reception unit that receives the spherical images transmitted by the first transmission unit; a map data obtaining unit that obtains map data from a map data storage, the map data including the imaging locations of the spherical images; a path information creation unit that creates information about a path made by connecting the imaging locations in the map data obtained by the map data obtaining unit; and a content providing unit that makes content available for a request through the network, the content including the map data, the information about the path, and the spherical images.

16. 发明申请

US20190253627A1 SERVICE SYSTEM, INFORMATION PROCESSING APPARATUS, AND SERVICE PROVIDING METHOD 审中-公开
公开(公告)号：US20190253627A1
公开(公告)日：2019-08-15
申请号：US16395721
申请日：2019-04-26
申请人： Satoshi MITSUI , Kei KUSHIMOTO , Kohichi NISHIDE , Tomotoshi SATO
发明人： Satoshi MITSUI , Kei KUSHIMOTO , Kohichi NISHIDE , Tomotoshi SATO
IPC分类号： H04N5/232 , H04N1/21 , H04N21/45 , H04N1/00 , H04N21/258 , H04N21/81 , H04N21/4223 , H04N21/2743 , H04N1/32
CPC分类号： H04N5/23238 , H04N1/00103 , H04N1/00244 , H04N1/2112 , H04N1/32128 , H04N5/2258 , H04N5/23229 , H04N21/25841 , H04N21/2743 , H04N21/4223 , H04N21/4524 , H04N21/812 , H04N21/816 , H04N2201/3247 , H04N2201/3252 , H04N2201/3273 , H04N2201/3278
摘要： A service system includes a mobile terminal and an information processing device capable of communication via a network. The mobile terminal includes a first transmission unit that transmits spherical images taken in respective imaging locations and positional information about the imaging locations to the information processing device. The information processing device includes a reception unit that receives the spherical images transmitted by the first transmission unit; a map data obtaining unit that obtains map data from a map data storage, the map data including the imaging locations of the spherical images; a path information creation unit that creates information about a path made by connecting the imaging locations in the map data obtained by the map data obtaining unit; and a content providing unit that makes content available for a request through the network, the content including the map data, the information about the path, and the spherical images.

17. 发明授权

US09906720B2 Service system, information processing apparatus, and service providing method 有权
公开(公告)号：US09906720B2
公开(公告)日：2018-02-27
申请号：US14955699
申请日：2015-12-01
申请人： Satoshi Mitsui , Kei Kushimoto , Kohichi Nishide , Tomotoshi Sato
发明人： Satoshi Mitsui , Kei Kushimoto , Kohichi Nishide , Tomotoshi Sato
IPC分类号： H04N5/232 , H04N21/2743 , H04N21/4223 , H04N21/81 , H04N1/00 , H04N1/21 , H04N21/258 , H04N21/45 , H04N5/225
CPC分类号： H04N5/23238 , H04N1/00103 , H04N1/00244 , H04N1/2112 , H04N1/32128 , H04N5/2258 , H04N5/23229 , H04N21/25841 , H04N21/2743 , H04N21/4223 , H04N21/4524 , H04N21/812 , H04N21/816 , H04N2201/3247 , H04N2201/3252 , H04N2201/3273 , H04N2201/3278
摘要： A service system includes a mobile terminal and an information processing device capable of communication via a network. The mobile terminal includes a first transmission unit that transmits spherical images taken in respective imaging locations and positional information about the imaging locations to the information processing device. The information processing device includes a reception unit that receives the spherical images transmitted by the first transmission unit; a map data obtaining unit that obtains map data from a map data storage, the map data including the imaging locations of the spherical images; a path information creation unit that creates information about a path made by connecting the imaging locations in the map data obtained by the map data obtaining unit; and a content providing unit that makes content available for a request through the network, the content including the map data, the information about the path, and the spherical images.

18. 发明申请

US20160165136A1 SERVICE SYSTEM, INFORMATION PROCESSING APPARATUS, AND SERVICE PROVIDING METHOD 有权
标题翻译：服务系统，信息处理设备和服务提供方法
公开(公告)号：US20160165136A1
公开(公告)日：2016-06-09
申请号：US14955699
申请日：2015-12-01
申请人： Satoshi MITSUI , Kei KUSHIMOTO , Kohichi NISHIDE , Tomotoshi SATO
发明人： Satoshi MITSUI , Kei KUSHIMOTO , Kohichi NISHIDE , Tomotoshi SATO
IPC分类号： H04N5/232 , H04N21/4223 , H04N21/2668 , H04N1/21 , H04N21/858 , G06T17/05 , H04N1/00 , H04N21/258 , H04N21/2743 , H04N21/81
CPC分类号： H04N5/23238 , H04N1/00103 , H04N1/00244 , H04N1/2112 , H04N1/32128 , H04N5/2258 , H04N5/23229 , H04N21/25841 , H04N21/2743 , H04N21/4223 , H04N21/4524 , H04N21/812 , H04N21/816 , H04N2201/3247 , H04N2201/3252 , H04N2201/3273 , H04N2201/3278
摘要： A service system includes a mobile terminal and an information processing device capable of communication via a network. The mobile terminal includes a first transmission unit that transmits spherical images taken in respective imaging locations and positional information about the imaging locations to the information processing device. The information processing device includes a reception unit that receives the spherical images transmitted by the first transmission unit; a map data obtaining unit that obtains map data from a map data storage, the map data including the imaging locations of the spherical images; a path information creation unit that creates information about a path made by connecting the imaging locations in the map data obtained by the map data obtaining unit; and a content providing unit that makes content available for a request through the network, the content including the map data, the information about the path, and the spherical images.
摘要翻译：服务系统包括能够通过网络通信的移动终端和信息处理装置。移动终端包括第一传输单元，其将在各个成像位置拍摄的球形图像和关于成像位置的位置信息发送到信息处理设备。信息处理装置包括接收由第一传输单元发送的球形图像的接收单元; 地图数据获取单元，其从地图数据存储器获取地图数据，所述地图数据包括所述球形图像的成像位置; 路径信息创建单元，其创建关于通过在由地图数据获取单元获得的地图数据中连接成像位置而形成的路径的信息; 以及内容提供单元，其通过网络使内容可用于请求，所述内容包括地图数据，关于路径的信息和球形图像。

19. 发明授权

US07973877B2 Illumination device and liquid crystal display apparatus 有权
标题翻译：照明装置和液晶显示装置
公开(公告)号：US07973877B2
公开(公告)日：2011-07-05
申请号：US12087766
申请日：2007-01-12
申请人： Daisuke Takeda , Tomotoshi Sato , Akira Ohnishi
发明人： Daisuke Takeda , Tomotoshi Sato , Akira Ohnishi
IPC分类号： G02F1/1335 , H05B37/00 , F21V7/04 , F21V11/00 , B64F13/18
CPC分类号： H05B33/0821 , G02F1/133603 , G02F2001/133612 , H01L23/62 , H01L2924/0002 , H05B33/0818 , H01L2924/00
摘要： An object of the invention is to provide an illumination device that can make it easy to detect a disorder of a light emitting element, and a liquid crystal display apparatus including the illumination device. Each light emitting element array (S) is constituted by light emitting elements (T) which are connected in series. To the light emitting elements (T) are individually connected in parallel current bypass elements (U) that are changed from a disconnected state where no current flows to a connected state where current flows when a predetermined voltage higher than that applied to the light emitting elements in an lighting state is applied thereto. Each power source unit (P) is connected to each light emitting element array (S) in series, and supplies constant current to each light emitting element (T). Terminal units for voltage detection (11) are connected to an anode (A) of each light emitting element (T).
摘要翻译：本发明的目的是提供一种能够容易地检测发光元件的障碍的照明装置，以及包括该照明装置的液晶显示装置。每个发光元件阵列（S）由串联连接的发光元件（T）构成。发光元件（T）分别连接在并联电流旁路元件（U）中，该电流旁路元件（U）从没有电流流过的断开状态改变为当电流比施加到发光元件的电压高的电流时电流流动的连接状态处于照明状态。每个电源单元（P）串联连接到每个发光元件阵列（S），并且向每个发光元件（T）提供恒定电流。用于电压检测的端子单元（11）连接到每个发光元件（T）的阳极（A）。

20. 发明授权

US06482677B2 Chip component assembly manufacturing method 失效
标题翻译：芯片组件组装制造方法
公开(公告)号：US06482677B2
公开(公告)日：2002-11-19
申请号：US09955202
申请日：2001-09-19
申请人： Tomotoshi Sato , Tomonori Fujii
发明人： Tomotoshi Sato , Tomonori Fujii
IPC分类号： H01L2144
CPC分类号： H01L21/568 , H01L21/6835 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/16145 , H01L2224/83191 , H01L2225/06513 , H01L2225/06541 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068
摘要： A substrate of a semiconductor wafer, an insulating substrate or the like on which a circuit is formed is cut while being supported on a sheet, and thereafter, chip components obtained by the cutting are handled while being supported on the sheet. That is, in the state in which the substrate of a semiconductor wafer, an insulating substrate or the like on which a circuit is formed is supported on the sheet, a layer of a sealing material is formed on the substrate before cutting or the chip component after cutting. Each chip component is directly picked up from the sheet by being peeled off, and the chip components are successively stacked on the sheet. This enables the easy handling of even small-size thin chip components scarcely causing the damage and warp of the chip components and enables the correct stacking of the chip components.
摘要翻译：在其上形成有电路的半导体晶片，绝缘基板等的基板被切割，同时被支撑在片材上，然后通过切割获得的芯片部件被处理，同时被支撑在片材上。也就是说，在其上形成有电路的半导体晶片，绝缘基板等的基板被支撑在片材上的状态下，在切割之前在基板上形成密封材料层或芯片部件切割后通过剥离从片材直接拾取每个芯片部件，并且将芯片部件依次堆叠在片材上。这使得能够容易地处理甚至小尺寸的薄片组件，几乎不会导致芯片组件的损坏和翘曲，并且能够正确地堆叠芯片组件。

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