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11. 发明申请

US20130171804A1 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 有权
标题翻译：制造电子元件的方法
公开(公告)号：US20130171804A1
公开(公告)日：2013-07-04
申请号：US13820871
申请日：2011-09-14
申请人： Takeshi Saito , Tomomichi Takatsu
发明人： Takeshi Saito , Tomomichi Takatsu
IPC分类号： C09J11/06 , H01L21/78
CPC分类号： C09J11/06 , C08G18/673 , C08G18/792 , C08G18/8175 , C09D133/066 , C09J143/04 , C09J175/16 , H01L21/67132 , H01L21/78 , Y10T156/1052 , Y10T428/239 , Y10T428/24273 , Y10T428/24364 , Y10T428/28 , Y10T428/2809 , Y10T428/2891 , Y10T428/2907 , Y10T428/31855
摘要： Provided is a method for manufacturing electronic component improved in chip-holding efficiency, pickup efficiency and contamination resistance in a well-balanced manner, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer on the rear face of a wafer, a fixing step of fixing the semi-cured adhesive layer of the wafer on a ring frame with a cohesive sheet, a dicing step of dicing the wafer into semiconductor chips, a UV-irradiating step of irradiating ultraviolet ray, and a pick-up step of picking up the chips and semi-cured adhesive layers from the cohesive layer, wherein the cohesive sheet has a cohesive layer of a cohesive agent having a particular composition formed on one face of its base film.
摘要翻译：提供一种以均衡的方式制造提高了芯片保持效率，拾取效率和耐污染性的电子部件的方法，所述方法包括在后部形成半固化粘合剂层的半固化粘合剂层形成步骤将晶片的半固化粘合剂层固定在具有粘结片的环形框架上的定影步骤，将晶片切割成半导体芯片的切割步骤，照射紫外线的紫外线照射步骤和从内聚层拾取芯片和半固化粘合剂层的拾取步骤，其中粘合片材具有在其基膜的一个表面上形成的具有特定组成的粘结剂的内聚层。

12. 发明申请

US20120258572A1 ADHESIVE SHEET AND PRODUCTION METHOD FOR ELECTRONIC COMPONENT 审中-公开
标题翻译：电子元器件的粘合片和生产方法
公开(公告)号：US20120258572A1
公开(公告)日：2012-10-11
申请号：US13518055
申请日：2010-10-29
申请人： Tomomichi Takatsu
发明人： Tomomichi Takatsu
IPC分类号： C09J133/00 , H01L21/78 , C09J7/02
CPC分类号： H01L21/6836 , C08G18/672 , C08G18/8012 , C08G2170/40 , C09J7/38 , C09J151/06 , C09J2203/326 , C09J2433/00 , C09J2451/00 , H01L2221/6834 , Y10T428/2887 , C08G18/6225
摘要： Disclosed is an adhesive sheet that has a base film and an ultraviolet curable adhesive layered upon the base film. The ultraviolet curable adhesive includes 100 parts by mass of an acrylic ester copolymer with a weight-average molecular weight of at least one million, 20 to 200 parts by mass of a photopolymerizable acrylate having at least three carbon-carbon double bonds, and 0.1 to 10 parts by mass of an isocyanate curing agent. From among the monomers used during the copolymerization of the acrylic ester copolymer, a monomer having one or both of a hydroxyl group and a carboxyl group is included at no more than 0.1 mass %.
摘要翻译：公开了一种粘合片，其具有层叠在基膜上的基膜和紫外线固化型粘合剂。紫外线固化性粘合剂包括100质量份的重均分子量为至少100万的丙烯酸酯共聚物，20〜200质量份具有至少3个碳 - 碳双键的光聚合性丙烯酸酯和0.1〜 10质量份异氰酸酯固化剂。在丙烯酸酯共聚物的共聚合中使用的单体之中，含有羟基和羧基中的一个或两个的单体的含量不超过0.1质量％。

13. 发明申请

US20120000599A1 ADHESIVE AND ADHESIVE SHEET 有权
标题翻译：粘合和粘合片
公开(公告)号：US20120000599A1
公开(公告)日：2012-01-05
申请号：US13256801
申请日：2010-02-09
申请人： Tomomichi Takatsu , Masashi Kume
发明人： Tomomichi Takatsu , Masashi Kume
IPC分类号： B32B38/10 , C09J11/06 , B32B7/12 , C09J133/06
CPC分类号： C09J133/10 , C08L2205/02 , C08L2312/00 , C09J7/385 , C09J133/08 , C09J2203/326 , C09J2433/00 , H01L21/67132 , Y10T156/1052 , Y10T428/2878
摘要： Provided is a adhesive and an adhesive sheet which exhibit excellent chip-holding properties during dicing and from which chips can be easily stripped during pick up, even when considering changes over time. It is a adhesive composition which contains both (A) a (meth)acrylic acid ester copolymer component that has functional-group containing monomer units and a weight average molecular weight of less than 350,000 and (B) a (meth)acrylic ester copolymer component that has functional-group containing monomer units and a weight average molecular weight of 350,000 to 2,000,000 at a weight ratio of 10:90 to 90:10, and further contains 0.5 to 20 parts by mass of a crosslinking agent per 100 parts by mass of components (A) and (B) in total, the crosslinking agent being a crosslinking agent that reacts with both the functional groups of the component (A) and the functional groups of the component (B).
摘要翻译：提供了一种粘合剂和粘合片，其在切割期间表现出优异的切屑保持性能，并且即使考虑随时间的变化，芯片也可以在拾取期间容易地剥离。它是一种粘合剂组合物，其包含（A）具有含官能团的单体单元和重均分子量小于35万的（甲基）丙烯酸酯共聚物组分和（B）（甲基）丙烯酸酯共聚物组分具有含官能团的单体单元，重均分子量为35万〜200万，重量比为10:90〜90:10，进一步含有0.5〜20质量份交联剂，相对于100质量份组分（A）和（B），交联剂是与组分（A）的官能团和组分（B）的官能团反应的交联剂。

14. 发明申请

US20100240196A1 ADHESIVE, ADHESIVE SHEET, MULTI-LAYERED ADHESIVE SHEET, AND PRODUCTION METHOD FOR AN ELECTRONIC PART 审中-公开
标题翻译：粘合剂，粘合片，多层粘合片，电子部件生产方法
公开(公告)号：US20100240196A1
公开(公告)日：2010-09-23
申请号：US12682909
申请日：2007-10-16
申请人： Takeshi Saito , Tomomichi Takatsu
发明人： Takeshi Saito , Tomomichi Takatsu
IPC分类号： H01L21/78 , C09J133/12 , B32B27/36
CPC分类号： C09J133/066 , C08L2312/00 , C09J7/385 , C09J2203/326 , H01L21/67132 , H01L24/27 , H01L24/83 , H01L2224/83191 , Y10T428/2848 , Y10T428/2887
摘要： A multi-layered adhesive sheet includes a substrate film, an adhesive layer formed by coating an adhesive having a specific composition onto the substrate film, and a die attachment film laminated on the adhesive layer. The multi-layered adhesive sheet employing an adhesive having this specific composition is superior in retention of a die chip during dicing of a silicon wafer, the multi-layered adhesive sheet is less likely to come off a ring frame during the dicing of the silicon wafer, and it allows for the die attachment film and the adhesive layer to be easily peeled apart during a pick-up operation of a die chip.
摘要翻译：多层粘合片包括基材膜，通过将具有特定组成的粘合剂涂布在基材膜上形成的粘合剂层和层压在粘合剂层上的模片附着膜。使用具有这种特定组成的粘合剂的多层粘合片在硅晶片的切割期间在芯片的保持性方面是优异的，在硅晶片的切割期间，多层粘合片不太可能脱落环架，并且允许在芯片的拾取操作期间，芯片附接膜和粘合剂层容易剥离。

15. 发明授权

US08975347B2 Method for manufacturing electronic component 有权
标题翻译：电子元件制造方法
公开(公告)号：US08975347B2
公开(公告)日：2015-03-10
申请号：US13820871
申请日：2011-09-14
申请人： Takeshi Saito , Tomomichi Takatsu
发明人： Takeshi Saito , Tomomichi Takatsu
IPC分类号： C08F283/00 , C09J11/06 , C09D133/06 , H01L21/67 , C08G18/67 , C08G18/79 , C08G18/81 , C09J175/16 , H01L21/78 , C09J143/04 , C08F283/12
CPC分类号： C09J11/06 , C08G18/673 , C08G18/792 , C08G18/8175 , C09D133/066 , C09J143/04 , C09J175/16 , H01L21/67132 , H01L21/78 , Y10T156/1052 , Y10T428/239 , Y10T428/24273 , Y10T428/24364 , Y10T428/28 , Y10T428/2809 , Y10T428/2891 , Y10T428/2907 , Y10T428/31855
摘要： Provided is a method for manufacturing electronic component improved in chip-holding efficiency, pickup efficiency and contamination resistance in a well-balanced manner, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer on the rear face of a wafer, a fixing step of fixing the semi-cured adhesive layer of the wafer on a ring frame with a cohesive sheet, a dicing step of dicing the wafer into semiconductor chips, a UV-irradiating step of irradiating ultraviolet ray, and a pick-up step of picking up the chips and semi-cured adhesive layers from the cohesive layer, wherein the cohesive sheet has a cohesive layer of a cohesive agent having a particular composition formed on one face of its base film.
摘要翻译：提供一种以均衡的方式制造提高了芯片保持效率，拾取效率和耐污染性的电子部件的方法，所述方法包括在后部形成半固化粘合剂层的半固化粘合剂层形成步骤将晶片的半固化粘合剂层固定在具有粘结片的环形框架上的定影步骤，将晶片切割成半导体芯片的切割步骤，照射紫外线的紫外线照射步骤和从内聚层拾取芯片和半固化粘合剂层的拾取步骤，其中粘合片材具有在其基膜的一个表面上形成的具有特定组成的粘结剂的内聚层。

16. 发明授权

US08764933B2 Adhesive and adhesive sheet 有权
标题翻译：粘合剂和粘合片
公开(公告)号：US08764933B2
公开(公告)日：2014-07-01
申请号：US13256801
申请日：2010-02-09
申请人： Tomomichi Takatsu , Masashi Kume
发明人： Tomomichi Takatsu , Masashi Kume
IPC分类号： C04B37/00
CPC分类号： C09J133/10 , C08L2205/02 , C08L2312/00 , C09J7/385 , C09J133/08 , C09J2203/326 , C09J2433/00 , H01L21/67132 , Y10T156/1052 , Y10T428/2878
摘要： Provided is a adhesive and an adhesive sheet which exhibit excellent chip-holding properties during dicing and from which chips can be easily stripped during pick up, even when considering changes over time. It is a adhesive composition which contains both (A) a (meth)acrylic acid ester copolymer component that has functional-group containing monomer units and a weight average molecular weight of less than 350,000 and (B) a (meth)acrylic ester copolymer component that has functional-group containing monomer units and a weight average molecular weight of 350,000 to 2,000,000 at a weight ratio of 10:90 to 90:10, and further contains 0.5 to 20 parts by mass of a crosslinking agent per 100 parts by mass of components (A) and (B) in total, the crosslinking agent being a crosslinking agent that reacts with both the functional groups of the component (A) and the functional groups of the component (B).
摘要翻译：提供了一种粘合剂和粘合片，其在切割期间表现出优异的切屑保持性能，并且即使考虑随时间的变化，芯片也可以在拾取期间容易地剥离。它是一种粘合剂组合物，其包含（A）具有含官能团的单体单元和重均分子量小于35万的（甲基）丙烯酸酯共聚物组分和（B）（甲基）丙烯酸酯共聚物组分具有含官能团的单体单元，重均分子量为35万〜200万，重量比为10:90〜90:10，进一步含有0.5〜20质量份交联剂，相对于100质量份组分（A）和（B），交联剂是与组分（A）的官能团和组分（B）的官能团反应的交联剂。

17. 发明授权

US08399338B2 Electronic component manufacturing method 有权
标题翻译：电子元件制造方法
公开(公告)号：US08399338B2
公开(公告)日：2013-03-19
申请号：US13130076
申请日：2009-11-11
申请人： Takeshi Saito , Tomomichi Takatsu
发明人： Takeshi Saito , Tomomichi Takatsu
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , B32B7/12 , B32B25/12 , B32B25/14 , B32B27/08 , B32B27/16 , B32B27/18 , B32B27/281 , B32B27/283 , B32B27/30 , B32B27/308 , B32B27/32 , B32B27/36 , B32B27/38 , B32B27/40 , B32B2270/00 , B32B2274/00 , B32B2307/21 , B32B2457/14 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68318 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/83856 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01019 , H01L2924/01025 , H01L2924/0103 , H01L2924/01033 , H01L2924/01058 , H01L2924/01075 , H01L2924/01082 , H01L2924/0665 , H01L2924/00
摘要： The objective is to limit pickup defects when chips with a semi-cured adhesive layer are picked up following dicing by lowering the adhesive strength of an ultraviolet curable adhesive beforehand while improving the cohesive force. Provided is a dicing method for semiconductor wafers with a semi-cured adhesive layer that comprises a process to coat the back surface of semiconductor wafers with a paste-like adhesive and semi-cure the paste-like adhesive in a sheet form using heating or ultraviolet irradiation to form a semi-cured adhesive layer, a gluing process to glue an adhesive sheet, wherein an ultraviolet curable adhesive is laminated on a base film, onto the semi-cured adhesive layer, an ultraviolet irradiation process to apply ultraviolet irradiation to the ultraviolet curable adhesive, and a dicing process to dice the semi-cured adhesive layer glued to the adhesive sheet and the semiconductor wafers.
摘要翻译：目的是通过在改善内聚力的同时降低紫外线固化性粘合剂的粘合强度，在切割后拾取具有半固化粘合剂层的芯片，以限制拾取缺陷。本发明提供一种具有半固化粘合剂层的半导体晶片的切割方法，其包括用糊状粘合剂涂覆半导体晶片的背面并使用加热或紫外线将片状粘合剂半固化的方法照射以形成半固化粘合剂层，将粘合片胶合的胶合工艺，其中将紫外线固化性粘合剂层压在基膜上，到半固化粘合剂层上，对紫外线照射紫外线照射过程以及切割工艺来切割粘合到粘合片和半导体晶片的半固化粘合剂层。

18. 发明授权

US08389629B2 Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for electronic part 有权
标题翻译：粘合剂，粘合片，多层粘合片和电子部件的制造方法
公开(公告)号：US08389629B2
公开(公告)日：2013-03-05
申请号：US12738083
申请日：2007-10-16
申请人： Takeshi Saito , Tomomichi Takatsu
发明人： Takeshi Saito , Tomomichi Takatsu
IPC分类号： C08L83/06
CPC分类号： C09J183/10 , C08F230/08 , C08F2220/281 , C08G18/672 , C08G77/20 , C08G2170/40 , C08L33/08 , C08L51/085 , C08L75/04 , C08L75/16 , C08L83/10 , C09J7/38 , C09J133/066 , C09J175/04 , C09J175/16 , C09J2203/326 , C09J2433/00 , C09J2451/00 , C09J2475/00 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01082 , H01L2924/01088 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , Y10T428/31551 , Y10T428/31663 , C08G18/48 , C08F2220/1808 , C08F2220/1858 , C08F220/18 , H01L2924/07025 , H01L2924/00
摘要： A multi-layered adhesive sheet 100, includes: a substrate film 106, an adhesive layer 103 formed by coating an adhesive having a specific composition onto this substrate film 106, and a die attachment film 105 laminated on the adhesive layer 103. The multi-layered adhesive sheet 100 employing an adhesive having this specific composition has superior retention of die chip 108 during the dicing of silicon wafer 101, allows the die attachment film 105 and adhesive layer 103 to be easily peeled apart during a pick-up operation of the die chip 108, and prevents poor adhesion during the bonding of die chip 108 to lead frame 111.
摘要翻译：多层粘合片100包括：基材膜106，通过将具有特定组成的粘合剂涂布在该基材膜106上形成的粘合剂层103和层压在粘合剂层103上的模具附着膜105。使用具有这种特定组成的粘合剂的分层粘合片100在硅晶片101的切割期间具有优异的晶片芯片108的保持性，允许模具附着膜105和粘合剂层103在模具的拾取操作期间容易地剥离芯片108，并且防止在芯片108与引线框架111的接合期间的粘附性差。

19. 发明授权

US08236416B2 Adhesive sheet and process for producing electric components using the sheet 有权
标题翻译：粘合片和使用该片生产电组件的方法
公开(公告)号：US08236416B2
公开(公告)日：2012-08-07
申请号：US12095019
申请日：2006-11-29
申请人： Satoru Kawata , Tomomichi Takatsu
发明人： Satoru Kawata , Tomomichi Takatsu
IPC分类号： B32B7/12 , B32B27/34 , B32B27/38
CPC分类号： H01L21/6836 , C09J7/29 , C09J2201/162 , C09J2451/006 , H01L2221/68327 , Y10T428/28 , Y10T428/31504 , Y10T428/31511 , Y10T428/31663 , Y10T428/31786
摘要： An adhesive sheet and a method for producing electronic components using the sheet are provided.An adhesive sheet comprising a substrate layer; an antistatic layer formed on one surface of the substrate layer and containing an organic binder, an antistatic agent, an antifriction agent and a curing agent; and an adhesive layer formed on the other surface of the substrate layer; and a method for producing electronic components using the adhesive sheet.
摘要翻译：提供了一种粘合片和使用该片的电子部件的制造方法。一种粘合片，包括基底层; 形成在基材层的一个表面上并含有有机粘合剂，抗静电剂，抗摩擦剂和固化剂的抗静电层; 以及形成在所述基材层的另一个表面上的粘合剂层; 以及使用该粘合片制造电子部件的方法。

20. 发明授权

US08114759B2 Dicing method using a die attach film on an adhesive sheet 有权
标题翻译：在粘合片上使用芯片附着膜的切割方法
公开(公告)号：US08114759B2
公开(公告)日：2012-02-14
申请号：US12992616
申请日：2009-03-03
申请人： Takeshi Saito , Tomomichi Takatsu
发明人： Takeshi Saito , Tomomichi Takatsu
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , C08G18/10 , C08G18/6229 , C08G18/672 , C08G18/673 , C08G18/73 , C08G18/792 , C09D183/10 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/27436 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01019 , H01L2924/01025 , H01L2924/0103 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , C08G18/61 , H01L2924/00
摘要： With the invented dicing method, by increasing the cohesive strength while decreasing the adhesive strength of an ultraviolet-curing adhesive in advance, mixing of the ultraviolet-curing adhesive layer of an adhesive sheet with a die attach film on a dicing line can be decreased and pickup failures can be reduced, when picking up chips having a die attach film after dicing. The dicing method for a semiconductor wafer with a die-attach film comprises a first gluing step in which a die attach film is affixed to an adhesive sheet having an ultraviolet-curing adhesive laminated on a base material film, a second gluing step in which a semiconductor wafer is affixed to the opposite side of the die attach film affixed to the adhesive sheet, an ultraviolet irradiation step in which the ultraviolet-curing adhesive is irradiated with ultraviolet light, and a dicing step in which the semiconductor wafer and the die attach film affixed to the adhesive sheet are diced.
摘要翻译：利用本发明的切割方法，通过提高粘合强度同时降低紫外线固化型粘合剂的粘合强度，可以减少粘合片的紫外线固化粘合剂层与切割线上的芯片附着膜的混合，当切割后拾取带有贴片的芯片时，可以降低拾取故障。具有芯片附着膜的半导体晶片的切割方法包括第一胶合步骤，其中将芯片附着膜固定到具有层压在基材膜上的紫外线固化粘合剂的粘合片，第二胶合步骤，其中将半导体晶片固定在固定在粘合片上的管芯附着膜的相对侧，紫外线照射工序，紫外线固化型粘合剂被紫外线照射，切割工序，其中半导体晶片和芯片附着膜固定在粘合片上是切块的。

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