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11. 发明申请

US20090010034A1 START SIGNAL DETECTOR CIRCUIT 有权
标题翻译：开始信号检测电路
公开(公告)号：US20090010034A1
公开(公告)日：2009-01-08
申请号：US12162148
申请日：2007-01-11
申请人： Tomoyuki Yamase , Tadashi Maeda
发明人： Tomoyuki Yamase , Tadashi Maeda
IPC分类号： H02M7/217
CPC分类号： H02M7/103 , G01R21/10 , H02M7/217 , H03K17/145 , H03K17/302
摘要： A variation of a threshold of diode-connected transistors is compensated for to maintain a constant rectification efficiency of a rectifier circuit, thereby enabling stable detection of a start signal. A constant voltage is applied to DC bias terminal of cascaded half-wave voltage doubler rectifier circuits (including MOS transistors M1 to M4 and capacitors C1 to C4) forming a rectifier circuit, and a voltage equal to the sum of the constant voltage applied to DC bias terminal 103 and a variation ΔVt of a threshold voltage of the MOS transistors is applied to DC bias terminal 104 of cascaded half-wave voltage doubler rectifier circuits (including MOS transistors M5 to M8 and capacitors C5 to C8) forming a bias circuit.
摘要翻译：二极管连接的晶体管的阈值的变化被补偿以保持整流器电路的恒定的整流效率，从而能够稳定地检测起始信号。将恒定电压施加到形成整流电路的级联半波倍压整流电路（包括MOS晶体管M1至M4和电容器C1至C4）的DC偏置端子，以及等于施加到DC的恒定电压之和的电压偏置端子103和MOS晶体管的阈值电压的变化量ΔVt被施加到形成偏置电路的级联半波倍压整流电路（包括MOS晶体管M5至M8和电容器C5至C8）的DC偏置端子104。

12. 发明申请

US20080244900A1 Flux for Soldering and Soldering Process 有权
标题翻译：焊接和焊接工艺的焊剂
公开(公告)号：US20080244900A1
公开(公告)日：2008-10-09
申请号：US10586598
申请日：2005-01-27
申请人： Tadashi Maeda , Tadahiko Sakai
发明人： Tadashi Maeda , Tadahiko Sakai
IPC分类号： H05K3/34 , B23K35/34
CPC分类号： B23K35/0244 , B23K35/025 , B23K35/3006 , B23K35/3013 , B23K35/36 , B23K35/3613 , H01L21/6835 , H01L24/11 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/11003 , H01L2224/11822 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/1403 , H01L2224/16 , H01L2224/81011 , H01L2224/81801 , H01L2924/00013 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/12044 , H05K3/3489 , H05K2201/0215 , Y10T29/49144 , H01L2224/29099 , H01L2924/00014 , H01L2924/01083 , H01L2924/00
摘要： There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation.Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains: a liquid base material made of a resin component which is dissolved in a solvent, an active component which removes an oxide film, and a metal powder made of a metal of which melting point is higher than that of a solder material which forms the solder portion, and the flux contains the metal powder in an amount in the range between 1% and 9% by volume based on a volume of the flux.
摘要翻译：提供焊接助焊剂和焊接工艺，其形成更好的焊接连接，而不会发生不良连接和绝缘劣化。当将第一电极焊接到第二电极时，放置在形成在第一电极上的焊料部分和第二电极之间的这种焊剂包含：溶解在溶剂中的由树脂成分制成的液体基材，活性成分除去氧化膜和由熔点高于形成焊料部分的焊料材料的金属制成的金属粉末，并且焊剂含有金属粉末的量在1％至9％的范围内，基于磁通量的体积。

13. 发明授权

US07298215B2 Amplifying circuit 有权
标题翻译：放大电路
公开(公告)号：US07298215B2
公开(公告)日：2007-11-20
申请号：US10537470
申请日：2003-12-03
申请人： Hitoshi Yano , Tomoyuki Yamase , Keiichi Numata , Tadashi Maeda
发明人： Hitoshi Yano , Tomoyuki Yamase , Keiichi Numata , Tadashi Maeda
IPC分类号： H03G3/30
CPC分类号： H03F1/56 , H03F1/02
摘要： The present invention provides an amplifying circuit capable of accomplishing high-impedance input/output, and providing a high gain and low power consumption. The amplifier amplifies a signal received through an input terminal, and outputs the signal through an output terminal. A control circuit comprised of the inductors, and the switches turns input/output impedances of the amplifier into a high impedance.
摘要翻译：本发明提供一种能够实现高阻抗输入/输出并提供高增益和低功耗的放大电路。放大器放大通过输入端接收的信号，并通过输出端输出信号。由电感器组成的控制电路，并且开关将放大器的输入/输出阻抗转换成高阻抗。

14. 发明申请

US20050284921A1 Method of soldering electronic component having solder bumps to substrate 有权
标题翻译：将具有焊料凸块的电子部件焊接到基板的方法
公开(公告)号：US20050284921A1
公开(公告)日：2005-12-29
申请号：US11157921
申请日：2005-06-22
申请人： Tadahiko Sakai , Tadashi Maeda
发明人： Tadahiko Sakai , Tadashi Maeda
IPC分类号： H01L21/60 , H05K3/34 , B23K31/00
CPC分类号： H05K3/3436 , H01L24/11 , H01L24/81 , H01L2224/1182 , H01L2224/11822 , H01L2224/1308 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13118 , H01L2224/13139 , H01L2224/13144 , H01L2224/13164 , H01L2224/16 , H01L2224/29499 , H01L2224/75 , H01L2224/75301 , H01L2224/758 , H01L2224/81011 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3489 , H05K2201/0215 , H05K2201/035 , H05K2203/0338 , Y02P70/613 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099
摘要： A method of soldering electronic component (6) having solder bumps (7) formed thereon to substrate (12), wherein bumps (7) are pressed against a flux transferring stage on which a thin film is formed of flux (10) containing metal powder (16) of good wettability to solder so as to cause metal powder (16) to penetrate oxide films (7a) and embed in the surfaces on the bottom parts of bumps (7), and bumps (7) in this state are positioned and mounted to electrodes (12a) on substrate (12). Substrate (12) is then heated to melt bumps (7) and allow the melted solder to flow and spread along the surfaces of metal powder (16) toward electrodes (12a). The method can thus provide solder bonding portions of high quality without any soldering defect and deterioration of the insulating property.
摘要翻译：一种将在其上形成有焊料凸块（7）的电子部件（6）焊接到基板（12）上的方法，其中凸块（7）被压在其上形成有由金属粉末的焊剂（10）形成薄膜的焊剂转移台（16），使焊料具有良好的润湿性，从而使金属粉末（16）穿透氧化膜（7a）并嵌入在凸块（7）的底部的表面上，并且在该状态下的凸块（7）被定位并安装到基板（12）上的电极（12a）上。然后将基板（12）加热以熔化凸块（7），并使熔融的焊料沿着金属粉末（16）的表面朝向电极（12a）流动并扩散。因此，该方法可以提供高质量的焊接部分，而没有任何焊接缺陷和绝缘性能的劣化。

15. 发明授权

US06797544B2 Semiconductor device, method of manufacturing the device and method of mounting the device 有权
标题翻译：半导体装置，装置的制造方法以及装置的安装方法
公开(公告)号：US06797544B2
公开(公告)日：2004-09-28
申请号：US09977220
申请日：2001-10-16
申请人： Tadahiko Sakai , Mitsuru Ozono , Tadashi Maeda
发明人： Tadahiko Sakai , Mitsuru Ozono , Tadashi Maeda
IPC分类号： H01L2144
CPC分类号： H01L21/6836 , H01L21/67144 , H01L21/78 , H01L23/562 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2221/68327 , H01L2223/54406 , H01L2223/54473 , H01L2223/54486 , H01L2224/16225 , H01L2224/274 , H01L2224/32014 , H01L2224/73253 , H01L2224/83192 , H01L2224/8385 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/16152 , H01L2924/3511 , H01L2924/3512 , H01L2924/00
摘要： A semiconductor device having a thinned semiconductor element that can be easily handled is manufactured with a method of manufacturing. The semiconductor device includes a semiconductor element and a bumper member bonded, as a reinforcing member, to a back surface opposite to an electrode-formed surface of the semiconductor element with an adhesive. The adhesive has a low elastic modulus and easily expands and contracts after bonding, and bonds the semiconductor element to the bumper member while allowing the semiconductor element to be deformed. Thus, the semiconductor device can be easily handled, and the semiconductor element can be deformed in response to the deformation of a substrate after being mounted. In addition, a thermal stress in a heat cycle can be alleviated effectively.
摘要翻译：通过制造方法制造具有可以容易地处理的薄型半导体元件的半导体器件。半导体器件包括半导体元件和保险杠元件，该保险杠元件作为加强元件，用粘合剂粘合到与半导体元件的电极形成表面相对的后表面。粘合剂具有低的弹性模量，并且在粘合之后容易膨胀和收缩，并且在使半导体元件变形的同时将半导体元件粘合到保险杠构件。因此，可以容易地处理半导体器件，并且半导体元件可以在安装之后响应于基板的变形而变形。另外，可以有效地缓解热循环中的热应力。

16. 发明授权

US06189771B1 Method of forming solder bump and method of mounting the same 有权
标题翻译：形成焊料凸点的方法及其安装方法
公开(公告)号：US06189771B1
公开(公告)日：2001-02-20
申请号：US09414374
申请日：1999-10-07
申请人： Tadashi Maeda , Tadahiko Sakai
发明人： Tadashi Maeda , Tadahiko Sakai
IPC分类号： B23K3100
CPC分类号： H01L24/12 , H01L23/49816 , H01L24/11 , H01L2224/11334 , H01L2224/11822 , H01L2224/13099 , H01L2224/16237 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3436 , H05K3/3478 , H05K3/3484 , H05K3/4038 , H05K2201/0305 , H05K2201/035 , H05K2201/0394 , H05K2201/09472 , H05K2201/10992 , H05K2203/0338 , H05K2203/041 , Y02P70/613
摘要： A solder bump formation method and solder bump mounting method for forming a solder bump by soldering a solder ball 9 onto an electrode 2 provided at the bottom of a cavity 3 on a substrate 2 which has an opening shape through which the solder ball 9 cannot go. Metal paste 5, containing metal having a higher liquidus temperature than that of solder used for the solder ball 9, is filled into the cavity 3. The solder ball 9 is placed on the cavity 3, and then heated to the temperature higher than the liquidus temperature of the solder ball 9. During the heating process, metal in the metal paste 5 remains unmelted in the cavity 3 when the solder ball 9 melts. This enables the metal to direct the melted solder to the electrode 2 at the bottom of the cavity 3, achieving good soldering.
摘要翻译：一种焊锡凸块形成方法和焊料凸块安装方法，用于通过将焊球9焊接到设置在腔3的底部的电极2上形成焊料凸块，所述电极2具有焊球9不能去的开口形状的基板2上。将含有比用于焊球9的焊料高的液相线温度的金属的金属膏5填充到空腔3中。将焊球9放置在空腔3上，然后加热至高于液相线焊球9的温度。在加热过程中，当焊球9熔化时，金属浆料5中的金属保持未熔化在空腔3中。这使得金属能够将熔融的焊料引导到空腔3的底部的电极2，实现良好的焊接。

17. 发明申请

US20090146512A1 COOLING DEVICE OF ELECTRIC MOTOR FOR VEHICLE 有权
标题翻译：电动汽车冷却装置
公开(公告)号：US20090146512A1
公开(公告)日：2009-06-11
申请号：US12065040
申请日：2006-04-14
申请人： Hideyuki Yoshizawa , Kazushi Horie , Tadashi Maeda
发明人： Hideyuki Yoshizawa , Kazushi Horie , Tadashi Maeda
IPC分类号： H02K9/02
CPC分类号： H02K9/06
摘要： A cooling device of an electric motor for a vehicle for receiving cooling air into the electric motor through a suction port according to the rotation of a rotor shaft on which a rotor core, which is disposed opposite to a stator core, is installed. The cooling device includes an air volume regulating mechanism regulating a cooling air volume received therein through the suction port according to an ambient temperature. Since the cooling air volume received in the cooling device through the suction port is regulated according to the ambient temperature, the cooling of the electric motor can be optimized, and noise generated can be efficiently reduced according to the ambient temperature.
摘要翻译：一种用于车辆的电动机的冷却装置，其通过吸入口将冷却空气接收到转子轴的旋转中，转子轴上安装有与定子芯相对设置的转子芯。冷却装置包括风量调节机构，其根据环境温度调节通过吸入口容纳在其中的冷却风量。由于通过吸入口容纳在冷却装置中的冷却风量根据环境温度进行调节，所以能够优化电动机的冷却，能够根据环境温度有效地降低产生的噪音。

18. 发明授权

US06194841B1 Discharge lamp lighting device 失效
标题翻译：放电灯照明装置
公开(公告)号：US06194841B1
公开(公告)日：2001-02-27
申请号：US09334768
申请日：1999-06-16
申请人： Osamu Takahashi , Kazuhiko Tsugita , Isamu Ogawa , Tetuya Kobayashi , Isao Masatika , Tadashi Maeda , Koji Shibata , Kenji Hamazaki , Hiroaki Nishikawa
发明人： Osamu Takahashi , Kazuhiko Tsugita , Isamu Ogawa , Tetuya Kobayashi , Isao Masatika , Tadashi Maeda , Koji Shibata , Kenji Hamazaki , Hiroaki Nishikawa
IPC分类号： H05B3702
CPC分类号： H05B41/2828 , H05B41/3925 , Y10S315/04
摘要： A discharge lamp lighting device in which dim control can be performed for a discharge lamp continuously and stably in a wide range, and which is simple in circuit configuration and low in price. The discharge lamp lighting device comprises: an inverter (IV) for turning on/off switching elements (Q2, Q3) by an oscillation output signal of an IV control integrated circuit (IC2) to thereby invert a voltage of a DC power supply (E) into high-frequency electric power, a discharge lamp (LA) capable of being lighted by the high-frequency electric power from the inverter (IV), a feedback circuit (FB) having delay time T (unit: second) expressed by 1/f≦T≦1/10,000 when the frequency of the high-frequency electric power is f, the feedback circuit (FB) including a reference value setting means (R15) for setting a reference value, the feedback circuit outputting a voltage for controlling the IV control integrated circuit (IC2) to make the high-frequency electric power equal to the reference value.
摘要翻译：一种放电灯点亮装置，其能够在宽范围内连续稳定地对放电灯进行调光控制，电路结构简单，价格低廉。放电灯点亮装置包括：用于通过IV控制集成电路（IC2）的振荡输出信号使开关元件（Q2，Q3）导通/断开的逆变器（IV），从而使直流电源（E ）变换为高频电力，能够通过来自逆变器（IV）的高频电力点亮的放电灯（LA），具有由1表示的延迟时间T（单位：秒）的反馈电路（FB）当高频电力的频率为f时，f f = T <= 1 / 10,000，反馈电路（FB）包括用于设定基准值的基准值设定装置（R15），反馈电路输出电压用于控制IV控制集成电路（IC2）以使高频电功率等于参考值。

19. 发明授权

US5619146A Switching speed fluctuation detecting apparatus for logic circuit arrangement 失效
标题翻译：用于逻辑电路布置的开关速度波动检测装置
公开(公告)号：US5619146A
公开(公告)日：1997-04-08
申请号：US604621
申请日：1996-02-21
申请人： Masahiro Fujii , Yasuo Ohno , Tadashi Maeda , Takao Atsumo , Noriaki Matsuno , Keiichi Numata , Nobuhide Yoshida
发明人： Masahiro Fujii , Yasuo Ohno , Tadashi Maeda , Takao Atsumo , Noriaki Matsuno , Keiichi Numata , Nobuhide Yoshida
IPC分类号： G01R31/319 , H03K17/14 , H03K19/00 , H03K19/003
CPC分类号： H03K19/00369 , H03K17/14
摘要： In a switching speed fluctuation detecting apparatus, an input terminal for receiving a signal having a definite time period, a series arrangement of at least one first logic circuit connected to the input terminal, a second logic circuit having a first input connected to the input terminal and a second input connected to an output of the series arrangement and an integrator connected to an output of the second logic circuit are provided.
摘要翻译：在切换速度波动检测装置中，接收具有确定时间段的信号的输入端子，连接到输入端子的至少一个第一逻辑电路的串联布置，具有连接到输入端子的第一输入端的第二逻辑电路并且提供连接到串联装置的输出的第二输入和连接到第二逻辑电路的输出的积分器。

20. 发明授权

US09030064B2 Totally-enclosed fan-cooled motor 有权
标题翻译：全封闭风扇电机
公开(公告)号：US09030064B2
公开(公告)日：2015-05-12
申请号：US13812417
申请日：2010-07-28
申请人： Seiji Haga , Kazuto Minagawa , Tadashi Maeda
发明人： Seiji Haga , Kazuto Minagawa , Tadashi Maeda
IPC分类号： H02K9/00 , H02K9/04 , H02K9/14 , H02K9/18 , H02K9/22 , H02K1/20 , H02K5/20 , H02K9/08
CPC分类号： H02K9/04 , H02K1/20 , H02K5/20 , H02K9/08 , H02K9/14 , H02K9/18 , H02K9/22
摘要： The totally-enclosed fan-cooled motor includes the stator; the rotor; the drive side bracket; the counter drive side bracket; a pair of the bearings; the external fan that sends cooling air to the stator; the internal fan; the heat radiator that is arranged on an outer side of the drive side bracket and is mounted on the rotation shaft; the cover that contains a joint, which connects the rotation shaft extending to an outer side of the drive side bracket of the motor and a reduction gear, and is provided in parallel with the joint; and the ventilation path that is arranged between the drive side bracket and an end of the cover, and includes the outlet causes the cooling air induced by rotation of the heat radiator to flow to the heat radiator and discharges the cooling air outside the motor.
摘要翻译：全封闭风扇电机包括定子; 转子; 驱动侧支架; 柜台驱动侧支架; 一对轴承; 向定子发送冷却空气的外部风扇; 内部风扇; 所述散热器布置在所述驱动侧支架的外侧并安装在所述旋转轴上; 所述盖包括将所述旋转轴延伸到所述电动机的驱动侧支架的外侧的连接件和减速齿轮，并且与所述接头平行地设置; 并且布置在驱动侧支架和盖的端部之间的通风路径包括出口，使得由散热器的旋转引起的冷却空气流到散热器并将冷却空气排出到电动机外部。

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