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    • 15. 发明授权
    • Thin film transistor and method for fabricating the same
    • 薄膜晶体管及其制造方法
    • US07838352B2
    • 2010-11-23
    • US11493044
    • 2006-07-25
    • Tae-Hoon YangKi-Yong LeeJin-Wook SeoByoung-Keon Park
    • Tae-Hoon YangKi-Yong LeeJin-Wook SeoByoung-Keon Park
    • H01L21/84
    • H01L29/78654H01L29/66757H01L29/66772H01L29/78675H01L29/78696
    • A thin film transistor that has improved characteristics and uniformity is developed by uniformly controlling low concentration of crystallization catalyst and controlling crystallization position so that no seed exists and no grain boundary exists, or one grain boundary exists in a channel layer of the thin film transistor. The thin film transistor includes a substrate; a semiconductor layer pattern which is formed on the substrate, the semiconductor layer pattern having a channel layer of which no seed exists and no grain boundary exists; a gate insulating film formed on the semiconductor layer pattern; and a gate electrode formed on the gate insulating film. A method for fabricating the thin film transistor includes forming an amorphous silicon layer on a substrate; forming a semiconductor layer pattern having a channel layer in which no seed exists and no grain boundary exists by crystallizing and patterning the amorphous silicon layer; forming a gate insulating film on the semiconductor layer pattern; and forming a gate electrode on the gate insulating film.
    • 通过均匀控制结晶催化剂的低浓度和控制结晶位置,使得不存在晶种并且不存在晶界,或者在薄膜晶体管的沟道层中存在一个晶界,开发出具有改善的特性和均匀性的薄膜晶体管。 薄膜晶体管包括基板; 形成在所述基板上的半导体层图案,所述半导体层图案具有不存在种子的沟道层,并且不存在晶界; 形成在半导体层图案上的栅极绝缘膜; 以及形成在栅极绝缘膜上的栅电极。 一种薄膜晶体管的制造方法,包括在基板上形成非晶硅层; 形成具有不存在种子的沟道层的半导体层图案,并且通过对非晶硅层进行结晶和图案化而不存在晶界; 在半导体层图案上形成栅极绝缘膜; 以及在所述栅极绝缘膜上形成栅电极。
    • 19. 发明授权
    • Thin film transistor and method of fabricating the same
    • 薄膜晶体管及其制造方法
    • US07683373B2
    • 2010-03-23
    • US11017688
    • 2004-12-22
    • Byoung-Keon ParkJin-Wook SeoTae-Hoon YangKi-Yong Lee
    • Byoung-Keon ParkJin-Wook SeoTae-Hoon YangKi-Yong Lee
    • H01L31/036
    • H01L29/66757H01L27/1277H01L27/1281H01L29/04H01L29/78675
    • Provided are a thin film transistor and method of fabricating the same, in which an amorphous silicon layer is formed on a substrate, a capping layer containing a metal catalyst having a different concentration according to its thickness is formed on the amorphous silicon layer, the capping layer is patterned to form a capping layer pattern, and the amorphous silicon layer is crystallized, such that the density and position of seeds formed at an interface between the amorphous silicon layer and the capping layer pattern is controlled, thereby improving the size and uniformity of grains, and in which polycrystalline silicon of desired size and uniformity is selectively formed at a desired position by one crystallization process, resulting in a thin film transistor having excellent and desired properties. The thin film transistor includes a substrate; a plurality of semiconductor layers formed on the substrate, the semiconductor layers including grains of different sizes obtained by crystallizing an amorphous silicon layer beneath a capping layer into a polycrystalline silicon layer using the capping layer pattern containing a metal catalyst with a predetermined distribution and having a predetermined height and width; and a gate insulating layer, a gate electrode, an interlayer insulting layer, and source and drain electrodes formed on the semiconductor layers. Therefore, the crystallization process is performed using the capping layer pattern containing the metal catalyst, which has concentration and distribution varying depending on the thickness of the capping layer pattern, thereby improving the size and uniformity of grains. In addition, the polycrystalline silicon of desired size and uniformity is selectively formed in a desired position by one crystallization process, resulting in the thin film transistor having excellent and desired properties.
    • 本发明提供一种薄膜晶体管及其制造方法,其中在基板上形成非晶硅层,在非晶硅层上形成包含不同浓度的金属催化剂的覆盖层 图案化以形成覆盖层图案,并且使非晶硅层结晶化,使得在非晶硅层和覆盖层图案之间的界面处形成的晶种的密度和位置受到控制,从而提高了非晶硅层的尺寸和均匀性 晶粒,并且其中通过一次结晶工艺在期望的位置选择性地形成所需尺寸和均匀性的多晶硅,导致具有优异和期望性能的薄膜晶体管。 薄膜晶体管包括基板; 形成在所述基板上的多个半导体层,所述半导体层包括通过使用包含具有预定分布的金属催化剂的覆盖层图案将覆盖层下面的非晶硅层结晶成多晶硅层而获得的不同尺寸的晶粒,并且具有 预定高度和宽度; 以及形成在半导体层上的栅极绝缘层,栅极电极,层间绝缘层以及源极和漏极。 因此,使用含有金属催化剂的覆盖层图案进行结晶化处理,其具有随封盖层图案的厚度而变化的浓度和分布,从而提高了晶粒的尺寸和均匀性。 此外,所需尺寸和均匀性的多晶硅通过一次结晶工艺选择性地形成在期望的位置,导致薄膜晶体管具有优异和期望的性能。