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    • 17. 发明授权
    • Complex power generation system and method for supplying heated water thereof
    • 复合发电系统及其加热水的供给方法
    • US08445155B2
    • 2013-05-21
    • US13336525
    • 2011-12-23
    • Soo Young Park
    • Soo Young Park
    • H01M8/04
    • H01M8/04014F24D3/18F24D2200/19F24H4/02F24H2240/10H01M8/0656Y02B30/12Y02B30/52
    • A complex power generation system according to an embodiment of the present invention may include a fuel cell module having a first heat exchanger and a second heat exchanger configured to generate a direct current by means of an electrochemical reaction between hydrogen and oxygen, a first cycle configured to receive hot water in a first temperature range from the first heat exchanger to supply to a heat pump, and receive hot water in a second temperature range from the heat pump to supply to the first heat exchanger, and a second cycle configured to receive hot water in a third temperature range from the heat pump to discharge hot water in a fourth temperature range through the second heat exchanger, thereby enhancing a heating performance and increasing a thermal efficiency of the overall system.
    • 根据本发明的实施例的复合发电系统可以包括具有第一热交换器和第二热交换器的燃料电池模块,所述第一热交换器和第二热交换器被配置为通过氢和氧之间的电化学反应产生直流电, 在第一温度范围内接收来自第一热交换器的热水供应到热泵,并且在从热泵到第一热交换器的第二温度范围内接收热水,以及被配置为接收热量的第二循环 在来自热泵的第三温度范围内的水通过第二热交换器在第四温度范围内排出热水,从而提高整个系统的加热性能和提高热效率。
    • 20. 发明授权
    • Method for fabricating semiconductor device
    • 制造半导体器件的方法
    • US07268085B2
    • 2007-09-11
    • US10749909
    • 2003-12-30
    • Yu-Chang KimSoo-Young Park
    • Yu-Chang KimSoo-Young Park
    • H01L21/302
    • H01L21/76897H01L27/10814H01L27/10855H01L27/10885
    • The present invention relates to a method for forming a storage node contact of a semiconductor device. The method includes the steps of: depositing sequentially a conductive layer, a nitride layer and a polysilicon layer on a substrate having an insulating structure and a conductive structure; etching selectively the polysilicon layer, the nitride layer and the conductive layer to form a plurality of conductive patterns with a stack structure of the conductive layer and a dual hard mask including the polysilicon layer and the nitride layer; forming an insulation layer along a profile containing the conductive patterns; and etching the insulation layer by using a line type photoresist pattern as an etch mask to form a contact hole exposing the conductive structure disposed between the neighboring conductive patterns.
    • 本发明涉及形成半导体器件的存储节点接触的方法。 该方法包括以下步骤:在具有绝缘结构和导电结构的衬底上依次沉积导电层,氮化物层和多晶硅层; 选择性地蚀刻多晶硅层,氮化物层和导电层以形成具有导电层的堆叠结构的多个导电图案和包括多晶硅层和氮化物层的双重硬掩模; 沿着包含导电图案的轮廓形成绝缘层; 以及通过使用线型光致抗蚀剂图案作为蚀刻掩模来蚀刻绝缘层,以形成露出设置在相邻导电图案之间的导电结构的接触孔。