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11. 发明授权

US07742704B2 Visible light control apparatus, visible light control circuit, visible light communication apparatus, and visible light control method 失效
标题翻译：可见光控制装置，可见光控制电路，可见光通信装置和可见光控制方法
公开(公告)号：US07742704B2
公开(公告)日：2010-06-22
申请号：US11540222
申请日：2006-09-29
申请人： Shuuji Suzuki , Ryuhei Fujiwara
发明人： Shuuji Suzuki , Ryuhei Fujiwara
IPC分类号： H04B10/04
CPC分类号： H04B10/116 , H04B10/1141
摘要： There is provided a visible light control apparatus including: a modulation unit (corresponding to a PPM signal generation circuit, a subcarrier generation circuit, and a first AND circuit) that modulates a subcarrier and thereby generates a modulated signal; a visible light control unit (corresponding to a driving circuit) that controls blinking of visible light which contains information based on the modulated signal modulated by the modulation unit and allows the visible light to be emitted at a predetermined emission time ratio; and an emission time ratio control unit (corresponding to a dimming signal generation circuit, an inverting circuit, a second AND circuit, and an OR circuit) that changes the predetermined emission time ratio and allows the visible light to be emitted at the changed emission time ratio.
摘要翻译：提供了一种可见光控制装置，包括：调制单元（对应于PPM信号生成电路，子载波生成电路和第一AND电路），其对副载波进行调制，从而生成调制信号; 可控光单元（对应于驱动电路），其控制基于由调制单元调制的调制信号的信息的可见光的闪烁，并允许以预定的发射时间比率发射可见光; 以及改变预定发光时间比并允许以改变的发射时间发射可见光的发射时间比率控制单元（对应于调光信号产生电路，反相电路，第二AND电路和OR电路）比。

12. 发明申请

US20080116611A1 Method of Manufacturing Multilayer Wiring Board 审中-公开
标题翻译：制造多层接线板的方法
公开(公告)号：US20080116611A1
公开(公告)日：2008-05-22
申请号：US11943410
申请日：2007-11-20
申请人： Minoru Ogawa , Masahiro Izumi , Shigeyasu Itoh , Shingetsu Yamada , Shuuji Suzuki , Hiroo Kurosaki
发明人： Minoru Ogawa , Masahiro Izumi , Shigeyasu Itoh , Shingetsu Yamada , Shuuji Suzuki , Hiroo Kurosaki
IPC分类号： B29C59/00
CPC分类号： H05K3/4632 , H01L2224/16 , H01L2224/83192 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/09701 , H05K1/0353 , H05K1/0373 , H05K1/095 , H05K3/041 , H05K3/045 , H05K3/107 , H05K3/1258 , H05K3/4069 , H05K3/4617 , H05K2201/0129 , H05K2201/0154 , H05K2201/0209 , H05K2201/0352 , H05K2201/0391 , H05K2203/0108 , H05K2203/065 , Y02P20/582 , Y10S428/901 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , Y10T428/24917 , Y10T428/249994
摘要： A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring. can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C. and an amorphous polyetherimide resin as the primary constituents, a metallic foil is embedded within the grooves so that the surface of the foil protrudes to the surface of the insulating substrate, and a conductive material formed by curing a conductive paste is used for filling the via holes.
摘要翻译：具有高耐热性的多层线路板，能够在不发生树脂流动的情况下进行低温融合，能够实现高精度，细致的导电布线。可以理想地应用于低体积高混合物制造配置，并且与使用这种多层布线板的半导体器件安装板一起提供的环境几乎没有影响，以及制造这种多层布线板的方法。在多层布线板中，形成布线电路和通孔的槽形成在由包含结晶熔融峰值温度至少为260℃的聚芳基酮树脂的热塑性树脂组合物形成的绝缘基板和无定形聚醚酰亚胺树脂作为主要成分，金属箔被嵌入槽内，使得箔的表面突出到绝缘基板的表面，并且通过固化导电膏形成的导电材料用于填充通孔。

13. 发明授权

US07022399B2 Semiconductor device integrated multilayer wiring board 失效
标题翻译：半导体器件集成多层布线板
公开(公告)号：US07022399B2
公开(公告)日：2006-04-04
申请号：US10357097
申请日：2003-02-03
申请人： Minoru Ogawa , Masahiro Izumi , Shigeyasu Itoh , Shingetsu Yamada , Shuuji Suzuki , Hiroo Kurosaki
发明人： Minoru Ogawa , Masahiro Izumi , Shigeyasu Itoh , Shingetsu Yamada , Shuuji Suzuki , Hiroo Kurosaki
IPC分类号： B32B15/00 , B32B3/00 , B32B7/00
CPC分类号： H05K3/4632 , H01L21/4857 , H01L23/145 , H01L23/49822 , H01L24/24 , H01L24/82 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H05K1/185 , H05K3/041 , H05K3/107 , H05K3/1258 , H05K3/4617 , H05K2201/0129 , H05K2201/09036 , H05K2203/0108 , Y10S428/901 , Y10T428/24917 , Y10T428/249994 , H01L2924/00
摘要： The present invention provides a semiconductor device integrated multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, thereby enabling the production of high density, ultra small three dimensional mounting modules and the like, can also be ideally applied to low volume high mix manufacturing configurations, and has little impact on the environment, and also provides a method of manufacturing such a semiconductor device integrated multilayer wiring board. In the semiconductor device integrated multilayer wiring board, a wiring substrate is formed by embedding conductive wiring within an insulating substrate, formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C. and an amorphous polyetherimide resin as primary constituents, so that the surface of the wiring protrudes to the surface of the resin, and a plurality of these wiring substrates are laminated together, IC chips are mounted onto some of the wiring substrates, the insulating substrates of the wiring substrates are bonded together by thermal fusion, and the conductive wiring of each of the wiring substrates, and the wiring electrically connecting the wiring substrates together, is formed from a conductive material produced by curing a conductive paste.
摘要翻译：本发明提供一种具有高耐热性的半导体器件集成多层布线板，其能够在不发生树脂流动的情况下进行低温熔融，能够实现高精度，细致的导电布线，从而能够生产高密度，超小三维安装模块等也可以理想地应用于低体积高混合物制造配置，并且对环境影响很小，并且还提供了制造这种半导体器件集成多层布线板的方法。在半导体装置集成多层布线基板中，通过将导电布线嵌入绝缘基板内而形成布线基板，绝缘基板由包含结晶熔融峰值温度为260℃以上的聚芳基酮树脂的热塑性树脂组合物形成，无定形聚醚酰亚胺树脂作为主要成分，使得布线的表面突出到树脂的表面，并且多个这些布线基板层叠在一起，将IC芯片安装到一些布线基板上，布线基板的绝缘基板通过热熔接结合在一起，并且每个布线基板的导电布线以及将布线基板电连接在一起的布线由通过固化导电浆料制成的导电材料形成。

14. 发明申请

US20050025944A1 Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board 失效
标题翻译：多层布线基板，使用该多层布线基板的半导体装置安装基板以及多层布线基板的制造方法
公开(公告)号：US20050025944A1
公开(公告)日：2005-02-03
申请号：US10925644
申请日：2004-08-24
申请人： Minoru Ogawa , Masahiro Izumi , Shigeyasu Itoh , Shingetsu Yamada , Shuuji Suzuki , Hiroo Kurosaki
发明人： Minoru Ogawa , Masahiro Izumi , Shigeyasu Itoh , Shingetsu Yamada , Shuuji Suzuki , Hiroo Kurosaki
IPC分类号： C08J5/18 , C08L71/10 , C08L79/08 , H01L23/12 , H01L23/14 , H05K1/03 , H05K1/09 , H05K3/04 , H05K3/10 , H05K3/20 , H05K3/22 , H05K3/40 , H05K3/46 , B32B3/00 , B32B15/08
CPC分类号： H05K3/4632 , H01L2224/16 , H01L2224/83192 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/09701 , H05K1/0353 , H05K1/0373 , H05K1/095 , H05K3/041 , H05K3/045 , H05K3/107 , H05K3/1258 , H05K3/4069 , H05K3/4617 , H05K2201/0129 , H05K2201/0154 , H05K2201/0209 , H05K2201/0352 , H05K2201/0391 , H05K2203/0108 , H05K2203/065 , Y02P20/582 , Y10S428/901 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , Y10T428/24917 , Y10T428/249994
摘要： A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C. and an amorphous polyetherimide resin as the primary constituents, a metallic foil is embedded within the grooves so that the surface of the foil protrudes to the surface of the insulating substrate, and a conductive material formed by curing a conductive paste is used for filling the via holes.
摘要翻译：具有耐热性高的多层布线基板，其能够低温熔融而不发生树脂流动，能够实现高精度，细致的导电布线，理想地应用于低体积高混合物制造配置，并且还具有与使用这种多层布线板的半导体装置安装板一起提供对环境的影响很小，以及制造这种多层布线板的方法。在多层布线板中，形成布线电路和通孔的槽形成在由包含结晶熔融峰值温度至少为260℃的聚芳基酮树脂的热塑性树脂组合物形成的绝缘基板和无定形聚醚酰亚胺树脂中主要成分，金属箔被嵌入槽内，使得箔的表面突出到绝缘基板的表面，并且通过固化导电膏形成的导电材料用于填充通孔。

15. 发明申请

US20070092264A1 Visible light control apparatus, visible light control circuit, visible light communication apparatus, and visible light control method 失效
标题翻译：可见光控制装置，可见光控制电路，可见光通信装置和可见光控制方法
公开(公告)号：US20070092264A1
公开(公告)日：2007-04-26
申请号：US11540222
申请日：2006-09-29
申请人： Shuuji Suzuki , Ryuhei Fujiwara
发明人： Shuuji Suzuki , Ryuhei Fujiwara
IPC分类号： H04B10/04
CPC分类号： H04B10/116 , H04B10/1141
摘要： There is provided a visible light control apparatus including: a modulation unit (corresponding to a PPM signal generation circuit, a subcarrier generation circuit, and a first AND circuit) that modulates a subcarrier and thereby generates a modulated signal; a visible light control unit (corresponding to a driving circuit) that controls blinking of visible light which contains information based on the modulated signal modulated by the modulation unit and allows the visible light to be emitted at a predetermined emission time ratio; and an emission time ratio control unit (corresponding to a dimming signal generation circuit, an inverting circuit, a second AND circuit, and an OR circuit) that changes the predetermined emission time ratio and allows the visible light to be emitted at the changed emission time ratio.
摘要翻译：提供了一种可见光控制装置，包括：调制单元（对应于PPM信号生成电路，子载波生成电路和第一AND电路），其对副载波进行调制，从而生成调制信号; 可控光单元（对应于驱动电路），其控制基于由调制单元调制的调制信号的信息的可见光的闪烁，并允许以预定的发射时间比率发射可见光; 以及改变预定发光时间比并允许以改变的发射时间发射可见光的发射时间比率控制单元（对应于调光信号产生电路，反相电路，第二AND电路和OR电路）比。

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