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    • 11. 发明授权
    • Reflective mask blank for EUV lithography
    • EUV光刻用反光罩
    • US08088538B2
    • 2012-01-03
    • US12578648
    • 2009-10-14
    • Kazyuki HayashiKazuo KadowakiMasaki MikamiTakashi Sugiyama
    • Kazyuki HayashiKazuo KadowakiMasaki MikamiTakashi Sugiyama
    • G03F1/00B32B9/00
    • G03F1/24B82Y10/00B82Y40/00G03F1/78
    • Provision of a reflective mask blank for EUV lithography having an absorber layer which has a low reflectance in the wavelength regions of EUV light and pattern inspection light and whose film composition and film thickness are easily controllable to desired ones.A reflective mask blank for EUV lithography, which comprises a substrate, and a reflective layer to reflect EUV light and an absorber layer to absorb EUV light, formed in this order on the substrate, wherein the absorber layer contains tantalum (Ta), boron (B) and silicon (Si), and in the absorber layer, the content of B is at least 1 at. % and less than 5 at. % and the content of Si is from 1 to 25 at. %, and wherein the absorber layer contains no nitrogen (N) or at most 10 at. % of N.
    • 提供用于EUV光刻的反射掩模板,其具有在EUV光和图案检查光的波长区域中具有低反射率的吸收层,并且其膜组成和膜厚度可以容易地控制到期望的。 一种用于EUV光刻的反射掩模板,其包括基板,以及反射层,用于反射EUV光和吸收层,以吸收在基板上依次形成的EUV光,其中吸收层包含钽(Ta),硼( B)和硅(Si),并且在吸收层中,B的含量至少为1个。 %和小于5在。 %,Si的含量为1〜25at。 %,并且其中吸收层不含氮(N)或至多10原子。 %的N.
    • 14. 发明申请
    • REFLECTIVE MASK BLANK FOR EUV LITHOGRAPHY
    • 反射掩蔽空白用于EUV LITHOGRAPHY
    • US20100035165A1
    • 2010-02-11
    • US12578648
    • 2009-10-14
    • KAZUYUKI HAYASHIKAZUO KADOWAKIMASAKI MIKAMITAKASHI SUGIYAMA
    • KAZUYUKI HAYASHIKAZUO KADOWAKIMASAKI MIKAMITAKASHI SUGIYAMA
    • G03F1/00
    • G03F1/24B82Y10/00B82Y40/00G03F1/78
    • Provision of a reflective mask blank for EUV lithography having an absorber layer which has a low reflectance in the wavelength regions of EUV light and pattern inspection light and whose film composition and film thickness are easily controllable to desired ones.A reflective mask blank for EUV lithography, which comprises a substrate, and a reflective layer to reflect EUV light and an absorber layer to absorb EUV light, formed in this order on the substrate, wherein the absorber layer contains tantalum (Ta), boron (B) and silicon (Si), and in the absorber layer, the content of B is at least 1 at. % and less than 5 at. % and the content of Si is from 1 to 25 at. %, and wherein the absorber layer contains no nitrogen (N) or at most 10 at. % of N.
    • 提供用于EUV光刻的反射掩模板,其具有在EUV光和图案检查光的波长区域中具有低反射率的吸收层,并且其膜组成和膜厚度可以容易地控制到期望的。 一种用于EUV光刻的反射掩模板,其包括衬底,以及反射层,用于反射EUV光和吸收层,以吸收EUV光,该衬底依次形成在衬底上,其中吸收层包含钽(Ta),硼( B)和硅(Si),并且在吸收层中,B的含量至少为1个。 %和小于5在。 %,Si的含量为1〜25at。 %,并且其中所述吸收层不含氮(N)或至多10原子。 %的N.