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    • 12. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20120056262A1
    • 2012-03-08
    • US13052028
    • 2011-03-18
    • Wataru SAITOSyotaro OnoShunji TaniuchiMiho WatanabeHiroaki Yamashita
    • Wataru SAITOSyotaro OnoShunji TaniuchiMiho WatanabeHiroaki Yamashita
    • H01L29/78
    • H01L29/7839H01L29/0619H01L29/0623H01L29/0878H01L29/402H01L29/407H01L29/41741H01L29/41766H01L29/4236H01L29/42368H01L29/66727H01L29/66734H01L29/7806H01L29/7811H01L29/7813
    • According to one embodiment, a semiconductor device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a third semiconductor layer of the first conductivity type, an embedded electrode, a control electrode, a fourth semiconductor layer of the second conductivity type, a first main electrode, and a second main electrode. The second semiconductor layer is provided on the first semiconductor layer. The third semiconductor layer is provided on the second semiconductor layer. The embedded electrode is provided in a first trench via a first insulating film. The first trench penetrates through the second semiconductor layer from a surface of the third semiconductor layer to reach the first semiconductor layer. The control electrode is provided above the embedded electrode via a second insulating film in the first trench. The fourth semiconductor layer is selectively provided in the first semiconductor layer and is connected to a lower end of a second trench. The second trench penetrates through the second semiconductor layer from the surface of the third semiconductor layer to reach the first semiconductor layer. The first main electrode is electrically connected to the first semiconductor layer. The second main electrode is provided in the second trench and connected to the second semiconductor layer, the third semiconductor layer and the fourth semiconductor layer. The embedded electrode is electrically connected to one of the second main electrode and the control electrode. A Schottky junction formed of the second main electrode and the first semiconductor layer is formed at a sidewall of the second trench.
    • 根据一个实施例,半导体器件包括第一导电类型的第一半导体层,第二导电类型的第二半导体层,第一导电类型的第三半导体层,嵌入电极,控制电极,第四半导体 第二导电类型的层,第一主电极和第二主电极。 第二半导体层设置在第一半导体层上。 第三半导体层设置在第二半导体层上。 嵌入式电极经由第一绝缘膜设置在第一沟槽中。 第一沟槽从第三半导体层的表面穿过第二半导体层到达第一半导体层。 控制电极通过第一沟槽中的第二绝缘膜设置在嵌入电极的上方。 第四半导体层选择性地设置在第一半导体层中并连接到第二沟槽的下端。 第二沟槽从第三半导体层的表面穿过第二半导体层到达第一半导体层。 第一主电极电连接到第一半导体层。 第二主电极设置在第二沟槽中并连接到第二半导体层,第三半导体层和第四半导体层。 嵌入电极与第二主电极和控制电极中的一个电连接。 在第二沟槽的侧壁处形成由第二主电极和第一半导体层形成的肖特基结。
    • 13. 发明授权
    • Apparatus for controlling packet output
    • 用于控制分组输出的装置
    • US07190674B2
    • 2007-03-13
    • US10281366
    • 2002-10-25
    • Takahiro KobayakawaHiroaki Yamashita
    • Takahiro KobayakawaHiroaki Yamashita
    • H04L12/66H04L12/28H04L12/26
    • H04L49/508H04L47/22H04L47/24H04L47/50H04L47/56H04L49/30H04L49/506
    • In a packet scheduler, an arithmetic-operation controlling means designates output ports in a time-sharing manner and a parallel arithmetic operation means performs an arithmetic operation common with the queues of each designated output port to obtain packet output completion due times (evaluation factors) of the top packets of queues of each output port. Intra-port selecting means selects the evaluation factor of a packet that is to be preferentially output for each output port based on the result of the arithmetic operations. Then inter-port selecting means determines one to be most-preferentially output from the top packets selected based on the selected evaluation factors and the bandwidths for the output ports. Therefore, an apparatus for controlling packet output having such a packet scheduler can realize accurately control bandwidths of a plurality of queues, high-speed processing and the reduced size thereby being incorporated in hardware.
    • 在分组调度器中,算术运算控制装置以分时方式指定输出端口,并行算术运算装置执行与各指定输出端口的队列相同的算术运算,以获得分组输出完成到期(评估因子) 的每个输出端口的最高队列数据包。 内部端口选择装置根据算术运算的结果,选择要对每个输出端口优先输出的分组的评估因子。 然后,端口间选择装置根据所选择的评估因子和输出端口的带宽确定从最高分组选出的最优先输出。 因此,具有这种分组调度器的用于控制分组输出的装置可以精确地实现多个队列的控制带宽,高速处理和减小的尺寸,从而被并入硬件。
    • 17. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08829608B2
    • 2014-09-09
    • US13051987
    • 2011-03-18
    • Wataru SaitoSyotaro OnoShunji TaniuchiMiho WatanabeHiroaki Yamashita
    • Wataru SaitoSyotaro OnoShunji TaniuchiMiho WatanabeHiroaki Yamashita
    • H01L29/78
    • H01L29/7813H01L29/0865H01L29/0878H01L29/1095H01L29/407H01L29/42372H01L29/66734
    • According to one embodiment, a semiconductor device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of the first conductivity type, a third semiconductor layer of a second conductivity type, a fourth semiconductor layer of the second conductivity type, a fifth semiconductor layer of the first conductivity type, a control electrode, a first main electrode, a second main electrode, and a sixth semiconductor layer of the first conductivity type. The second semiconductor layer and the third semiconductor layer are alternately provided on the first semiconductor layer in a direction substantially parallel to a major surface of the first semiconductor layer. The fourth semiconductor layer is provided on the second semiconductor layer and the third semiconductor layer. The fifth semiconductor layer is selectively provided on a surface of the fourth semiconductor layer. The control electrode is provided in a trench via an insulating film. The trench penetrates through the fourth semiconductor layer from a surface of the fifth semiconductor layer and is in contact with the second semiconductor layer. The first main electrode is connected to the first semiconductor layer. The second main electrode is connected to the fourth semiconductor layer and the fifth semiconductor layer. The sixth semiconductor layer is provided between the fourth semiconductor layer and the second semiconductor layer. An impurity concentration of the sixth semiconductor layer is higher than an impurity concentration of the second semiconductor layer.
    • 根据一个实施例,半导体器件包括第一导电类型的第一半导体层,第一导电类型的第二半导体层,第二导电类型的第三半导体层,第二导电类型的第四半导体层, 第一导电类型的第五半导体层,第一导电类型的控制电极,第一主电极,第二主电极和第六半导体层。 第二半导体层和第三半导体层在与第一半导体层的主表面大致平行的方向上交替地设置在第一半导体层上。 第四半导体层设置在第二半导体层和第三半导体层上。 第五半导体层选择性地设置在第四半导体层的表面上。 控制电极通过绝缘膜设置在沟槽中。 沟槽从第五半导体层的表面穿过第四半导体层并且与第二半导体层接触。 第一主电极连接到第一半导体层。 第二主电极连接到第四半导体层和第五半导体层。 第六半导体层设置在第四半导体层和第二半导体层之间。 第六半导体层的杂质浓度高于第二半导体层的杂质浓度。
    • 20. 发明授权
    • Filter having internally threaded cover non-rotatably mounted to casing
of the filter
    • 过滤器具有不可旋转地安装到过滤器壳体上的内螺纹盖
    • US5593577A
    • 1997-01-14
    • US328267
    • 1994-09-30
    • Koji ImaiToshiya WakahoiHiromitsu AdachiKeiichi TeradaHiroaki YamashitaHiroshi Morikawa
    • Koji ImaiToshiya WakahoiHiromitsu AdachiKeiichi TeradaHiroaki YamashitaHiroshi Morikawa
    • B01D35/147B01D35/30
    • B01D35/147B01D2201/302B01D2201/40B01D2201/4076
    • A filter includes a case, filtering material housed within the case, a cover which covers the open end of the case and is non-rotatable relative to the case, and an annular fastener clamping the cover to the case. The case includes a large-diameter portion at an open end of the case, the large-diameter portion including a convexity forming an engagement tab. The cover has a concavity into which the convexity is received to prevent the cover from rotating relative to the case. Moreover, the cover includes a screw thread on the outer periphery thereof. The annular fastener has a screw thread on the inner periphery thereof mated with the screw thread on the outer periphery of the cover. On the other hand, the annular fastener has a small-diameter portion engaged with the large-diameter portion of the case by which engagement and mating of the screw threads the annular fastener secures the cover to the case. By preventing relative rotation between the cover and the case, the filter can be easily installed by being screwed onto a threaded member of an automotive engine or the like.
    • 过滤器包括壳体,容纳在壳体内的过滤材料,覆盖壳体的开口端并且相对于壳体不可旋转的盖子以及将盖子夹紧到壳体的环形紧固件。 该壳体包括在壳体的开口端处的大直径部分,大直径部分包括形成接合突片的凸部。 盖具有凹部,凹部被接收到其中以防止盖相对于壳体旋转。 此外,盖子在其外周上包括螺纹。 环形紧固件在其内周上具有与螺纹外壳上的螺纹配合的螺纹。 另一方面,环形紧固件具有与壳体的大直径部分接合的小直径部分,通过该小直径部分,螺纹与环形紧固件的接合和配合将盖固定到壳体。 通过防止盖和壳体之间的相对旋转,可以通过旋拧到汽车发动机等的螺纹构件上来容易地安装过滤器。