会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 12. 发明授权
    • Solder handling assembly
    • 焊接处理组件
    • US09314863B2
    • 2016-04-19
    • US13666745
    • 2012-11-01
    • Hakko Corporation
    • Yoshitomo Teraoka
    • B23K3/00H05B1/02B23K3/03
    • B23K3/033
    • A solder handling assembly comprises a heating portion, a casing, a variable resistor, a connecting member coupled to the variable resistor, and an elastic-resilient member movable from a first state to a second state. The connecting member is rotatable relative to the casing and is configured to adjust a resistor value of the variable resistor when the connecting member is rotated relative to casing. When the elastic-resilient member is in the first state, the connecting member is prevented from rotating relative to the casing. When the elastic-resilient member is in the second state, the connecting member can be rotated relative to the casing.
    • 焊料处理组件包括加热部分,壳体,可变电阻器,耦合到可变电阻器的连接部件以及可从第一状态移动到第二状态的弹性部件。 连接构件可相对于壳体旋转,并且构造成当连接构件相对于壳体旋转时,调节可变电阻器的电阻值。 当弹性构件处于第一状态时,防止连接构件相对于壳体旋转。 当弹性构件处于第二状态时,连接构件能够相对于壳体旋转。