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11. 发明申请

US20050053849A1 Electrochemical fabrication method for producing compliant beam-like structures 审中-公开
标题翻译：用于生产符合梁状结构的电化学制造方法
公开(公告)号：US20050053849A1
公开(公告)日：2005-03-10
申请号：US10883891
申请日：2004-07-02
申请人： Adam Cohen , Michael Lockard , Christopher Bang , Marvin Kilgo
发明人： Adam Cohen , Michael Lockard , Christopher Bang , Marvin Kilgo
IPC分类号： B23H3/00 , B23H9/00 , C25D1/00 , C25D5/02 , C25D5/10 , G03F7/00 , G03F9/00
CPC分类号： C25D1/003 , B23H3/00 , B23H9/00 , C25D5/022 , C25D5/10 , G03F7/00
摘要： Embodiments of the invention are directed to the formation of beam-like structures using electrochemical fabrication techniques where the beam like structures have narrow regions and wider regions such that a beam of desired compliance is obtained. In some embodiments, narrower regions of the beam are thinner than a minimum feature size but are formable as a result of the thicker regions. In some embodiments the beam-like structures are formed from a plurality of adhered layers.
摘要翻译：本发明的实施例涉及使用电化学制造技术形成束状结构，其中束状结构具有窄区域和较宽区域，使得获得所需柔性束。在一些实施例中，光束的较窄区域比最小特征尺寸更薄，但是由于较厚的区域而可形成。在一些实施例中，束状结构由多个粘附层形成。

12. 发明申请

US20080106280A1 Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes 审中-公开
标题翻译：用于接触电子元件的垂直微孔及其制造方法
公开(公告)号：US20080106280A1
公开(公告)日：2008-05-08
申请号：US11928707
申请日：2007-10-30
申请人： Richard Chen , Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Kieun Kim , Gang Zhang , Dennis Smalley
发明人： Richard Chen , Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Kieun Kim , Gang Zhang , Dennis Smalley
IPC分类号： G01R1/067
CPC分类号： G01R3/00 , A61N1/00 , C25D1/00 , C25D1/003 , G01R1/06722 , G01R1/06744 , G01R1/06761
摘要： Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both.
摘要翻译：用于测试或以其他方式与半导体管芯或其他电子部件进行电接触的多层探针结构通过在多个覆盖层和附着层中的一种或多种材料的沉积进行电化学制造。在一些实施例中，结构可以包括旨在增强功能性，可构建性或两者的配置。

13. 发明申请

US20080093424A1 Probe Arrays and Method for Making 有权
公开(公告)号：US20080093424A1
公开(公告)日：2008-04-24
申请号：US11929539
申请日：2007-10-30
申请人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
发明人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
IPC分类号： B29C65/00 , B23K35/12
CPC分类号： B23K35/0222 , C23C18/1605 , C23C18/1651 , C25D1/003 , C25D1/12 , G01R1/06744 , G01R1/07307 , G01R1/07314 , G01R3/00 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2221/68363 , H01L2224/0401 , H01L2224/05568 , H01L2224/10126 , H01L2224/1147 , H01L2224/11831 , H01L2224/1184 , H01L2224/1191 , H01L2224/13017 , H01L2224/13018 , H01L2224/13076 , H01L2224/131 , H01L2224/1403 , H01L2224/81001 , H01L2224/81054 , H01L2224/81136 , H01L2224/8121 , H01L2224/8181 , H01L2224/81815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3651 , H01L2924/3841 , H01L2224/13099 , H01L2224/29099 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

14. 发明申请

US20080062638A1 Monolithic Structures Including Alignment and/or Retention Fixtures for Accepting Components 有权
标题翻译：包括用于接受部件的对准和/或保持夹具的整体结构
公开(公告)号：US20080062638A1
公开(公告)日：2008-03-13
申请号：US11685118
申请日：2007-03-12
申请人： Adam Cohen , Daniel Feinberg , Christopher Bang
发明人： Adam Cohen , Daniel Feinberg , Christopher Bang
IPC分类号： H05K7/02 , H05K7/20
CPC分类号： B81C3/002 , B81B2201/042 , B81C3/008 , B81C2203/051 , G01P1/023 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H01P11/007 , H05K3/4647
摘要： Permanent or temporary alignment and/or retention structures for receiving multiple components are provided. The structures are preferably formed monolithically via a plurality of deposition operations (e.g. electrodeposition operations). The structures typically include two or more positioning fixtures that control or aid in the positioning of components relative to one another, such features may include (1) positioning guides or stops that fix or at least partially limit the positioning of components in one or more orientations or directions, (2) retention elements that hold positioned components in desired orientations or locations, and/or (3) positioning and/or retention elements that receive and hold adjustment modules into which components can be fixed and which in turn can be used for fine adjustments of position and/or orientation of the components.
摘要翻译：提供用于接收多个部件的永久或临时对准和/或保持结构。优选地，这些结构通过多个沉积操作（例如电沉积操作）一体地形成。结构通常包括两个或更多个控制或辅助部件相对于彼此的定位的定位夹具，这些特征可以包括（1）定位引导件或止动件，其固定或至少部分地限制部件在一个或多个取向中的定位或方向，（2）将定位的部件保持在期望的取向或位置的保持元件，和/或（3）接收和保持调节模块的定位和/或保持元件，组件可以被固定到其中，微调零件的位置和/或取向。

15. 发明申请

US20070199822A1 Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns 审中-公开
标题翻译：使用牺牲金属图案模制结构的方法和设备
公开(公告)号：US20070199822A1
公开(公告)日：2007-08-30
申请号：US11621429
申请日：2007-01-09
申请人： Christopher Bang
发明人： Christopher Bang
IPC分类号： C25D1/00
CPC分类号： G01P15/0802 , B33Y10/00 , B81B2201/042 , B81C99/0085 , B81C2201/0107 , B81C2201/0109 , B81C2201/0197 , G01P15/125
摘要： Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.
摘要翻译：提供了模制结构，制造模制结构的方法和设备。用于模具的表面特征的至少一部分由多层电化学制造的结构（例如通过EFAB TM形成工艺制造）形成，并且通常包含具有在1至100μm范围内的分辨率的特征。根据需要，将层状结构与其他模具部件组合，并将模塑材料注入模具中并硬化。层压结构与任何其它模具部件一起被除去（例如通过蚀刻）以产生模塑制品。在一些实施例中，分层结构的部分保留在模制品中，并且在其它实施例中，在部分或完全去除层状结构之后添加另外的模制材料。

16. 发明申请

US20080105558A1 Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures 审中-公开
标题翻译：电化学制造的密封微结构，以及用于生产这种结构的方法和装置
公开(公告)号：US20080105558A1
公开(公告)日：2008-05-08
申请号：US11927680
申请日：2007-10-30
申请人： Adam Cohen , Michael Lockard , Dennis Smalley , Vacit Arat , Christopher Bang , John Dixon
发明人： Adam Cohen , Michael Lockard , Dennis Smalley , Vacit Arat , Christopher Bang , John Dixon
IPC分类号： C25D5/10
CPC分类号： B81C1/00293 , B81B2201/042 , B81C1/00333 , B81C2201/0197 , B81C2203/0145 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647
摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.
摘要翻译：在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。密封材料位于开口附近。在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。此后，使密封材料流动，密封开口并重新固化。在其他实施例中，添加了后层形成盖或其它外壳完成结构。

17. 发明申请

US20070045121A1 Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures 审中-公开
标题翻译：电化学制造的密封微结构，以及用于生产这种结构的方法和装置
公开(公告)号：US20070045121A1
公开(公告)日：2007-03-01
申请号：US11435809
申请日：2006-05-16
申请人： Adam Cohen , Michael Lockard , Dennis Smalley , Vacit Arat , Christopher Bang , John Dixon
发明人： Adam Cohen , Michael Lockard , Dennis Smalley , Vacit Arat , Christopher Bang , John Dixon
IPC分类号： C25D5/02
CPC分类号： B81C1/00293 , B81B2201/042 , B81C1/00333 , B81C2201/0197 , B81C2203/0145 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647
摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.
摘要翻译：在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。密封材料位于开口附近。在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。此后，使密封材料流动，密封开口并重新固化。在其他实施例中，添加了后层形成盖或其它外壳完成结构。

18. 发明申请

US20050189958A1 Cantilever microprobes for contacting electronic components and methods for making such probes 审中-公开
标题翻译：用于接触电子部件的悬臂微型纺织品和用于制造这种探针的方法
公开(公告)号：US20050189958A1
公开(公告)日：2005-09-01
申请号：US11029171
申请日：2005-01-03
申请人： Richard Chen , Ezekiel Kruglick , Christopher Bang , Dennis Smalley , Pavel Lembrikov
发明人： Richard Chen , Ezekiel Kruglick , Christopher Bang , Dennis Smalley , Pavel Lembrikov
IPC分类号： G01R31/02
CPC分类号： G01R1/06727 , G01R1/06738 , G01R1/07357 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
摘要翻译：本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。具体地，实施例涉及悬臂式探针结构的各种设计。一些实施例涉及制造这种悬臂结构的方法。在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗能力和/或类似物。

19. 发明授权

US6076409A Media compatible packages for pressure sensing devices 失效
标题翻译：用于压力传感装置的介质兼容包装
公开(公告)号：US6076409A
公开(公告)日：2000-06-20
申请号：US995829
申请日：1997-12-22
申请人： Christopher Bang
发明人： Christopher Bang
IPC分类号： G01L9/04 , G01L9/00 , G01L19/06 , G01L7/00
CPC分类号： G01L19/143 , G01L19/0038 , G01L19/0645
摘要： Media compatible packages for pressure sensing devices include molded polymeric housings and diaphragms which mount and isolate pressure sensing devices in operative contact with any type of corrosive or non-corrosive media for pressure measurement. The various pressure sensor package housings include a main cavity in which a pressure sensor is mounted, a polymeric diaphragm bonded to the housing within the main cavity, at least one media port which leads to a pressure port on one side of the diaphragm, and a pressure transfer cavity on an opposite side of the diaphragm in which a pressure sensor is located. A fill port through a wall of the housing between the diaphragm and the pressure sensor allows the pressure transfer cavity to be filled with a pressure transfer medium such as oil and then sealed, without introducing any excess pressure. The use of bondable polymers to form the housing and thin film diaphragms provides excellent media compatibility for pressure measurements in corrosive environments. Differential dual port packages having a media conduit and diaphragm on opposite sides of a single sensor are also provided. Internal walls of the connectable halves of the pressure sensor housing are configured to capture, position and hold a pressure sensing device within a main cavity of the housing, and to form at least one pressure transfer cavity between a pressure sensing device and a diaphragm.
摘要翻译：用于压力感测装置的介质兼容包装包括模制的聚合物壳体和隔膜，其安装和隔离与任何类型的腐蚀性或非腐蚀性介质压力测量有效接触的压力感测装置。各种压力传感器封装壳体包括其中安装有压力传感器的主腔，在主空腔内结合到壳体的聚合膜，至少一个通向隔膜一侧的压力端口的介质口，以及在压力传感器所在的膜片的相对侧上的压力传递腔。通过隔膜和压力传感器之间的壳体的壁的填充口允许压力传递腔填充有诸如油的压力传递介质，然后密封，而不引入任何过量的压力。使用可结合的聚合物形成外壳和薄膜隔膜为腐蚀性环境中的压力测量提供了出色的介质兼容性。还提供了在单个传感器的相对侧上具有介质导管和隔膜的差分双端口封装。压力传感器壳体的可连接半部的内壁构造成在壳体的主腔内捕获，定位和保持压力感测装置，并且在压力感测装置和隔膜之间形成至少一个压力传递空腔。

20. 发明申请

US20080108221A1 Microprobe Tips and Methods for Making 审中-公开
标题翻译：微型技巧和制作方法
公开(公告)号：US20080108221A1
公开(公告)日：2008-05-08
申请号：US11931308
申请日：2007-10-31
申请人： Kieun Kim , Adam Cohen , Willa Larsen , Richard Chen , Ananda Kumar , Ezekiel Kruglick , Vacit Arat , Gang Zhang , Michael Lockard , Christopher Bang
发明人： Kieun Kim , Adam Cohen , Willa Larsen , Richard Chen , Ananda Kumar , Ezekiel Kruglick , Vacit Arat , Gang Zhang , Michael Lockard , Christopher Bang
IPC分类号： H01L21/44
CPC分类号： C25D1/00 , C25D1/003 , C25D7/123
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.
摘要翻译：本发明的实施例涉及形成具有各种构造的微探针尖元件。在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制，由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

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