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    • 14. 发明授权
    • Method and apparatus for combined particle location and removal
    • 用于组合颗粒定位和去除的方法和装置
    • US06356653B2
    • 2002-03-12
    • US09116680
    • 1998-07-16
    • Jeffrey A. BriganteGlenn W. GaleMaurice R. HeveyFrederick W. Kern, Jr.Ben KimJoel M. SharrowWilliam A. Syverson
    • Jeffrey A. BriganteGlenn W. GaleMaurice R. HeveyFrederick W. Kern, Jr.Ben KimJoel M. SharrowWilliam A. Syverson
    • G06K900
    • H01L22/20H01L21/268
    • A method for removing one or more particles from a surface of an object is provided. The method has first and second steps of detecting and locating the one or more particles on the surface of the object. In a third step, focused energy is directed onto one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface. In preferred variations of the method of the present invention, the object is a semiconductor wafer and the directed focused energy is in the form of a laser. Also provided is an apparatus for removing the plurality of particles from the surface of the object. The apparatus includes a detector for detecting and locating the plurality of particles on the surface of the object, and a laser for directing focused energy on one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface.
    • 提供了从物体表面去除一个或多个颗粒的方法。 该方法具有检测和定位物体表面上的一个或多个颗粒的第一和第二步骤。 在第三步骤中,将聚焦的能量引导到一个或多个检测到的颗粒上以破坏一个或多个颗粒与表面之间的键能,从而从表面除去一个或多个颗粒。 在本发明方法的优选变型中,目的是半导体晶片,并且定向的聚焦能是激光的形式。 还提供了用于从物体的表面去除多个颗粒的装置。 该装置包括用于检测和定位物体表面上的多个颗粒的检测器和用于将聚焦能量引导到一个或多个检测到的颗粒上的激光器,以破坏一个或多个颗粒与表面之间的结合能,由此 从表面去除一个或多个颗粒。
    • 19. 发明授权
    • Cleaning with liquified gas and megasonics
    • 用液化天然气和超声波清洗
    • US06343609B1
    • 2002-02-05
    • US09133889
    • 1998-08-13
    • Ben Kim
    • Ben Kim
    • B08B310
    • H01L21/67051B08B3/02B08B7/0021B08B2203/0288Y10S134/902
    • An apparatus and method are provided for cleaning (removing) contaminating particles and/or films from substrate surfaces such as semiconductor wafers during the fabrication process for making electronic components. The method and apparatus use a liquified gas contained in a distributor which has been energized with megasonic energy in the distributor and the energized liquefied gas directed as a stream against the surface to be cleaned from an outlet distribution nozzle of the distributor. The stream is preferably impinged on the substrate surface at an acute angle. The preferred liquified gas is carbon dioxide.
    • 提供了一种装置和方法,用于在用于制造电子部件的制造过程中,从诸如半导体晶片的衬底表面清洁(去除)污染颗粒和/或膜。 该方法和装置使用包含在分配器中的液化气体,该分配器已经在分配器中以兆声波能量通电,并且通电的液化气体以与分配器的出口分配喷嘴相对的待清洁表面相反的方式指向。 流优选以锐角撞击在基板表面上。 优选的液化气体是二氧化碳。