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11. 发明申请

US20070128990A1 Semiconductor wafer polishing apparatus, and method of polishing semiconductor wafer 有权
公开(公告)号：US20070128990A1
公开(公告)日：2007-06-07
申请号：US11600857
申请日：2006-11-17
申请人： Akira Kubo
发明人： Akira Kubo
IPC分类号： B24B1/00 , B24B29/00
CPC分类号： B24B9/065
摘要： Aimed at thoroughly preventing abrasive and dusts from adhering onto the circuit-forming region of a wafer, improving yield ratio of semiconductor devices, and thereby improving operation rates of the individual manufacturing apparatuses in the succeeding stage, a semiconductor wafer polishing apparatus of the present invention has a polishing unit polishing the circumferential edge side of a disc-formed wafer; and a gas blowing unit blowing a gas G against the surface of the wafer, so as to separate the space over the wafer by a curtain C of the gas G between a polishing field PF in which the wafer is polished by the polishing unit and a normal field NF except the polishing field PF.

12. 外观设计

USD538748S1 Flat cable coupler 有权
标题翻译：扁平电缆耦合器
公开(公告)号：USD538748S1
公开(公告)日：2007-03-20
申请号：US29236137
申请日：2005-08-11
申请人： Akira Kubo , Masata Umehara
设计人： Akira Kubo , Masata Umehara

13. 发明授权

US07189090B2 Coupler for flat cables and electrical connector assembly 失效
标题翻译：扁平电缆和电连接器组件的耦合器
公开(公告)号：US07189090B2
公开(公告)日：2007-03-13
申请号：US11261881
申请日：2005-10-28
申请人： Masayuki Aizawa , Akira Kubo , Isao Igarashi
发明人： Masayuki Aizawa , Akira Kubo , Isao Igarashi
IPC分类号： H01R13/15
CPC分类号： H01R12/62 , H01R12/58 , H01R12/61 , H01R13/6581
摘要： A coupler for an electrical connector assembly includes first and second holding members that mate to fix a flexible flat cable therebetween. At least one of the first or second holding members has an inner surface provided with a metallic shell that contacts an exposed grounding member of the flexible flat cable. The metallic shell has a contact member extending therefrom that engages a metallic shielding shell on a housing of an electrical connector.
摘要翻译：一种用于电连接器组件的耦合器包括第一和第二保持构件，其配合以将柔性扁平电缆固定在它们之间。第一或第二保持构件中的至少一个具有设置有与柔性扁平电缆的暴露的接地构件接触的金属壳的内表面。金属外壳具有从其延伸的接触构件，其接合电连接器的壳体上的金属屏蔽外壳。

14. 发明申请

US20060290945A1 Three-dimensional measuring system 失效
公开(公告)号：US20060290945A1
公开(公告)日：2006-12-28
申请号：US11268948
申请日：2005-11-08
申请人： Akira Kubo , Shinichi Horita , Yoshihisa Abe
发明人： Akira Kubo , Shinichi Horita , Yoshihisa Abe
IPC分类号： G01B11/24
CPC分类号： G01B21/04
摘要： A three-dimensional measuring system for measuring a three-dimensional shape of a measurement object in a noncontact manner includes a first obtaining portion for obtaining arrangement information of the measurement object, a second obtaining portion for obtaining design shape information of the measurement object, a fourth obtaining portion for obtaining specifics information about one or more three-dimensional measuring devices, a determining portion for determining a measurable part that can be measured by the three-dimensional measuring device about a surface shape of the measurement object in accordance with the obtained arrangement information, the obtained design shape information and the obtained specifics information, and an output portion for outputting the determined measurable part.

15. 发明授权

US06558782B1 Flexible graphite sheet and method of producing the same 有权
标题翻译：柔性石墨片及其制造方法
公开(公告)号：US06558782B1
公开(公告)日：2003-05-06
申请号：US09551298
申请日：2000-04-18
申请人： Anatoliy S. Bakman , Akira Kubo
发明人： Anatoliy S. Bakman , Akira Kubo
IPC分类号： B32B900
CPC分类号： F16J15/022 , C04B35/536 , F16J15/102 , F16J15/3496 , F28F2230/00 , Y10S277/938 , Y10S277/944 , Y10S277/945 , Y10T428/249928 , Y10T428/24994 , Y10T428/26 , Y10T428/2918 , Y10T428/30
摘要： Flexible graphite article of manufacture made by compressing a mixture of expanded graphite particle and a fluoro-resin including ethylene-tetrafluoroethylene (ETFE) copolymers after additional heat treatment. An article of manufacture of a gasket material made shows enhanced mechanical properties especially after oil immersion and reduced leakage.
摘要翻译：通过在额外的热处理后压缩膨胀石墨颗粒和包括乙烯 - 四氟乙烯（ETFE）共聚物的氟树脂的混合物制成的柔性石墨制品。制造的垫圈材料制品显示出增强的机械性能，特别是在油浸和减少渗漏之后。

16. 发明授权

US06555223B2 Graphite structure with increased flexibility 失效
公开(公告)号：US06555223B2
公开(公告)日：2003-04-29
申请号：US09521262
申请日：2000-03-08
申请人： Akira Kubo
发明人： Akira Kubo
IPC分类号： B32B900
CPC分类号： B32B9/007 , B32B9/04 , B32B15/04 , B32B37/156 , B32B2305/38 , B32B2315/02 , C04B35/536 , C04B37/04 , C04B2235/3427 , C04B2235/3445 , C04B2237/363 , C04B2237/406 , Y10T428/30 , Y10T428/31
摘要： An article of manufacture including a graphite sheet having a texturized surface. The article of manufacture comprises, in one embodiment, about 90 to 99 percent vermicular graphite and about 1 to 10 percent of a filler (e.g., talc or mica). The article of manufacture may also include an insert in the form of a sheet of, for example, stainless steel, polyester film, or fiberglass fabric. Also, a method including combining an article having a surface texture with a graphite sheet, and imparting the surface texture to a surface of the graphite sheet.

17. 发明授权

US06541389B1 Method of patterning a thin layer by chemical etching 失效
标题翻译：通过化学蚀刻图案化薄层的方法
公开(公告)号：US06541389B1
公开(公告)日：2003-04-01
申请号：US09469166
申请日：1999-12-21
申请人： Akira Kubo , Kiyotsugu Mizouchi , Masahiko Machida
发明人： Akira Kubo , Kiyotsugu Mizouchi , Masahiko Machida
IPC分类号： H01L21302
CPC分类号： H01L29/78669 , C23F1/02 , H01L21/28008 , H01L21/32134 , H01L27/12 , H01L27/124 , H01L29/4908 , H01L29/66765
摘要： A method of patterning a thin layer into a predetermined shape on the basis of a pattern layer arranged in a thin layer formed in a substrate comprises a first step of soaking the substrate in a first solution to etch off the thin layer on the basis of the pattern layer, a second step of spraying a second solution having the same composition as that of an etching solution used in a third step to wash the substrate, and a third step of soaking the substrate in a third solution to further etch the thin layer.
摘要翻译：基于布置在形成在基板中的薄层中的图案层将薄层图案化成预定形状的方法包括：将基板浸入第一溶液中的第一步骤，以基于图案层，第二步骤，喷涂具有与在第三步骤中使用的蚀刻溶液相同的组成的第二溶液以洗涤衬底;以及第三步骤，将衬底浸泡在第三溶液中以进一步蚀刻薄层。

18. 发明授权

US06488514B2 Electrical connectors equipped with guiding column and guiding aperture, respectively 失效
标题翻译：电连接器分别装有引导柱和引导孔
公开(公告)号：US06488514B2
公开(公告)日：2002-12-03
申请号：US09906620
申请日：2001-07-18
申请人： Akira Kubo , Yasuhiro Enami
发明人： Akira Kubo , Yasuhiro Enami
IPC分类号： H01R13648
CPC分类号： H01R12/716 , H01R13/658
摘要： An electrical connector equipped with a guiding column comprises a housing (21); at least one guiding column (23) extending forwardly from the housing (21) to be inserted into a guiding aperture (14B) of a mating connector (10); at least one ground terminal (24) having a contact section (24A) for contact with a ground member (12) of the mating connector (12); and a side recess (23B) provided in the guiding column (23) to receive the ground terminal (24) such that the contact section (24A) of the ground terminal (24) projects from the side recess (23B) for making sliding contact with the ground member (12) of the mating connector (10).
摘要翻译：具有引导柱的电连接器包括壳体（21）; 至少一个引导柱（23），其从所述壳体（21）向前延伸以插入到配合连接器（10）的引导孔（14B）中; 至少一个接地端子（24）具有用于与所述配合连接器（12）的接地构件（12）接触的接触部分（24A）。以及设置在引导柱（23）中以接收接地端子（24）的侧凹部（23B），使得接地端子（24）的接触部分（24A）从侧凹部（23B）突出以进行滑动接触与配合连接器（10）的接地构件（12）连接。

19. 发明授权

US06361708B1 Method and apparatus for polishing a metal film 失效
标题翻译：抛光金属膜的方法和装置
公开(公告)号：US06361708B1
公开(公告)日：2002-03-26
申请号：US09078559
申请日：1998-05-14
申请人： Akira Kubo , Mieko Suzuki
发明人： Akira Kubo , Mieko Suzuki
IPC分类号： H01L21302
CPC分类号： B24B37/042 , H01L21/3212 , H01L21/32134
摘要： A method and an apparatus for polishing a metal film formed on a semiconductor device are disclosed. A semiconductor wafer is immersed in an oxidizing solution before it is polished. As a result, the undesirable part of a W film deposited on the circumferential edge of the wafer is removed by etching.
摘要翻译：公开了一种用于抛光形成在半导体器件上的金属膜的方法和设备。将半导体晶片在抛光之前浸入氧化溶液中。结果，通过蚀刻去除沉积在晶片的圆周边缘上的W膜的不期望的部分。

20. 发明授权

US06132292A Chemical mechanical polishing method suitable for highly accurate planarization 有权
标题翻译：化学机械抛光方法适用于高精度平面化
公开(公告)号：US06132292A
公开(公告)日：2000-10-17
申请号：US161218
申请日：1998-09-28
申请人： Akira Kubo
发明人： Akira Kubo
IPC分类号： H01L21/3205 , B24B37/04 , H01L21/304 , H01L21/321 , H01L21/768 , B24B1/00
CPC分类号： B24B37/04 , H01L21/3212 , H01L21/7684
摘要： A method of forming interconnection layers within grooves of an insulating layer. The method includes the steps of: forming grooves in an upper portion of an insulating layer; depositing a conductive layer over a surface of the insulating layer and also within the grooves; and subjecting the conductive layer to a chemical mechanical polishing for polishing the conductive layer, so as to leave the conductive layer only within the grooves, thereby forming interconnection layers in the grooves. The chemical mechanical polishing is carried out by use of a polishing pad having a polyurethane foam polishing pad surface at a down pressure of no more than 420 gwt/cm.sup.2.
摘要翻译：在绝缘层的槽内形成互连层的方法。该方法包括以下步骤：在绝缘层的上部形成沟槽; 在绝缘层的表面上以及沟槽内沉积导电层; 并且对导电层进行化学机械抛光以抛光导电层，以便仅将导电层留在沟槽内，从而在槽中形成互连层。化学机械抛光通过使用具有聚氨酯泡沫抛光垫表面的抛光垫在不超过420g / cm 2的压力下进行。

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