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    • 12. 发明申请
    • METHOD FOR PRODUCING AN OPTOELECTRONIC DEVICE
    • 生产光电器件的方法
    • US20170018695A1
    • 2017-01-19
    • US15120504
    • 2015-02-10
    • OSRAM Opto Semiconductors GmbH
    • Siegfried HERRMANNNorwin VON MALM
    • H01L33/62H01L25/075H01L25/00H01L33/48
    • H01L33/62H01L25/075H01L25/50H01L33/0095H01L33/486H01L2224/16225H01L2224/97H01L2933/0033H01L2933/0066
    • A method for manufacturing an opto-electronic component (100) is given, comprising a provision of a carrier (1) with at least one mounting surface (11), a generation of at least two vias (4) in the carrier (1) with electrically conducting contacts (12, 13) running through the vias (4), a provision of at least one light-emitting semiconductor chip (2), wherein the semiconductor chip (2) comprises a growth substrate (10) and a layer sequence (7) epitaxially grown thereon, a mounting of the at least one semiconductor chip (2) onto the at least one mounting surface (11) of the carrier (1), wherein the semiconductor chip (2) is connected in an electrically conducting manner to the contacts (12, 13) in the same method step during the mounting onto the mounting surface (11), an isolation of the carrier (1) along isolation lines (V), wherein an isolation line (V) runs through at least one of the vias (4), so that, after the isolation, the contacts (12, 13) form contact surfaces (5) at at least one side surface (1a) of the carrier (1), wherein the side surface (1a) is perpendicular to the mounting surface (11) of the carrier (1), and a mounting of the carrier (1) with the contact surfaces (5) on a connection plate (8), wherein the mounting surface (11) is perpendicular to the connection plate (8).
    • 给出了一种用于制造光电子部件(100)的方法,包括提供具有至少一个安装表面(11)的载体(1),在载体(1)中产生至少两个通孔(4) 具有穿过所述通孔(4)的导电触头(12,13),提供至少一个发光半导体芯片(2),其中所述半导体芯片(2)包括生长衬底(10)和层序列 (7),将所述至少一个半导体芯片(2)安装在所述载体(1)的所述至少一个安装表面(11)上,其中所述半导体芯片(2)以导电方式连接 在安装到安装表面(11)上的同一方法步骤中将触点(12,13)分离到触点(12,13)上,沿着隔离线(V)隔离载体(1),其中隔离线(V)至少穿过 一个通孔(4),使得在隔离之后,触点(12,13)至少形成接触表面(5) 所述载体(1)的一个侧表面(1a),其中所述侧表面(1a)垂直于所述载体(1)的安装表面(11),并且所述载体(1)与所述接触表面 5)在连接板(8)上,其中安装表面(11)垂直于连接板(8)。