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11. 发明授权

US6062961A Wafer polishing head drive 失效
标题翻译：晶圆抛光头驱动
公开(公告)号：US6062961A
公开(公告)日：2000-05-16
申请号：US964817
申请日：1997-11-05
申请人： Linh X. Can , Kelvin Lum , Gregory A. Appel
发明人： Linh X. Can , Kelvin Lum , Gregory A. Appel
IPC分类号： B24B21/04 , B24B37/04 , B24B41/06
CPC分类号： B24B37/04 , B24B21/04
摘要： A wafer polisher head drive includes a head drive housing; a head portion extending from the housing for mounting an unpolished wafer when the head drive housing and head portion are in a horizontal orientation; a pivot mechanism extending from the head drive housing for pivoting the head drive housing and the head portion from the horizontal orientation to a vertical orientation juxtaposed to a transverse vertical portion of a continuous rotating polishing belt; a drive in the housing for moving the head portion and a mounted wafer outwardly from the housing against the transverse vertical portion of the rotating polishing belt; and a drive in the housing for rotating the head portion and the mounted wafer. The head drive housing may be pivoted from the vertical orientation in a sweeping arc extending perpendicularly from the belt transverse vertical portion or in a swinging arc extending parallel from the belt transverse vertical portion. The pivot mechanism includes a hollow shaft connected to said head drive housing; and a motor, gearbox and a ball screw and nut assembly in driving connection between the gearbox and the hollow shaft for transversing in a direction parallel to the belt.
摘要翻译：晶片抛光头驱动器包括头驱动器壳体; 当所述头驱动器壳体和头部部分处于水平方向时，从所述壳体延伸的用于安装未抛光晶片的头部; 从所述头驱动壳体延伸的枢转机构，用于将所述头驱动器壳体和所述头部部分从所述水平定向枢转到与所述连续旋转抛光带的横向垂直部分并置的垂直取向; 壳体中的驱动器，用于将头部部分和安装的晶片从壳体向外移动旋转抛光带的横向垂直部分; 以及用于旋转头部和安装的晶片的壳体中的驱动。头驱动器壳体可以从垂直于带横向垂直部分或从带横向垂直部分平行延伸的摆动弧中扫掠的弧线从竖直方向枢转。枢转机构包括连接到所述头驱动器壳体的空心轴; 以及在齿轮箱和中空轴之间的驱动连接中的马达，齿轮箱和滚珠丝杠和螺母组件，用于在平行于带的方向上横切。

12. 发明授权

US6000997A Temperature regulation in a CMP process 失效
标题翻译： CMP工艺中的温度调节
公开(公告)号：US6000997A
公开(公告)日：1999-12-14
申请号：US113450
申请日：1998-07-10
申请人： Shu-Hsin Kao , Shou-sung Chang , Huey M. Tzeng , Gregory C. Lee , Greg Simon , Harry Lee , David E. Weldon , Garry Kwong , William F. Lapson , Gregory A. Appel , Peter Mok
发明人： Shu-Hsin Kao , Shou-sung Chang , Huey M. Tzeng , Gregory C. Lee , Greg Simon , Harry Lee , David E. Weldon , Garry Kwong , William F. Lapson , Gregory A. Appel , Peter Mok
IPC分类号： B24B21/04 , B24B37/015 , B24B49/14
CPC分类号： B24B37/015 , B24B21/04
摘要： Heat is transferred between a linear CMP belt and an adjacent heat transfer source, providing a predetermined lateral temperature distribution across the belt. Temperature sensors generate feedback signals to control the heat transfer sources. Alternatively, process monitoring sensors provide feedback signals. The heat transfer source can include multiple selectively controllable individual heat transfer sources having differing temperatures, which can be above or below ambient temperature. The mechanism of heat transfer can include one or more of convection, conduction, and radiation. The configuration provides substantial flexibility to establish and maintain selective non-uniform temperature distributions across the polishing belt. This in turn permits precise control and stability of the polishing process. Heat transfer sources can include pulleys, slurry dispensers, polishing pad conditioners or conditioner back supports, fluid nozzles, and sealed fluid cavity belt supports.
摘要翻译：热量在线性CMP带和相邻的传热源之间传递，从而提供穿过带的预定横向温度分布。温度传感器产生反馈信号来控制传热源。或者，过程监控传感器提供反馈信号。传热源可以包括具有不同温度的多个选择性可控的单个热传递源，其可以高于或低于环境温度。传热的机理可以包括一个或多个对流，传导和辐射。该配置提供了大量灵活性，以建立和保持穿过抛光带的选择性不均匀的温度分布。这又允许精确的控制和抛光过程的稳定性。传热源可以包括滑轮，浆液分配器，抛光垫调节器或调节器背部支撑件，流体喷嘴和密封的流体腔体带支撑件。

13. 发明授权

US5947802A Wafer shuttle system 失效
标题翻译：晶圆穿梭系统
公开(公告)号：US5947802A
公开(公告)日：1999-09-07
申请号：US965037
申请日：1997-11-05
申请人： John Weiguo Zhang , H. Alexander Anderson
发明人： John Weiguo Zhang , H. Alexander Anderson
IPC分类号： B24B21/04 , B24B37/04 , B24B47/20 , B24B47/02
CPC分类号： B24B21/04 , B24B37/04
摘要： A shuttle system for transferring a semiconductor wafer from a receiving station to a horizontal-oriented head drive of a wafer polishing machine includes a linear horizontal rail extending from a first position to a second position; a wafer transfer assembly adjacent to the first position; a wafer conveying assembly movable along the rail from adjacent the first position to adjacent the second position; and wherein the wafer conveying assembly includes a vertically movable and radially movable gripper for gripping peripheral edges of a wafer to be transferred and conveyed from the transfer assembly to the head drive. The transfer assembly includes a transfer receiver for receiving an unpolished wafer from a cassette which receiver is movable to the second position where the gripper is movable to edge-grip the received unpolished wafer. The gripper includes a series of radially movable segments having edge-contacting fingers depending therefrom for gripping the wafer edges. A polished wafer is conveyed by the gripper along the rail to a rinsing bath including an unloading ring movable up and down in the bath.
摘要翻译：用于将半导体晶片从接收站传送到晶片抛光机的水平取向头驱动器的穿梭系统包括从第一位置延伸到第二位置的直线水平轨道; 与第一位置相邻的晶片传送组件; 晶片传送组件，其可沿着所述轨道从所述第一位置相邻移动到所述第二位置; 并且其中所述晶片传送组件包括可垂直移动的和可径向移动的夹持器，用于夹持要从所述传送组件传输和传送到所述头驱动器的晶片的周边边缘。传送组件包括用于从盒接收未抛光晶片的传送接收器，该接收器可移动到第二位置，在该位置，夹持器可移动到边缘夹持接收的未抛光晶片。夹持器包括一系列径向可移动的部分，其具有从其附近的用于夹持晶片边缘的边缘接触指状物。抛光的晶片由夹持器沿着轨道传送到漂洗槽，该冲洗槽包括可在浴中上下移动的卸载环。

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