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    • 172. 发明授权
    • Method of estimating internal dielectric fluid temperature of an electrical device
    • 估计电气设备的内部介电液温度的方法
    • US09395252B1
    • 2016-07-19
    • US13760269
    • 2013-02-06
    • Dynamic Ratings Pty Ltd.
    • Ethan C. FrounfelkerMark D. Tostrud
    • G01K15/00G01K13/00G01K1/00
    • G01K7/427
    • A system and method for estimating a temperature of a fluid contained in an electrical device such as a transformer, circuit breaker, or reactor without direct thermal communication with the fluid is disclosed. The method includes measuring a temperature of an exterior wall of a housing of the electrical device, measuring an ambient temperature around the housing, and estimating a temperature of the fluid within the housing using the measured wall temperature and the measured ambient temperature. In a preferred aspect, the method also adjusts the estimated fluid temperature for one or more of ambient humidity conditions, conductive, convective, and radiation heat transfer properties associated with operation of the underlying electrical device.
    • 公开了一种用于估计包含在诸如变压器,断路器或反应器的电气装置中的流体的温度的系统和方法,而不与流体直接热连通。 该方法包括测量电气设备的壳体的外壁的温度,测量壳体周围的环境温度,以及使用测量的壁温度和测量的环境温度来估计壳体内的流体的温度。 在优选的方面,该方法还调节与下面的电气设备的操作相关联的一个或多个环境湿度条件,导电,对流和辐射热传递性质的估计流体温度。
    • 176. 发明申请
    • NON-INTRUSIVE TEMPERATURE MEASUREMENT ASSEMBLY
    • 非侵入式温度测量装置
    • US20150185085A1
    • 2015-07-02
    • US14140784
    • 2013-12-26
    • Rosemount Inc.
    • Pat Dodson Converse
    • G01K1/14G01K3/14G01K13/00
    • G01K1/143G01K3/14G01K7/427G01K13/00G01K13/02
    • A temperature sensor assembly for use with a process vessel wall includes a base structure, a first temperature sensor, a second temperature sensor, and a processor. The base structure forms a contact area with an external surface of the process vessel wall. The first temperature sensor extends through the base structure to measure a temperature of the external surface of the process vessel wall. The second temperature sensor is at a second surface spaced from the first surface to measure a temperature of the second surface of the base structure. The processor is connected to the first and second temperature sensors, and adapted to determine an internal process vessel wall temperature value as a function of the measured temperature of the external surface of the process vessel wall, the measured temperature of the second surface of the base structure, base structure parameters, and process vessel wall parameters.
    • 与过程容器壁一起使用的温度传感器组件包括基座结构,第一温度传感器,第二温度传感器和处理器。 基底结构与处理容器壁的外表面形成接触区域。 第一温度传感器延伸穿过基部结构以测量处理容器壁的外表面的温度。 第二温度传感器处于与第一表面间隔开的第二表面,以测量基部结构的第二表面的温度。 处理器连接到第一温度传感器和第二温度传感器,并且适于确定作为处理容器壁的外表面的测量温度的函数的内部处理容器壁温度值,基底的第二表面的测量温度 结构,基础结构参数和过程容器壁参数。
    • 177. 发明申请
    • CONTACT TYPE INTERNAL THERMOMETER
    • 接触式内部温度计
    • US20150071325A1
    • 2015-03-12
    • US14389381
    • 2013-02-21
    • CITIZEN HOLDINGS CO., LTD.
    • Yukio KuroyamaMasato Tsuchida
    • G01K7/22
    • G01K7/22A61B5/01A61B5/683A61B2562/0271G01K7/427G01K13/002
    • Provided is a contact type internal thermometer including: a measurement surface that is brought into contact with a surface to be measured of a measurement object; a first temperature sensor stack including a first measurement surface side temperature sensor arranged on a measurement surface side, and a first back surface side temperature sensor arranged on a back surface side; a second temperature sensor stack including a second measurement surface side temperature sensor arranged on a measurement surface side, and a second back surface side temperature sensor arranged on a back surface side; and a controller configured to calculate an internal temperature of the measurement object based on measurement results of the respective temperature sensors, in which the first back surface side temperature sensor and the second back surface side temperature sensor have different surface areas.
    • 本发明提供一种接触型内部温度计,包括:测量表面,其与测量对象的待测表面接触; 包括布置在测量表面侧的第一测量表面侧温度传感器和布置在背面侧的第一背面侧温度传感器的第一温度传感器堆叠; 包括布置在测量表面侧的第二测量表面侧温度传感器和布置在背面侧的第二背面侧温度传感器的第二温度传感器堆叠; 以及控制器,其被配置为基于所述第一背面侧温度传感器和所述第二背面侧温度传感器具有不同的表面积的各温度传感器的测量结果来计算所述测量对象的内部温度。
    • 178. 发明申请
    • CONTACT TYPE INTERNAL THERMOMETER
    • 接触式内部温度计
    • US20150055681A1
    • 2015-02-26
    • US14389382
    • 2013-02-21
    • CITIZEN HOLDINGS CO., LTD.
    • Masato Tsuchida
    • G01K7/16G01K13/00
    • G01K7/16A61B5/01G01K1/165G01K7/427G01K13/002
    • Provided is a contact type internal thermometer including: a measurement surface that is brought into contact with a measurement object; a first temperature sensor stack including a first measurement surface side temperature sensor and a first back surface side temperature sensor arranged on opposite sides of a first thermal resistor; a second temperature sensor stack including a second measurement surface side temperature sensor and a second back surface side temperature sensor arranged on opposite sides of a second thermal resistor; and a controller configured to calculate an internal temperature of the measurement object based on measurement results of the respective temperature sensors, in which the controller has a first mode of calculating the internal temperature based on a heat conduction equation in a non-steady state, and a second mode of calculating the internal temperature based on a heat conduction equation in a steady state.
    • 提供一种接触式内部温度计,其包括:与测量对象接触的测量表面; 包括第一测量表面侧温度传感器和布置在第一热敏电阻器的相对侧上的第一背面侧温度传感器的第一温度传感器堆叠; 第二温度传感器堆叠,包括布置在第二热敏电阻器的相对侧上的第二测量表面侧温度传感器和第二背面侧温度传感器; 以及控制器,被配置为基于各个温度传感器的测量结果来计算测量对象的内部温度,其中控制器具有基于非稳定状态下的热传导方程计算内部温度的第一模式,以及 基于稳态中的热传导方程计算内部温度的第二模式。
    • 180. 发明申请
    • METHOD AND SYSTEM FOR DETEREMINING AMBIENT TEMPERATURE OF AN ELECTRONIC DEVICE
    • 用于确定电子设备环境温度的方法和系统
    • US20140379290A1
    • 2014-12-25
    • US14312730
    • 2014-06-24
    • Advanced Digital Broadcast S.A.
    • Miroslaw WLODARCZYKPiotr PASZKUDZKI
    • G01K7/42
    • G01K7/42G01K7/427G06F1/206
    • A method for determining the ambient temperature of an electronic device, the device comprising heat-generating components (102) and a temperature sensor (105) positioned within a common casing (101), the method comprising the steps of: in an environment with a controlled ambient temperature: determining (307) a device-specific coefficient of power dissipation change (a) between a first (Emin) and second (Emax) power modes, wherein in the second power mode (Emax) the device dissipates more power than in the first power mode (Emin); and in an environment for which the ambient temperature is to be determined: measuring (203-205) temperatures (Tmin, Tmax) is by the temperature sensor (105) for the first power mode (Emin) and the second power mode (Emax), calculating (206) ambient temperature (Tamb) as a function of the measured temperatures (Tmin, Tmax) and the device-specific coefficient of power dissipation change (a).
    • 一种用于确定电子设备的环境温度的方法,所述设备包括定位在公共壳体(101)内的发热部件(102)和温度传感器(105),所述方法包括以下步骤:在具有 控制环境温度:确定(307)在第一(Emin)和第二(Emax)功率模式之间的功率耗散的器件特定系数变化(a),其中在第二功率模式(Emax)中,器件耗散比在 第一种功率模式(Emin); 并且在要确定环境温度的环境中:通过用于第一功率模式(Emin)和第二功率模式(Emax)的温度传感器(105)来测量(203-205)温度(Tmin,Tmax) ,计算(206)环境温度(Tamb)作为测量温度(Tmin,Tmax)和器件特定的功率耗散变化系数(a)的函数。