专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

161. 发明授权

US09480186B2 Apparatus and method for facilitating air cooling of an electronics rack 有权
标题翻译：用于促进电子机架的空气冷却的装置和方法
公开(公告)号：US09480186B2
公开(公告)日：2016-10-25
申请号：US11958528
申请日：2007-12-18
申请人： Steven J. Ahladas , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber, Jr.
发明人： Steven J. Ahladas , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber, Jr.
IPC分类号： H05K5/00 , H05K7/20
CPC分类号： H05K7/20745 , H05K7/20736
摘要： Apparatus and method are provided for facilitating air cooling of an electronics rack. The apparatus includes a tile assembly, temperature sensor and controller. The tile assembly is disposed adjacent to the electronics rack, and includes a perforated tile and one or more controllable air-moving devices associated with the perforated tile for moving air through the perforated tile. The temperature sensor is positioned for sensing air temperature adjacent and external to, or within, the electronics rack, and the controller is coupled to the tile assembly and the temperature sensor for controlling operation of the air-moving device. Airflow through the tile assembly is adjusted based on air temperature sensed, thereby facilitating air cooling of the electronics rack. In one embodiment, the tile assembly is a floor tile assembly with an air-to-liquid heat exchanger disposed between the perforated tile and the air-moving device for cooling air passing through the floor tile assembly.
摘要翻译：提供了用于促进电子机架的空气冷却的装置和方法。该装置包括瓦片组件，温度传感器和控制器。瓦片组件邻近电子机架布置，并且包括穿孔瓦片和与穿孔瓦片相关联的一个或多个可控空气移动装置，用于使空气移动穿过穿孔瓦片。温度传感器被定位成用于感测电子机架附近或外部的空气温度，并且控制器耦合到瓦片组件和温度传感器，以控制空气移动装置的操作。基于感测的空气温度调节通过瓦片组件的气流，从而有助于电子机架的空气冷却。在一个实施例中，瓦片组件是地板砖组件，其中空气 - 液体热交换器设置在穿孔瓦片和空气移动装置之间，用于冷却通过地板瓦片组件的空气。

162. 发明授权

US09045995B2 Electronics rack with liquid-coolant-driven, electricity-generating system 有权
标题翻译：电子机架采用液冷驱动，发电系统
公开(公告)号：US09045995B2
公开(公告)日：2015-06-02
申请号：US13103233
申请日：2011-05-09
申请人： David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Donald W. Porter , Enrico A. Romano , Roger R. Schmidt , Gerard V. Weber, Jr.
发明人： David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Donald W. Porter , Enrico A. Romano , Roger R. Schmidt , Gerard V. Weber, Jr.
IPC分类号： F01D15/10 , F02C6/00 , H02K7/18 , H02P9/04 , F02B63/04 , F03G7/08 , F03B13/00 , F03B13/10 , F01D15/08
CPC分类号： F01D15/10 , F01D15/08 , F03B13/00
摘要： An electronics rack with a cooling apparatus and a liquid-coolant-driven, electricity-generating system. The generating system includes a housing coupled in fluid communication with a fluid transport pipe of the cooling apparatus, an impeller disposed within the housing and positioned to turn with flow of fluid across the impeller, one or more magnetic structures disposed to turn with turning of the impeller, and an electrical circuit. Electricity is generated for the electrical circuit with turning of the one or more magnetic structures, and is supplied to an electrical load disposed within or associated with the electronics rack.
摘要翻译：具有冷却装置和液体冷却剂驱动的发电系统的电子机架。所述发电系统包括与所述冷却装置的流体输送管道流体连通的壳体，设置在所述壳体内并且被定位成随着流过所述叶轮的流体而转动的叶轮，一个或多个磁性结构，叶轮和电路。通过一个或多个磁性结构的转动为电路产生电，并且被提供给设置在电子机架中或与电子机架相关联的电负载。

163. 发明授权

US08547692B2 Heatsink allowing in-situ maintenance in a stackable module 失效
标题翻译：散热器允许在可堆叠模块中进行现场维护
公开(公告)号：US08547692B2
公开(公告)日：2013-10-01
申请号：US13596828
申请日：2012-08-28
申请人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Juan C. Rubio
发明人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Juan C. Rubio
IPC分类号： H05K7/20 , F28F7/00 , H05K5/00
CPC分类号： H05K7/20 , G06F1/181 , G06F1/20
摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要翻译：提供允许现场维护的模块化处理模块。模块化处理模块包括一组处理模块侧面。每个处理模块侧包括电路板，多个连接器和多个处理节点。每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。

164. 发明授权

US08531839B2 Liquid cooled data center with alternating coolant supply lines 有权
标题翻译：具有交替冷却液供应管线的液冷数据中心
公开(公告)号：US08531839B2
公开(公告)日：2013-09-10
申请号：US12916434
申请日：2010-10-29
申请人： Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： H05K7/20 , H01L23/34
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20645 , H05K7/20745 , H05K7/20836 , H01L2924/00
摘要： Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two coolant supply lines. The cabinets are configured to house computer equipment and the coolant supply lines provide coolant for the cabinets. Moreover, the cabinets are arranged in at least one row of adjacent cabinets such that each row of adjacent cabinets receives coolant from alternating coolant supply lines.
摘要翻译：当柜内的冷却器供给冷却液时，防止机柜内计算机设备过热的方法失效。示例性实施例是包括多个机柜和至少两个冷却剂供应管线的数据中心。机柜被配置为容纳计算机设备，并且冷却剂供应管线为机柜提供冷却剂。此外，机柜布置在至少一排相邻的机柜中，使得每排相邻机柜从交替的冷却剂供应管路接收冷却剂。

165. 发明申请

US20130192794A1 INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD 审中-公开
标题翻译：用于集成电路和电路板的可互换冷却系统
公开(公告)号：US20130192794A1
公开(公告)日：2013-08-01
申请号：US13361929
申请日：2012-01-30
申请人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： F28F9/00
CPC分类号： H05K13/00 , H01L21/4882 , H01L23/40 , H01L23/42 , H01L23/44 , H01L23/467 , H01L23/473 , H01L2224/16225 , H05K7/20009 , H05K7/20254 , Y10T29/49117
摘要： Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices.
摘要翻译：提供冷却系统互换性的几种设备和方法。一种装置包括热耦合到集成电路的导热板。导热板被配置为可互换地耦合到液体冷却组件或空气冷却组件，并且液体冷却组件和空气冷却组件是分离的装置。

166. 发明申请

US20130118712A1 DUAL COIL WITH ADAPTER TO MOVE BETWEEN REDUNDANT AND NON-REDUNDANT HIGH PERFORMANCE HEAT EXCHANGER 有权
标题翻译：具有适应能力的双线圈可以在冗余和非冗余高性能热交换器之间移动
公开(公告)号：US20130118712A1
公开(公告)日：2013-05-16
申请号：US13296207
申请日：2011-11-14
申请人： Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： F28D15/00 , B23P15/26
CPC分类号： H05K7/20736 , F28D2021/0028 , F28F2210/04 , H05K7/20618 , H05K7/20781 , Y10T29/4935
摘要： An apparatus, rear door heat exchanger, system, and method for controlling the redundancy of a cooling system for a server rack. The system includes a cooling system having at least two liquid cooling circuits. The system also includes a rear door heat exchanger connected to the cooling system. The rear door heat exchanger includes two heat exchange coils. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit. The rear door heat exchanger also includes an adapter configured to couple together the two heat exchange coils into one heat exchange unit. The heat exchange unit is configured to interface with one liquid cooling circuit from the cooling system.
摘要翻译：一种用于控制用于服务器机架的冷却系统的冗余的装置，后门热交换器，系统和方法。该系统包括具有至少两个液体冷却回路的冷却系统。该系统还包括连接到冷却系统的后门热交换器。后门热交换器包括两个热交换线圈。每个热交换线圈由服务器机架承载，并配置成与不同的液体冷却回路接口。后门热交换器还包括配置成将两个热交换盘管连接在一起的一个热交换单元中的适配器。热交换单元配置成与来自冷却系统的一个液体冷却回路相连接。

167. 发明申请

US20120320524A1 Heatsink Allowing In-Situ Maintenance in a Stackable Module 失效
标题翻译：散热器可以在可堆叠模块中进行原位维护
公开(公告)号：US20120320524A1
公开(公告)日：2012-12-20
申请号：US13596828
申请日：2012-08-28
申请人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Juan C. Rubio
发明人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Juan C. Rubio
IPC分类号： G06F1/20
CPC分类号： H05K7/20 , G06F1/181 , G06F1/20
摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要翻译：提供允许现场维护的模块化处理模块。模块化处理模块包括一组处理模块侧面。每个处理模块侧包括电路板，多个连接器和多个处理节点。每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。

168. 发明申请

US20120298338A1 DATA CENTER WITH DUAL RADIATOR CABINETS FOR REDUNDANT OPERATION 有权
标题翻译：具有用于冗余操作的双散热器柜的数据中心
公开(公告)号：US20120298338A1
公开(公告)日：2012-11-29
申请号：US13115590
申请日：2011-05-25
申请人： Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： F28D15/00
CPC分类号： F28F27/00 , F28D1/0475 , F28F1/32 , H05K7/20745 , Y10T29/49826
摘要： Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two main coolant supply lines. The cabinets are configured to house computer equipment and the main coolant supply lines provide coolant to the plurality of cabinets. Moreover, each cabinet includes a cooler and each of these coolers includes at least two radiators which receive coolant from different main coolant supply lines.
摘要翻译：当柜内的冷却器供给冷却液时，防止机柜内计算机设备过热的方法失效。示例性实施例是包括多个机柜和至少两个主冷却剂供应管线的数据中心。机柜被配置为容纳计算机设备，并且主冷却剂供应管线为多个机柜提供冷却剂。此外，每个机柜包括一个冷却器，并且这些冷却器中的每一个包括至少两个从不同主冷却剂供应管路接收冷却剂的散热器。

169. 发明授权

US08210741B2 Apparatus for thermal characterization under non-uniform heat load 有权
标题翻译：非均匀热负荷下热表征的装置
公开(公告)号：US08210741B2
公开(公告)日：2012-07-03
申请号：US12611519
申请日：2009-11-03
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
IPC分类号： G01N25/72 , G01K3/00
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.
摘要翻译：设备确定用于从电子设备传送热量的操作冷却装置的冷却特性。操作冷却装置热耦合到热管。热管具有用于选择性地在其上施加热量的暴露表面。来自局部热源的热量被选择性地施加到暴露表面的至少一个区域。热源优选能够相对于暴露的表面和热强度在位置上都变化。优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与来自局部热源的热隔离。当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。然后将温度分布用于热操作冷却装置的特征。

170. 发明授权

US08077462B2 Stress relieved hose routing to liquid-cooled electronics rack door 失效
标题翻译：减轻软管布置到液冷电子机柜门
公开(公告)号：US08077462B2
公开(公告)日：2011-12-13
申请号：US12552479
申请日：2009-09-02
申请人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, Jr.
发明人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, Jr.
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H05K7/2079 , H05K7/20818 , Y10T29/4935
摘要： A cooling apparatus and method are provided which include an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to an electronics rack door along an edge of the door remote from the edge hingedly mounted to the rack. The plenums are in fluid communication with the heat exchanger and respectively include an inlet and outlet. Coolant supply and return hoses are disposed above the electronics rack and couple the inlet plenum to a coolant supply header and the outlet plenum to a coolant return header. The hoses are sufficiently long and flexible to open or close the door. A stress relief structure is attached to the top of the door and clamps the supply and return hoses in fixed relation to relieve stress on connect couplings at the ends of the hoses to the plenum inlet and outlet during opening or closing of the door.
摘要翻译：提供了一种冷却装置和方法，其包括空气 - 液体热交换器和系统冷却剂入口和出口集气室，其沿着门的边缘安装到电子机架门，远离铰接安装到机架的边缘。增压室与热交换器流体连通，分别包括入口和出口。冷却剂供应和返回软管设置在电子机架上方，并将进气室连接到冷却剂供应集管，并将出口压力室连接到冷却剂返回集管。软管足够长且灵活以打开或关闭门。应力消除结构连接到门的顶部，并且固定地夹紧供应和返回软管，以在门的打开或关闭期间将软管端部处的连接联接器上的压力释放到通风口入口和出口。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式