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    • 151. 发明申请
    • MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    • 半导体器件的制造方法
    • US20120315730A1
    • 2012-12-13
    • US13484670
    • 2012-05-31
    • Junichi KOEZUKAShinji OHNOYuichi SATOShunpei YAMAZAKI
    • Junichi KOEZUKAShinji OHNOYuichi SATOShunpei YAMAZAKI
    • H01L21/336
    • H01L29/7869H01L29/24H01L29/4908H01L29/495H01L29/66969H01L29/78603H01L29/78618
    • A transistor using an oxide semiconductor, which has good on-state characteristics is provided. A high-performance semiconductor device including the transistor capable of high-speed response and high-speed operation is provided. The transistor includes the oxide semiconductor film including a channel formation region and low-resistance regions in which a metal element and a dopant are included. The channel formation region is positioned between the low-resistance regions in the channel length direction. In a manufacturing method of the transistor, the metal element is added by heat treatment performed in the state where the oxide semiconductor film is in contact with a film including the metal element and the dopant is added through the film including the metal element by an implantation method so that the low resistance regions in which a metal element and a dopant are included are formed.
    • 提供了具有良好的导通状态特性的使用氧化物半导体的晶体管。 提供了包括能够进行高速响应和高速运行的晶体管的高性能半导体器件。 晶体管包括包括沟道形成区域的氧化物半导体膜和包含金属元素和掺杂剂的低电阻区域。 沟道形成区域位于沟道长度方向的低电阻区域之间。 在晶体管的制造方法中,通过在氧化物半导体膜与包含金属元素的膜接触的状态下进行的热处理来添加金属元素,并且通过植入通过包含金属元素的膜添加掺杂剂 形成包含金属元素和掺杂剂的低电阻区域。