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    • 142. 发明申请
    • QUANTUM CASCADE LASER
    • 量子CASCADE激光
    • US20170033536A1
    • 2017-02-02
    • US15193249
    • 2016-06-27
    • HAMAMATSU PHOTONICS K.K.
    • Kazuue FUJITAAkio ITOTadataka EDAMURATatsuo DOUGAKIUCHI
    • H01S5/20H01S5/24H01S5/343H01S5/34
    • H01S5/2018H01S5/0604H01S5/1096H01S5/18H01S5/24H01S5/3402H01S5/34306H01S2302/02
    • A quantum cascade laser is configured with a semiconductor substrate, and an active layer provided on a first surface of the substrate and having a cascade structure in the form of a multistage lamination of unit laminate structures each of which includes an emission layer and an injection layer. The active layer is configured to be capable of generating first pump light of a frequency ω1 and second pump light of a frequency ω2 by intersubband emission transitions of electrons, and to generate output light of a difference frequency ω by difference frequency generation from the first pump light and the second pump light. Grooves respectively formed in a direction intersecting with a resonating direction in a laser cavity structure are provided on a second surface opposite to the first surface of the substrate.
    • 量子级联激光器被配置为具有半导体衬底和设置在衬底的第一表面上的有源层,并且具有层叠结构的级联结构,该级联结构是单位层叠结构的多级叠层形式,每层包括发射层和注入层 。 有源层被配置为能够通过电子的子带间发射跃迁来产生频率ω1的第一泵浦光和频率ω2的第二泵浦光,并且通过来自第一泵的差频产生产生差频ω的输出光 光和第二个泵灯。 在与基板的第一表面相对的第二表面上设置分别在与激光腔结构中的谐振方向相交的方向上形成的槽。
    • 148. 发明授权
    • Semiconductor laser light source
    • 半导体激光光源
    • US09450380B2
    • 2016-09-20
    • US14550613
    • 2014-11-21
    • MITSUBISHI ELECTRIC CORPORATION
    • Shuhei YamamotoAkira NakamuraKazutaka Ikeda
    • H01S5/00H01S5/20H01S5/022
    • H01S5/20H01S5/0224H01S5/02272
    • A sub-mount includes a sub-mount substrate, an Au layer placed above the sub-mount substrate, a barrier layer which is placed on the Au layer and has a barrier portion at least in a portion of its outer peripheral portion which is other than a portion corresponding to a side of an output end of a semiconductor laser, and a solder layer placed on the barrier layer in an area surrounded by the barrier portion, wherein the semiconductor laser is bonded to the sub-mount through the solder layer, in a state where the semiconductor laser is spaced apart by a predetermined interval from an inner surface of the barrier portion, and further, the output end protrudes, in a direction of output of the laser light, from an end of the solder layer which corresponds to the side of the output end of the semiconductor laser.
    • 子安装座包括副安装基板,位于副安装基板上方的Au层,位于Au层上的阻挡层,至少在其外周部分的另一部分上具有阻挡部分 比与半导体激光器的输出端的一侧对应的部分,以及在由阻挡部包围的区域中的阻挡层上设置的焊料层,其中半导体激光通过焊料层接合到副安装座, 在半导体激光器与阻挡部分的内表面隔开预定间隔的状态下,并且输出端在激光输出方向上从相应的焊料层的端部突出 到半导体激光器的输出端侧。