会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 142. 发明申请
    • OPTICAL WAVEGUIDE
    • 光波导
    • US20090202190A1
    • 2009-08-13
    • US11570410
    • 2005-06-10
    • Kazuo TanakaMasahiro Tanaka
    • Kazuo TanakaMasahiro Tanaka
    • G02B6/00
    • G01Q60/22G02B6/262Y10S977/862
    • When light is made incident to an optical waveguide path 14 formed through a main body 12 composed of silver (Ag) that is a plasmon active medium, surface plasmon is generated on a definition face 55 of the optical waveguide path 14 (including a fine aperture 16). Thus, the intensity of the light propagating in the optical waveguide path 14 is strengthened as the light propagates toward the fine aperture 16. In addition, a distal end 51 of a first protrusive piece 13a is more protrusive as compared with a distal end 52 of a second protrusive piece 13b. Thus, in a distal end part of a projection 13, the light is focused in the vicinity of the first protrusive piece 13a based on an intensity distribution of an electric field at the distal end part. Thus, the light having seeped out from the fine aperture 16 is restricted from spreading in a polarizing direction. Therefore, the light intensity of the light propagated through the optical waveguide path 14 is increased at a low cost without causing an increase of the spread of the light while maintaining a good S/N ratio.
    • 当光入射到通过由作为等离子体激元介质的银(Ag)构成的主体12形成的光波导路径14时,在光波导路径14的定义面55(包括细孔 16)。 因此,当光向微孔16传播时,在光波导路径14中传播的光的强度增强。此外,与第一突出片13a的远端52相比,第一突出片13a的远端51更突出 第二突出件13b。 因此,在突起13的前端部,基于前端部的电场的强度分布,将光聚焦在第一突出片13a的附近。 因此,从微细孔16渗出的光被限制在偏振方向上的扩散。 因此,通过光波导路径14传播的光的光强度以低成本增加,而不会导致光的扩展增加,同时保持良好的S / N比。
    • 146. 发明授权
    • Semiconductor integrated circuit
    • 半导体集成电路
    • US07425845B2
    • 2008-09-16
    • US11452238
    • 2006-06-14
    • Takeo TobaKazuo TanakaShunsuke Toyoshima
    • Takeo TobaKazuo TanakaShunsuke Toyoshima
    • H03K19/0185
    • G11C5/147G11C7/1066G11C11/4074
    • The present invention provides a semiconductor integrated circuit having two kinds of input/output circuits realizing higher speed and higher packing density with rational configuration. The semiconductor integrated circuit has a first input/output circuit operating on a first power source voltage, an internal circuit operating on a second power source voltage lower than the first power source voltage, and a second input/output circuit operating on a third power source voltage lower than the first power source voltage. In an output circuit of the first input/output circuit, signal amplitude corresponding to the second power source voltage is converted to signal amplitude corresponding to the first power source voltage by a level shifter, and a P-channel MOSFET and an N-channel MOSFET constructing the output circuit are driven. In an output circuit of the second input/output circuit, a drive signal is generated by a level shifter in a manner similar to the above to drive second and third N-channel MOSFETs for generating an output signal having signal amplitude corresponding to the third power source voltage.
    • 本发明提供一种具有两种输入/输出电路的半导体集成电路,其实现了具有合理配置的更高速度和更高的封装密度。 半导体集成电路具有以第一电源电压工作的第一输入/输出电路,以及低于第一电源电压的第二电源电压运行的内部电路,以及在第三电源上运行的第二输入/输出电路 电压低于第一电源电压。 在第一输入/输出电路的输出电路中,对应于第二电源电压的信号幅度由电平移位器转换成对应于第一电源电压的信号幅度,以及P沟道MOSFET和N沟道MOSFET 驱动输出电路的构造。 在第二输入/输出电路的输出电路中,以与上述类似的方式由电平转换器产生驱动信号,以驱动第二和第三N沟道MOSFET,以产生具有对应于第三功率的信号幅度的输出信号 源电压。
    • 147. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20080173899A1
    • 2008-07-24
    • US11970512
    • 2008-01-07
    • Koichiro TAKAKUWAKazuo Tanaka
    • Koichiro TAKAKUWAKazuo Tanaka
    • H01L27/10
    • H01L27/0251H01L23/5286H01L24/06H01L2924/1306H01L2924/13091H01L2924/3011H01L2924/00
    • There is provided a technology which allows sufficient protection of internal circuits from electrostatic discharge even when internal-circuit power source pads and internal-circuit GND pads are formed on an internal circuit region. Internal-circuit power source pads and internal-circuit GND pads are placed in the core region of a semiconductor chip. Between the internal-circuit power source pads and the internal-circuit GND pads, the internal circuits are formed. Between the internal-circuit power source pads and the internal-circuit GND pads, electrostatic protection circuits for protecting the internal circuits from a surge current are further formed. Each of the electrostatic protection circuits is composed of a discharge circuit for causing the surge current to flow therein and a control circuit for controlling the discharge circuit. The present invention is characterized in that the discharge circuits are placed in the core region and the control circuits are placed in an I/O region.
    • 即使在内部电路区域上形成内部电路电源焊盘和内部电路GND焊盘的情况下,也提供了能够充分保护内部电路免受静电放电的技术。 内部电路电源焊盘和内部电路GND焊盘放置在半导体芯片的芯区域中。 内部电源焊盘与内部电路GND焊盘之间形成内部电路。 在内部电源焊盘和内部电路GND焊盘之间,进一步形成用于保护内部电路免受浪涌电流的静电保护电路。 每个静电保护电路由用于使浪涌电流流过的放电电路和用于控制放电电路的控制电路组成。 本发明的特征在于,将放电电路放置在芯区域中,将控制电路放置在I / O区域中。
    • 148. 发明授权
    • Substrate processing equipment
    • 基板加工设备
    • US07346273B2
    • 2008-03-18
    • US10550202
    • 2004-06-18
    • Kazuo TanakaMasaaki UenoMasashi Sugishita
    • Kazuo TanakaMasaaki UenoMasashi Sugishita
    • F26B3/30H05B3/02
    • H01L21/67248G05D23/1928G05D23/22H01L21/67109
    • It is an object of the invention to provide a substrate processing equipment that can predict a temperature of a substrate and easily control temperature of the substrate. Formed in a reactor (processing chamber) 3 are four temperature adjustment zones, of which setting and adjustment of temperature can be made by zone heaters 340-1 to 340-4. A temperature controller 4 mixes temperatures detected by inner thermocouples 302-1 to 302-4 and outer thermocouples 342-1 to 342-4 to calculate predicted temperatures of substrates by means of the first-order lag calculation on the basis of time constants of temperatures of substrates heated by the zone heaters 340-1 to 340-4. Also, the temperature controller 4 calculates electric power values (operating variables) for the zone heaters 340-1 to 340-4 with the use of predicted temperatures of substrates to output the same to the zone heaters 340-1 to 340-4.
    • 本发明的目的是提供一种能够预测基板的温度并容易地控制基板的温度的基板处理设备。 在反应器(处理室)3中形成的是四个温度调节区域,其中温度的设定和调节可以由区域加热器340-1至340-4进行。 温度控制器4将由内部热电偶302-1至302-4检测的温度与外部热电偶342-1至342-4混合,以基于温度的时间常数通过一阶滞后计算来计算衬底的预测温度 的区域加热器340-1至340-4加热的基底。 此外,温度控制器4使用基板的预测温度来计算区域加热器340-1至340-4的电功率值(操作变量),以将其输出到区域加热器340-1至340-4。