会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 143. 发明申请
    • INTEGRATED CIRCUIT DEVICE WITH SERIES-CONNECTED FIELD EFFECT TRANSISTORS AND INTEGRATED VOLTAGE EQUALIZATION AND METHOD OF FORMING THE DEVICE
    • 具有串联场效应晶体管和集成电压均衡的集成电路装置及其形成方法
    • US20110068399A1
    • 2011-03-24
    • US12563195
    • 2009-09-21
    • Andres BryantEdward J. Nowak
    • Andres BryantEdward J. Nowak
    • H01L29/786H01L29/78H01L21/336
    • H01L21/845H01L21/84H01L27/1203H01L27/1211
    • Disclosed is an integrated circuit device having series-connected planar or non-planar field effect transistors (FETs) with integrated voltage equalization and a method of forming the device. The series-connected FETs comprise gates positioned along a semiconductor body to define the channel regions for the series-connected FETs. Source/drain regions are located within the semiconductor body on opposing sides of the channel regions such that each portion of the semiconductor body between adjacent gates comprises one source/drain region for one field effect transistor abutting another source/drain region for another field effect transistor. Integrated voltage equalization is achieved through a conformal conductive layer having a desired resistance and positioned over the series-connected FETs such that it is electrically isolated from the gates, but in contact with the source/drain regions within the semiconductor body.
    • 公开了具有集成电压均衡的具有串联的平面或非平面场效应晶体管(FET)的集成电路器件和形成器件的方法。 串联连接的FET包括沿着半导体本体定位的门,以限定用于串联连接的FET的沟道区。 源极/漏极区域位于沟道区域的相对侧上的半导体本体内,使得相邻栅极之间的半导体本体的每个部分包括用于一个场效应晶体管的一个源极/漏极区域,用于与另一个场效应晶体管的另一个源极/漏极区域相邻接 。 集成电压均衡通过具有期望电阻的并行导电层实现,并且位于串联连接的FET上,使得其与栅极电隔离,但与半导体本体内的源极/漏极区域接触。
    • 144. 发明授权
    • MugFET with stub source and drain regions
    • MugFET具有短路源极和漏极区域
    • US07902000B2
    • 2011-03-08
    • US12132865
    • 2008-06-04
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • H01L29/72
    • H01L29/785H01L29/66803
    • The present invention provides a semiconductor device that includes at least one semiconductor Fin structure atop the surface of a substrate; the semiconducting fin structure including a channel of a first conductivity type and source/drain regions of a second conductivity type, the source/drain regions present at each end of the semiconductor fin structure; a gate structure immediately adjacent to the semiconductor fin structure, a dielectric spacer abutting each sidewall of the gate structure wherein the each end of the fin structure extends a dimension that is less than about ¼ a length of the Si-containing fin structure from a sidewall of the dielectric spacer; and a semiconductor region to the each end of the semiconductor fin structure, wherein the semiconductor region to the each end of the semiconductor fin structure is separated from the gate structure by the dielectric spacer.
    • 本发明提供一种半导体器件,其包括在衬底的表面上方的至少一个半导体鳍结构; 所述半导体鳍结构包括第一导电类型的沟道和第二导电类型的源极/漏极区,所述源/漏区存在于所述半导体鳍结构的每个端部处; 靠近半导体鳍片结构的栅极结构,邻接栅极结构的每个侧壁的电介质间隔物,其中翅片结构的每个端部从侧壁延伸小于约含有Si的鳍结构的长度的尺寸 的电介质间隔物; 以及到半导体鳍片结构的每一端的半导体区域,其中半导体鳍片结构的每个端部的半导体区域通过电介质间隔物与栅极结构分离。
    • 145. 发明授权
    • Dense chevron non-planar field effect transistors and method
    • 密集V形非平面场效应晶体管及方法
    • US07847320B2
    • 2010-12-07
    • US11939574
    • 2007-11-14
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • H01L29/80
    • H01L27/0207H01L21/823412H01L29/785
    • Disclosed are embodiments of semiconductor structure and a method of forming the semiconductor structure that simultaneously maximizes device density and avoids contacted-gate pitch and fin pitch mismatch, when multiple parallel angled fins are formed within a limited area on a substrate and then traversed by multiple parallel gates (e.g., in the case of stacked, chevron-configured, CMOS devices). This is accomplished by using, not a minimum lithographic fin pitch, but rather by using a fin pitch that is calculated as a function of a pre-selected contacted-gate pitch, a pre-selected fin angle and a pre-selected periodic pattern for positioning the fins relative to the gates within the limited area. Thus, the disclosed structure and method allow for the conversion of a semiconductor product design layout with multiple, stacked, planar FETs in a given area into a semiconductor product design layout with multiple, stacked, chevron-configured, non-planar FETs in the same area.
    • 公开了半导体结构的实施例以及形成半导体结构的方法,其同时使器件密度最大化并避免接触栅极间距和鳍片间距失配,当在衬底上的有限区域内形成多个平行的有角度的鳍片然后穿过多个平行 门(例如,在堆叠,人字形配置的CMOS设备的情况下)。 这是通过使用而不是最小光刻鳍间距来实现的,而是通过使用根据预先选择的接触栅间距,预选翅片角和预选择的周期性图案计算的鳍间距来实现 在有限的区域内相对于门定位翅片。 因此,所公开的结构和方法允许将具有给定区域中的多个堆叠的平面FET的半导体产品设计布局转换成具有多个,堆叠的,人造V形的非平面FET的半导体产品设计布局 区。
    • 147. 发明授权
    • Multi-gated, high-mobility, density improved devices
    • 多门控,高移动性,密度改善设备
    • US07759179B2
    • 2010-07-20
    • US12023347
    • 2008-01-31
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • H01L21/00H01L21/84
    • H01L21/26513H01L21/26546H01L21/26586H01L21/845H01L29/66803H01L29/785
    • Disclosed herein are embodiments of an improved method of forming p-type and n-type MUGFETs with high mobility crystalline planes in high-density, chevron-patterned, CMOS devices. Specifically, semiconductor fins are formed in a chevron layout oriented along the centerline of a wafer. Gates are formed adjacent to the semiconductor fins such that they are approximately perpendicular to the centerline. Then, masked implant sequences are performed, during which halo and/or source/drain dopants are implanted into the sidewalls of the semiconductor fins on one side of the chevron layout and then into the sidewalls of the semiconductor fins on the opposite side of the chevron layout. The implant direction used during these implant sequences is substantially orthogonal to the gates in order to avoid mask shadowing, which can obstruct dopant implantation when separation between the semiconductor fins in the chevron layout is scaled (i.e., when device density is increased).
    • 本文公开了在高密度,人字纹图案化的CMOS器件中形成具有高迁移率晶面的p型和n型MUGFET的改进方法的实施方案。 具体地,半导体散热片形成为沿着晶片的中心线定向的人字形布局。 门形成在半导体翅片附近,使得它们大致垂直于中心线。 然后,进行掩蔽的植入序列,在此期间将卤素和/或源极/漏极掺杂剂注入到人字形布局的一侧上的半导体鳍片的侧壁中,然后进入人字纹相反侧的半导体鳍片的侧壁 布局。 在这些植入序列期间使用的植入方向基本上与栅极正交,以避免掩模阴影,当阴影布局中的半导体鳍片之间的间隔被缩放时(即,当器件密度增加时),这可能阻碍掺杂剂注入。
    • 148. 发明授权
    • Method of fabricating high voltage fully depleted SOI transistor and structure thereof
    • 制造高电压全耗尽SOI晶体管的方法及其结构
    • US07745879B2
    • 2010-06-29
    • US11872953
    • 2007-10-16
    • Andres BryantWilliam F. Clark, Jr.Edward J. Nowak
    • Andres BryantWilliam F. Clark, Jr.Edward J. Nowak
    • H01L29/43H01L29/786
    • H01L29/78624H01L29/66772H01L29/78612
    • A method of fabricating a high voltage fully depleted silicon-on-insulator (FD SOI) transistor, the FD SOI transistor having a structure including a region within a body on which a gate structure is disposed. The region includes a channel separating the source region and the drain region. Above the source region is disposed a carrier recombination element, which abuts the gate structure and is electrically connected to the region via the channel. The drain region is lightly doped and ballasted to increase breakdown voltage. The FD SOI may be fabricated by forming a body with a thin silicon layer disposed on a buried oxide (BOX). Alternatively, the body may be formed using a partially depleted (PD) SOI where the region formed therein has a reduced thickness in comparison to the overall thickness of the PD SOI.
    • 一种制造高电压完全耗尽的绝缘体上硅(FD SOI)晶体管的方法,所述FD SOI晶体管具有包括在其中设置栅极结构的主体内的区域的结构。 该区域包括分离源极区域和漏极区域的沟道。 在源极区上方设置有载流子复合元件,该载流子复合元件邻接栅极结构,并且经由沟道电连接到该区域。 漏极区域被轻掺杂并镇流以增加击穿电压。 可以通过形成具有设置在掩埋氧化物(BOX)上的薄硅层的主体来制造FD SOI。 或者,可以使用部分耗尽(PD)SOI形成主体,其中形成在其中的区域与PD SOI的总厚度相比具有减小的厚度。
    • 150. 发明申请
    • MUGFET WITH STUB SOURCE AND DRAIN REGIONS
    • MUFAET与STUB源和排水区域
    • US20090302402A1
    • 2009-12-10
    • US12132865
    • 2008-06-04
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • H01L29/00H01L21/8236
    • H01L29/785H01L29/66803
    • The present invention provides a semiconductor device that includes at least one semiconductor Fin structure atop the surface of a substrate; the semiconducting fin structure including a channel of a first conductivity type and source/drain regions of a second conductivity type, the source/drain regions present at each end of the semiconductor fin structure; a gate structure immediately adjacent to the semiconductor fin structure, a dielectric spacer abutting each sidewall of the gate structure wherein the each end of the fin structure extends a dimension that is less than about ¼ a length of the Si-containing fin structure from a sidewall of the dielectric spacer; and a semiconductor region to the each end of the semiconductor fin structure, wherein the semiconductor region to the each end of the semiconductor fin structure is separated from the gate structure by the dielectric spacer.
    • 本发明提供一种半导体器件,其包括在衬底的表面上方的至少一个半导体鳍结构; 所述半导体鳍结构包括第一导电类型的沟道和第二导电类型的源极/漏极区,所述源/漏区存在于所述半导体鳍结构的每个端部处; 靠近半导体鳍片结构的栅极结构,邻接栅极结构的每个侧壁的电介质间隔物,其中鳍状结构的每个端部从侧壁延伸小于约含有Si的鳍结构的长度的尺寸 的电介质间隔物; 以及到半导体鳍片结构的每一端的半导体区域,其中半导体鳍片结构的每个端部的半导体区域通过电介质间隔物与栅极结构分离。