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131. 发明授权

US08848389B2 Transmission device and method for manufacturing same, and wireless transmission device and wireless transmission method 有权
标题翻译：传输装置及其制造方法，无线传输装置及无线传输方法
公开(公告)号：US08848389B2
公开(公告)日：2014-09-30
申请号：US13062121
申请日：2009-09-15
申请人： Hirofumi Kawamura , Yasuhiro Okada
发明人： Hirofumi Kawamura , Yasuhiro Okada
IPC分类号： H05K1/11 , H04B3/52 , H01P5/107 , H01P5/02 , H01P1/04 , H05K1/14 , H05K1/02
CPC分类号： H01P5/107 , H01P1/047 , H01P5/028 , H04B3/52 , H05K1/0237 , H05K1/144 , H05K2201/037 , H05K2201/042 , H05K2201/10303 , Y10T29/49016
摘要： An electronic device provided with a plurality of circuit boards uses a support member for supporting the circuit boards as the transmission path of a wireless signal. For example, the electronic device is provided with a first printed circuit board for processing a millimeter-wave signal, a second printed circuit board which is signal-coupled to the printed circuit board and receives the millimeter-wave signal to subject the received signal to signal processing, and a waveguide which is disposed with a predetermined dielectric constant between the printed circuit boards, wherein the waveguide constitutes the dielectric transmission path, and the waveguide supports the printed circuit boards. This configuration makes it possible to receive the electromagnetic wave based on a millimeter-wave signal radiated from one end of the waveguide constituting the dielectric transmission path, at the other end thereof.
摘要翻译：设置有多个电路板的电子设备使用支撑部件来支持电路板作为无线信号的传输路径。例如，电子设备设置有用于处理毫米波信号的第一印刷电路板，与印刷电路板信号耦合的第二印刷电路板，并接收毫米波信号以将接收到的信号信号处理以及布置在印刷电路板之间的预定介电常数的波导，其中波导构成电介质传输路径，并且波导支撑印刷电路板。该结构使得可以在其另一端接收基于构成介质传输路径的波导的一端辐射的毫米波信号的电磁波。

132. 发明授权

US08847698B2 High-speed feedthrough having a stair-like shape transmission line formed through a multi-layer substrate 有权
标题翻译：高速馈通具有通过多层基板形成的楼梯状的形状传输线
公开(公告)号：US08847698B2
公开(公告)日：2014-09-30
申请号：US13278696
申请日：2011-10-21
申请人： Nikolai Morozov , Zhong Pan
发明人： Nikolai Morozov , Zhong Pan
IPC分类号： H01P5/02 , H01P3/00
CPC分类号： H01P3/003 , H01L2924/0002 , H01L2924/15174 , H01P5/022 , H01P5/028 , H01L2924/00
摘要： A high-speed feedthrough (HSFT) is disclosed for transmitting a signal having a highest frequency of at least 10 GHz between first and second locations separated by a vertical distance of at least approximately half of the shortest transmitted wavelength, and separated by a horizontal distance. A substrate structure includes multiple stacked layers. An RF transmission line is connected through the structure between the first and second locations for transmitting the signal. The RF transmission line comprises a series of sequentially connected horizontal conductors having lengths less than half of the effective wavelength and vertical conductors having heights less than one quarter of the effective wavelength, thereby spanning the horizontal and vertical distance between the two locations in a stairs-like shape through the structure's layers. Each conductor's geometry may deviate from standard 50 ohm buried strip lines and is optimized for complete 3-dimensional structure.
摘要翻译：公开了一种高速馈通（HSFT），用于在第一和第二位置之间传输具有至少10GHz的最高频率的信号，该信号被最短距离的最短透射波长的至少大约一半所隔开，并被水平距离。衬底结构包括多层叠层。 RF传输线通过第一和第二位置之间的结构连接，用于发送信号。 RF传输线包括一系列顺序连接的水平导体，其长度小于有效波长的一半，垂直导体的高度小于有效波长的四分之一，从而跨越楼梯间的两个位置之间的水平和垂直距离，通过结构层的形状。每个导线的几何形状可能偏离标准的50欧姆埋地线，并针对完整的三维结构进行了优化。

133. 发明授权

US08803639B2 Vacuum insulating chamber including waveguides separated by an air gap and including two planar reflectors for controlling radiation power from the air gap 有权
标题翻译：真空绝热室包括由气隙分开的波导并且包括两个平面反射器，用于控制来自气隙的辐射功率
公开(公告)号：US08803639B2
公开(公告)日：2014-08-12
申请号：US13911299
申请日：2013-06-06
申请人： Kabushiki Kaisha Toshiba
发明人： Tamio Kawaguchi , Hiroyuki Kayano , Noritsugu Shiokawa , Kohei Nakayama
IPC分类号： H01P5/02 , H01P1/04 , H01P1/08
CPC分类号： H01P5/024 , H01P1/042 , H01P1/08 , H01P1/30 , H01P3/12 , H01P5/00
摘要： A heat insulating transmission line includes a first waveguide with a first aperture end, a second waveguide with a second aperture end, and a reflector. The second waveguide is arranged coaxially with the first waveguide. The second aperture end faces the first aperture end through an air gap. The reflector is provided outside the air gap, and controls radiation power from the air gap. In addition, the reflector is substantially parallel to a portion of a virtual plane connecting an inner wall of the first aperture end of the first waveguide and an inner wall of the second aperture end of the second waveguide. When a mean frequency of a signal transmitting through the heat insulating transmission line is expressed as λ, a distance between the virtual surface and the reflector is not less than N×λ/2−0.05λ and not more than N×λ/2+0.2λ (N is a positive integer).
摘要翻译：绝热传输线包括具有第一开口端的第一波导，具有第二孔端的第二波导和反射器。第二波导与第一波导同轴配置。第二孔径端通过气隙面向第一孔径端。反射器设置在气隙外部，并控制来自气隙的辐射功率。此外，反射器基本上平行于连接第一波导的第一孔径的内壁和第二波导的第二孔端的内壁的虚拟平面的一部分。当通过绝热传输线传输的信号的平均频率表示为λ时，虚拟表面和反射器之间的距离不小于N×λ/2-0.05λ且不大于N×λ/ 2 + 0.2λ（N为正整数）。

134. 发明授权

US08803629B2 Electromagnetic coupler and information communication device including same 有权
标题翻译：电磁耦合器和包括其的信息通信装置
公开(公告)号：US08803629B2
公开(公告)日：2014-08-12
申请号：US13080128
申请日：2011-04-05
申请人： Yohei Shirakawa , Kazuhiro Fujimoto , Masamichi Kishi , Naoto Teraki
发明人： Yohei Shirakawa , Kazuhiro Fujimoto , Masamichi Kishi , Naoto Teraki
IPC分类号： H01P5/02 , H01G2/22
CPC分类号： H01P5/02 , H01G2/22 , H01P5/04
摘要： There is provided an electromagnetic coupler, which includes: a first conductor pattern and at least one second conductor pattern separated from the first conductor pattern, the first conductor pattern and the at least one second conductor pattern being formed in a first conductor layer; a feed pattern connected to a feeding system and a ground pattern separated from the feed pattern, the feed pattern and the ground pattern being composed of a conductor and formed in a second conductor layer; and a plurality of linear conductors electrically connecting the first conductor pattern with the feed pattern and connecting the second conductor pattern with the ground pattern, the plurality of linear conductors being formed between the first conductor layer and the second conductor layer. Furthermore, the first conductor layer and the second conductor layer are parallel to each other.
摘要翻译：提供了一种电磁耦合器，其包括：第一导体图案和与第一导体图案分离的至少一个第二导体图案，第一导体图案和至少一个第二导体图案形成在第一导体层中; 连接到馈电系统的馈电图案和与馈电图案分离的接地图案，馈电图案和接地图案由导体构成并形成在第二导体层中; 以及将所述第一导体图案与所述馈电图案电连接并将所述第二导体图案与所述接地图形连接的多个线状导体，所述多个线状导体形成在所述第一导体层与所述第二导体层之间。此外，第一导体层和第二导体层彼此平行。

135. 发明申请

US20140002213A1 REDUCED SIZE BIAS TEE 有权
标题翻译：减少尺寸偏差TEE
公开(公告)号：US20140002213A1
公开(公告)日：2014-01-02
申请号：US13534636
申请日：2012-06-27
申请人： Charles F. Clark, JR. , James D. Pileggi
发明人： Charles F. Clark, JR. , James D. Pileggi
IPC分类号： H01P5/02
CPC分类号： H01P5/20
摘要： A system can include a first radio frequency (RF) port, a second RF port electrically coupled with the first RF port, a direct current (DC) port, and a bias tee incorporated into a substrate. The bias tee can include multiple capacitors that are each integrated as a catch pad with a layer of the substrate. The bias tee can also include an inductor at least partially integrated with a layer of the substrate.
摘要翻译：系统可以包括第一射频（RF）端口，与第一RF端口电耦合的第二RF端口，直流（DC）端口和结合到衬底中的偏置三通。偏置三通可以包括多个电容器，每个电容器被集成为具有衬底层的捕捉垫。偏置三通还可以包括至少部分地与衬底层一体化的电感器。

136. 发明授权

US08604891B2 High frequency substrate including a signal line breaking portion coupled by a capacitor 失效
标题翻译：高频基板包括由电容器耦合的信号线断路部分
公开(公告)号：US08604891B2
公开(公告)日：2013-12-10
申请号：US12918954
申请日：2009-03-19
申请人： Risato Ohhira
发明人： Risato Ohhira
IPC分类号： H01P5/02
CPC分类号： H01P3/006 , H01P5/028
摘要： A high-frequency substrate in which a coplanar line including a signal line which transmits a signal and a pair of front ground patterns disposed in parallel with the signal line interposed therebetween is formed on one surface of a dielectric substrate, a back ground pattern is formed to cover the other surface of the dielectric substrate, and a plurality of conductive vias which connect the front ground patterns to the back ground pattern are arranged at a predetermined interval, the high-frequency substrate including: a signal line breaking portion which breaks the signal line; a substantially rectangular parallelepiped signal-line capacitor which is formed to connect the breaking ends of the signal line to each other; and ground pattern breaking portions which are disposed on both sides of the signal line breaking portion of the signal line to break the front ground patterns.
摘要翻译：在电介质基板的一个表面上形成有高频基板，其中，在电介质基板的一个表面上形成有包括发送信号的信号线的共面线和与信号线并列设置的一对前方接地图案的高频基板，形成背面图案以覆盖电介质基板的另一表面，并且以预定间隔布置连接前接地图案和后接地图案的多个导电通孔，高频基板包括：断开信号的信号线断开部分线; 形成为将信号线的断开端彼此连接的大致长方体的信号线电容器，以及设置在信号线的信号线断开部分的两侧的接地图案断开部分，以断开前部接地图案。

137. 发明授权

US08508311B2 Transmission line and electrical apparatus using the same 有权
标题翻译：输电线路和电气设备使用相同
公开(公告)号：US08508311B2
公开(公告)日：2013-08-13
申请号：US13272290
申请日：2011-10-13
申请人： Tzong-Lin Wu , Hao-Hsiang Chuang , Yu-Ren Cheng
发明人： Tzong-Lin Wu , Hao-Hsiang Chuang , Yu-Ren Cheng
IPC分类号： H03H7/38 , H01P5/02 , H04B3/14
CPC分类号： H04B3/28 , H01P3/02 , H04B3/14 , H04B3/32
摘要： A transmission line with a structure which is capable of forming a passive equalizer and an electrical apparatus using the same are illustrated. The transmission line has a substrate, a ground plane, a defect ground structure, a pair of transmission conducting lines, and at least one stub. The substrate has a plurality of surfaces. The ground plane is located on at least one of the surfaces. The defect ground structure is formed on the ground plane. The pair of transmission conducting lines is located on one of the surfaces, and stretching over the defect ground structure. The at least one stub is located above a plane of the defect ground structure, extending along with at least one side of two sides of the pair of the transmission conducting lines, and electrically coupled to the pair of the transmission conducting lines and the ground plane.
摘要翻译：示出了能够形成无源均衡器的结构的传输线和使用其的电气设备。传输线具有基板，接地平面，缺陷接地结构，一对传输导线和至少一个短截线。基板具有多个表面。接地平面位于至少一个表面上。缺陷接地结构形成在地面上。一对传输导线位于一个表面上，并在缺陷接地结构上进行拉伸。所述至少一个短截线位于所述缺陷接地结构的平面之上，与所述一对传输导线的两侧的至少一侧一起延伸，并且电耦合到所述一对传输导线和接地平面。

138. 发明申请

US20120262254A1 Antenna Coupler 有权
标题翻译：天线耦合器
公开(公告)号：US20120262254A1
公开(公告)日：2012-10-18
申请号：US13501916
申请日：2010-08-06
申请人： Igor Dremelj , Heinz Hohl
发明人： Igor Dremelj , Heinz Hohl
IPC分类号： H01P5/02
CPC分类号： H01P5/187
摘要： In an antenna coupler, a multilayer printed-circuit board has conductor levels which are electrically isolated from one another in the depth direction. A first radio-frequency line coupled to the antenna is arranged in a first conductor level, while a second radio-frequency line coupled on the appliance side is arranged in a second conductor level of the board. The board has an electrically insulating core layer, with the first and second conductor levels extending on the same of the two faces of the core layer and with the second radio-frequency line at a greater distance from the core layer than the first radio-frequency line. Furthermore, the second radio-frequency line is arranged on an outer surface of the board. The antenna coupler comprises an electrically conductive shielding structure designed to shield the first radio-frequency line and appliance-side metal parts, which are not part of the antenna coupler, against interaction with radio-frequency signals.
摘要翻译：在天线耦合器中，多层印刷电路板具有在深度方向上彼此电隔离的导体电平。耦合到天线的第一射频线路布置在第一导体电平中，而耦合在器具侧的第二射频线路布置在电路板的第二导体电平中。电路板具有电绝缘芯层，其中第一和第二导体电平在芯层的两个面的相同部分上延伸，并且第二射频线在距核心层的距离处比第一射频线。此外，第二射频线路布置在板的外表面上。天线耦合器包括导电屏蔽结构，其被设计为屏蔽不是天线耦合器的一部分的第一射频线和器具侧金属部件与射频信号的相互作用。

139. 发明申请

US20120194301A1 CAPACITIVE COUPLER PACKAGING STRUCTURE 有权
标题翻译：电容耦合器包装结构
公开(公告)号：US20120194301A1
公开(公告)日：2012-08-02
申请号：US13359460
申请日：2012-01-26
申请人： Ho-Yin YIU , Chien-Hung LIU , Ying-Nan WEN , Shih-Yi LEE , Wei-Chung YANG , Bai-Yao LOU , Hung-Jen LEE
发明人： Ho-Yin YIU , Chien-Hung LIU , Ying-Nan WEN , Shih-Yi LEE , Wei-Chung YANG , Bai-Yao LOU , Hung-Jen LEE
IPC分类号： H03H7/00 , H01P5/02
CPC分类号： H01L23/642 , H01L23/48 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/13101 , H01L2224/16225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/01327 , H01L2924/1901 , H01L2924/3011 , H01L2924/00 , H01L2224/45099 , H01L2924/014
摘要： Embodiments of the present invention provide a capacitive coupler packaging structure including a substrate with at least one capacitor and a receiver formed thereon, wherein the at least one capacitor at least includes a first electrode layer, a second electrode layer and a capacitor dielectric layer therebetween, and the first electrode layer is electrically connected to the receiver via a solder ball. The capacitive coupler packaging structure also includes a transmitter electrically connecting to the capacitor.
摘要翻译：本发明的实施例提供一种电容耦合器封装结构，其包括具有至少一个电容器的基板和形成在其上的接收器，其中所述至少一个电容器至少包括第一电极层，第二电极层和电介质层之间，并且第一电极层通过焊球电连接到接收器。电容耦合器封装结构还包括电连接到电容器的发射器。

140. 发明授权

US08169276B2 Vertical transmission line structure that includes bump elements for flip-chip mounting 有权
标题翻译：垂直传输线结构，包括用于倒装芯片安装的凸块
公开(公告)号：US08169276B2
公开(公告)日：2012-05-01
申请号：US13023235
申请日：2011-02-08
申请人： Edward Yi Chang , Wei-Cheng Wu , Ruey-Bing Hwang , Li-Han Hsu
发明人： Edward Yi Chang , Wei-Cheng Wu , Ruey-Bing Hwang , Li-Han Hsu
IPC分类号： H01P5/02
CPC分类号： H01P1/047 , H01L23/66 , H01L2223/6616 , H01L2223/6627 , H01L2924/0002 , H01L2924/09701 , H01L2924/19032 , H01L2924/19033 , H01L2924/3011 , H01P5/028 , H01L2924/00
摘要： A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.
摘要翻译：用于高频传输线的垂直传输结构包括导电轴芯和围绕导电轴芯的导电结构。垂直传输结构被应用于高频倒装芯片封装，用于降低底部填充物与导电轴芯接触的可能性。

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