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    • 137. 发明申请
    • Nonvolatile semiconductor memory device and manufacturing method thereof
    • 非易失性半导体存储器件及其制造方法
    • US20080067583A1
    • 2008-03-20
    • US11898746
    • 2007-09-14
    • Masaru KidohRyota KatsumataHiroyasu TanakaHideaki AochiMasaru Kito
    • Masaru KidohRyota KatsumataHiroyasu TanakaHideaki AochiMasaru Kito
    • H01L29/792H01L21/4763
    • H01L27/105G11C16/0483H01L21/8221H01L27/0688H01L27/115H01L27/11529H01L27/11556H01L27/11568H01L27/11582H01L29/66825H01L29/7881
    • A nonvolatile semiconductor memory device includes a substrate, and a plurality of memory strings, the memory string including a first selection transistor including a first pillar shaped semiconductor formed perpendicular to the substrate, a first gate insulating film formed around the first pillar shaped semiconductor, and a first gate electrode formed around the first gate insulating film, and a plurality of memory cells including a second pillar shaped semiconductor formed on the first pillar shaped semiconductor, the diameter of the first pillar shaped semiconductor being larger than the diameter of the second pillar shaped semiconductor at the part where the second pillar shaped semiconductor is connected to the first pillar shaped semiconductor, a first insulating film formed around the second pillar shaped semiconductor, a charge storage layer formed around the first insulating film, a second insulating film formed around the charge storage layer, and first to nth electrodes formed around the second insulating film (n is a natural number not less than 2), the first to nth electrodes being plate shaped, the first to nth electrodes being first to nth conductor layers spread in two dimensions, and a second selection transistor including a third pillar shaped semiconductor formed on the second pillar shaped semiconductor, a second gate insulating film formed around the third pillar shaped semiconductor and a second gate electrode formed around the second gate insulating film.
    • 非易失性半导体存储器件包括衬底和多个存储器串,所述存储器串包括第一选择晶体管,所述第一选择晶体管包括垂直于所述衬底形成的第一柱状半导体,围绕所述第一柱状半导体形成的第一栅极绝缘膜,以及 形成在第一栅极绝缘膜周围的第一栅电极和形成在第一柱状半导体上的包括第二柱状半导体的多个存储单元,第一柱状半导体的直径大于第二柱状半导体的直径 在第二柱状半导体与第一柱状半导体连接的部分处的半导体,形成在第二柱状半导体周围的第一绝缘膜,形成在第一绝缘膜周围的电荷存储层,形成在电荷周围的第二绝缘膜 存储层和第一至第n电极fo 围绕第二绝缘膜(n是不小于2的自然数),第一至第n电极是板状的,第一至第n电极是第一至第n导体层在二维上扩展,第二选择晶体管包括 形成在第二柱状半导体上的第三柱状半导体,围绕第三柱状半导体形成的第二栅极绝缘膜和形成在第二栅极绝缘膜周围的第二栅电极。