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131. 发明申请

US20080273307A1 LIQUID-BASED COOLING SYSTEM FOR COOLING A MULTI-COMPONENT ELECTRONICS SYSTEM 有权
标题翻译：用于冷却多组分电子系统的基于液体的冷却系统
公开(公告)号：US20080273307A1
公开(公告)日：2008-11-06
申请号：US12168267
申请日：2008-07-07
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20009 , G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components.
摘要翻译：提供了一种用于冷却电子系统的系统。冷却系统包括预先配置用于冷却电子系统的多个电子部件的单片结构，当与其耦合时。整体结构包括多个液冷冷板，其配置和间隔设置，以耦合到相应的电子部件; 多个与多个液冷冷却板流体连通地冶金结合的冷却剂供给管，以及与多个冷却剂供给管道流体连通地冶金结合的液体 - 冷却剂集管组件。头部组件包括冶金地结合到冷却剂供应管的冷却剂供应头和与冷却剂返回管冶金结合的冷却剂回流头。当使用时，多个液冷冷板接合电子系统的各个电子部件，并且液体冷却剂通过液体 - 冷却剂集管子组件和多个冷却剂输送管分配到冷板以除去由各自的电子元件。

132. 发明申请

US20080259567A1 CONDUCTIVE HEAT TRANSPORT COOLING SYSTEM AND METHOD FOR A MULTI-COMPONENT ELECTRONICS SYSTEM 失效
公开(公告)号：US20080259567A1
公开(公告)日：2008-10-23
申请号：US12144859
申请日：2008-06-24
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Randall G. Kemink , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Randall G. Kemink , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20509 , H01L23/473 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H05K7/20009 , H05K7/20772 , H01L2224/0401
摘要： A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.

133. 发明申请

US20070272396A1 Heat Exchanger With Angled Fin 审中-公开
标题翻译：带翅片的换热器
公开(公告)号：US20070272396A1
公开(公告)日：2007-11-29
申请号：US11420237
申请日：2006-05-25
申请人： Levi A Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F28F13/00
CPC分类号： F28F1/34 , F28D2021/0031 , H01L23/3672 , H01L23/473 , H01L2924/0002 , H05K7/20754 , H01L2924/00
摘要： An angled finned heat exchanger and associated method is provided. The heat exchanger cools the air provided to the electronic components and is disposed at an angle with respect to direction of air flow. The heat exchanger comprises a plurality of fins that are at an angle with respect to frontal area of the heat exchanger. In alternate embodiments, the angle of the fin is optimized to minimize air pressure loss and/or drop. Some suggested methods of fabrication of the fins are also provided.
摘要翻译：提供了一种有角度的翅片式热交换器和相关联的方法。热交换器冷却提供给电子部件的空气，并且相对于空气流动的方向以一定角度设置。热交换器包括与热交换器的正面区域成一角度的多个翅片。在替代实施例中，翅片的角度被优化以最小化空气压力损失和/或下降。还提供了一些建议的翅片制造方法。

134. 发明授权

US07665325B2 Multi-fluid cooling system and method with freeze protection for cooling an electronic device 失效
标题翻译：多流体冷却系统和冷冻保护方法，用于冷却电子设备
公开(公告)号：US07665325B2
公开(公告)日：2010-02-23
申请号：US11530992
申请日：2006-09-12
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F25D11/00 , F25B45/00 , H05K7/20
CPC分类号： F25B23/00 , F25B9/006 , H05K7/20281
摘要： A multi-fluid cooling system and method for cooling an electronic device are provided which employ freeze protection when in a shipping state. The cooling system includes a coolant loop having an expansion tank containing first and second fluids, which are immiscible and of different densities, and the second fluid freezes at a lower temperature than the first. The coolant loop further includes a first valve for facilitating coupling of the first fluid into the coolant loop and a second valve for facilitating coupling of the second fluid into the coolant loop, the first and second valves being independently controllable. Control logic electronically controls actuation of the first and second valves to automatically pass the first fluid through the coolant loop when the system is in an operational state and to automatically maintain the second fluid in the coolant loop when the system is in a shipping state.
摘要翻译：提供一种用于冷却电子设备的多流体冷却系统和方法，其在运输状态下采用防冻保护。冷却系统包括冷却剂回路，其具有包含第一和第二流体的膨胀罐，其不混溶并且具有不同的密度，并且第二流体在比第一流体低的温度下冻结。冷却剂回路还包括用于促进第一流体耦合到冷却剂回路中的第一阀和用于促进第二流体耦合到冷却剂回路中的第二阀，第一和第二阀是可独立控制的。当系统处于操作状态时，控制逻辑电子地控制第一和第二阀的致动，以自动地将第一流体通过冷却剂回路，并且当系统处于运输状态时，自动维持冷却剂回路中的第二流体。

135. 发明授权

US07385817B2 Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled 失效
标题翻译：冷却装置和方法采用设置在模块外壳和要冷却的电子部件之间的分立冷板
公开(公告)号：US07385817B2
公开(公告)日：2008-06-10
申请号：US11871334
申请日：2007-10-12
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.
摘要翻译：提供冷却装置和方法用于冷却包括支撑多个电子部件的基板的组件。冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂室; 和多个冷却剂输送管，每个管从相应的冷板延伸并与冷板的冷却剂入口或出口流体连通。提供了一个外壳，其周边区域与基板接合以形成空腔，电子部件和冷板设置在空腔内。外壳被配置有多个孔，每个孔的尺寸和位置被定位成接收从冷板延伸的管的相应的冷却剂承载管。此外，外壳配置有与管流体连通的歧管，用于与冷板平行地分配冷却剂。

136. 发明申请

US20080060368A1 MULTI-FLUID COOLING SYSTEM AND METHOD WITH FREEZE PROTECTION FOR COOLING AN ELECTRONIC DEVICE 失效
标题翻译：用于冷却电子设备的多流体冷却系统和冷冻保护方法
公开(公告)号：US20080060368A1
公开(公告)日：2008-03-13
申请号：US11530992
申请日：2006-09-12
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F25B45/00
CPC分类号： F25B23/00 , F25B9/006 , H05K7/20281
摘要： A multi-fluid cooling system and method for cooling an electronic device are provided which employ freeze protection when in a shipping state. The cooling system includes a coolant loop having an expansion tank containing first and second fluids, which are immiscible and of different densities, and the second fluid freezes at a lower temperature than the first. The coolant loop further includes a first valve for facilitating coupling of the first fluid into the coolant loop and a second valve for facilitating coupling of the second fluid into the coolant loop, the first and second valves being independently controllable. Control logic electronically controls actuation of the first and second valves to automatically pass the first fluid through the coolant loop when the system is in an operational state and to automatically maintain the second fluid in the coolant loop when the system is in a shipping state.
摘要翻译：提供一种用于冷却电子设备的多流体冷却系统和方法，其在运输状态下采用防冻保护。冷却系统包括冷却剂回路，其具有包含第一和第二流体的膨胀罐，其不混溶并且具有不同的密度，并且第二流体在比第一流体低的温度下冻结。冷却剂回路还包括用于促进第一流体耦合到冷却剂回路中的第一阀和用于促进第二流体耦合到冷却剂回路中的第二阀，第一和第二阀是可独立控制的。当系统处于操作状态时，控制逻辑电子地控制第一和第二阀的致动，以自动地将第一流体通过冷却剂回路，并且当系统处于运输状态时，自动维持冷却剂回路中的第二流体。

137. 发明申请

US20070295480A1 MULTI-FLUID COOLING SYSTEM, COOLED ELECTRONICS MODULE, AND METHODS OF FABRICATION THEREOF 失效
标题翻译：多流体冷却系统，冷却电子模块及其制造方法
公开(公告)号：US20070295480A1
公开(公告)日：2007-12-27
申请号：US11426423
申请日：2006-06-26
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L23/427 , H01L2924/0002 , Y10S165/908 , Y10T29/49002 , H01L2924/00
摘要： A multi-fluid cooling system and methods of fabrication thereof are provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool the one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.
摘要翻译：提供多流体冷却系统及其制造方法，用于从一个或多个电子设备去除热量。冷却系统包括具有至少一个第一流体入口孔口和至少一个第二流体入口孔口的多流体歧管结构，用于在采用冷却系统时同时单独地将第一流体和第二流体注入待冷却的表面上以冷却一个或多个电子设备，其中所述第一流体和所述第二流体是不混溶的，并且所述第一流体具有比所述第二流体低的沸点温度。当冷却系统用于冷却一个或多个电子装置和第一流体沸腾时，放出的第一流体蒸汽通过与较高沸点温度的第二流体直接接触而原位冷凝。

138. 发明授权

US07841385B2 Dual-chamber fluid pump for a multi-fluid electronics cooling system and method 有权
标题翻译：双腔流体泵用于多流体电子冷却系统和方法
公开(公告)号：US07841385B2
公开(公告)日：2010-11-30
申请号：US11426431
申请日：2006-06-26
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F28F7/00 , F04F1/18
CPC分类号： H05K7/20218
摘要： A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.
摘要翻译：为多流体电子冷却系统和方法提供双室流体泵。泵具有用于泵送第一流体冷却剂的第一流体路径和用于泵送第二流体冷却剂的第二流体路径，其中第一流体路径包括第一泵送室，第二流体路径包括第二泵送室。第一和第二泵送室由至少一个隔膜隔开，并且致动器联接到隔膜，用于在第一位置和第二位置之间转换隔膜。将隔膜转换到第一位置将第一流体冷却剂从第一泵送室抽出，同时将第二流体冷却剂拉入第二泵送室，并且将膜片转移到第二位置，从第二泵送室泵送第二流体冷却剂，同时拉伸第一流体冷却剂进入第一泵送室。

139. 发明申请

US20080245506A1 COOLING APPARTUSES WITH DISCRETE COLD PLATES COMPLIANTLY COUPLED BETWEEN A COMMON MANIFOLD AND ELECTRONICS COMPONENTS OF AN ASSEMBLY TO BE COOLED 有权
标题翻译：冷却配件与散装冷却板的冷却配件在通用冷却器和要组装的组件的电子部件之间紧密耦合
公开(公告)号：US20080245506A1
公开(公告)日：2008-10-09
申请号：US12137775
申请日：2008-06-12
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F28F7/00
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/2079
摘要： Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.
摘要翻译：提供冷却装置和方法用于冷却包括支撑多个电子部件的平面支撑结构的组件。冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂承载通道; 以及用于将冷却剂分配到冷板并从冷板排出冷却剂的歧管。冷却装置还包括将冷板的冷却剂入口连接到歧管的多个柔性软管以及到歧管的冷却剂出口，每个软管段设置在相应的冷板和歧管之间。偏置机构将冷板偏离歧管并朝向电子部件，并且至少一个紧固件将歧管固定到支撑结构，压缩偏置机构，从而迫使并联的冷板朝向它们各自的电子部件以确保良好的热界面。

140. 发明授权

US07380409B2 Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing 有权
标题翻译：隔离阀和冷却剂连接/断开组件和用于连接液冷电子子系统和电子设备外壳的制造方法
公开(公告)号：US07380409B2
公开(公告)日：2008-06-03
申请号：US10954792
申请日：2004-09-30
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Donald W. Porter , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Donald W. Porter , Roger R. Schmidt , Robert E. Simons
IPC分类号： F25D23/12 , F28D15/00 , H05K7/20 , F16K31/44
CPC分类号： H05K7/20772
摘要： An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of a coolant supply or return line providing liquid coolant to the electronics subsystem. The actuation member is coupled to the isolation valve to automatically translate a linear motion, resulting from insertion of the electronics subsystem into the operational position within the electronics housing, into a rotational motion to open the isolation valve and allow coolant to pass. The actuation mechanism, which operates to automatically close the isolation valve when the liquid cooled electronics subsystem is withdrawn from the operational position, can be employed in combination with a compression valve coupling, with one fitting of the compression valve coupling being disposed serially in fluid communication with the isolation valve.
摘要翻译：使用隔离阀和致动机构来提供隔离阀组件，冷却剂连接/断开组件，冷却的多叶片电子设备中心及其制造方法。隔离阀设置在向电子子系统提供液体冷却剂的冷却剂供应或返回管线中的至少一个中。致动构件联接到隔离阀以自动地将由电子系统子系统插入电子设备外壳内的操作位置而产生的直线运动转换成旋转运动，以打开隔离阀并允许冷却剂通过。当液体冷却的电子子系统从操作位置退出时，操作以自动关闭隔离阀的致动机构可以与压缩阀联接一起使用，压缩阀联接器的一个配件串联设置为流体连通与隔离阀。

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