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    • 131. 发明授权
    • Systems for erase voltage manipulation in non-volatile memory for controlled shifts in threshold voltage
    • 用于在非易失性存储器中擦除电压操作的系统用于阈值电压的受控偏移
    • US07522457B2
    • 2009-04-21
    • US11773927
    • 2007-07-05
    • Gerrit Jan HeminkTeruhiko Kamei
    • Gerrit Jan HeminkTeruhiko Kamei
    • G11C11/34
    • G11C16/344G11C11/5635G11C16/0483G11C16/16G11C16/3404G11C16/3445G11C2211/5621
    • The erase voltage applied to a set of non-volatile storage elements being erased is structured to provide controlled shifts in the threshold voltage of the storage elements. The erase voltage is applied as a series of voltage pulses, when necessary, to shift the threshold voltage of to-be-erased memory cells below a verify level indicative of an erased condition. To avoid over-erasing the memory cells, the second erase voltage pulse is decreased, or not increased, in magnitude when compared to the previously applied voltage pulse. By decreasing or not increasing the size of the erase voltage, the amount of charge transferred from the cells by the second pulse is controlled to more accurately position an erased threshold voltage distribution for the cells near the verify level. Subsequent erase voltage pulses are increased in magnitude to provide further erasing when needed.
    • 施加到被擦除的一组非易失性存储元件的擦除电压被构造成提供存储元件的阈值电压的受控偏移。 当需要时,将擦除电压作为一系列电压脉冲施加以将被擦除的存储器单元的阈值电压移动到指示擦除状态的验证电平以下。 为了避免过度擦除存储单元,与先前施加的电压脉冲相比,第二擦除电压脉冲的幅度减小或不增加。 通过减小或不增加擦除电压的大小,控制从单元传输的第二脉冲的电荷量,以更准确地定位靠近验证电平的单元的擦除的阈值电压分布。 随后的擦除电压脉冲的幅度增大,以便在需要时进一步擦除。
    • 132. 发明申请
    • Self-Boosting System for Flash Memory Cells
    • 闪存单元的自升压系统
    • US20090073761A1
    • 2009-03-19
    • US12276186
    • 2008-11-21
    • Gerrit Jan Hemink
    • Gerrit Jan Hemink
    • G11C16/02G11C16/06
    • G11C16/10G11C16/0483
    • A low voltage of the order of or one to three volts instead of an intermediate VPASS voltage (e.g. of the order of five to ten volts) is applied to word line zero immediately adjacent to the source or drain side select gate of a NAND flash device to reduce or prevent the shifting of threshold voltage of the memory cells coupled to word line zero during the programming cycles of the different cells of the NAND strings. This may be implemented in any one of a variety of different self boosting schemes including erased areas self boosting and local self boosting schemes. In a modified erased area self boosting scheme, low voltages are applied to two or more word lines on the source side of the selected word line to reduce band-to-band tunneling and to improve the isolation between two boosted channel regions. In a modified local self boosting scheme, zero volt or low voltages are applied to two or more word lines on the source side and to two or more word lines on the drain side of the selected word line to reduce band-to-band tunneling and to improve the isolation of the channel areas coupled to the selected word line.
    • 代替中间VPASS电压(例如5至10伏的数量级)的一级或一到三伏的低电压被施加到紧邻NAND闪存器件的源极或漏极侧选择栅极的字线零点 以减少或防止在NAND串的不同单元的编程周期期间耦合到字线零的存储单元的阈值电压偏移。 这可以在各种不同的自增强方案中的任何一种中实现,包括擦除区域自增强和局部自增强方案。 在修改的擦除区域自增强方案中,将低电压施加到所选字线的源极侧上的两个或更多个字线,以减少带间隧穿并改善两个增强的通道区域之间的隔离。 在修改后的局部自增强方案中,将零电压或低电压施加到源极侧的两条或更多条字线和所选择的字线的漏极侧上的两条或多条字线,以减少带间隧穿和 以改善耦合到所选字线的通道区域的隔离。
    • 133. 发明授权
    • Self-boosting system for flash memory cells
    • 闪存单元的自增强系统
    • US07471566B2
    • 2008-12-30
    • US11609688
    • 2006-12-12
    • Gerrit Jan Hemink
    • Gerrit Jan Hemink
    • G11C11/34
    • G11C16/10G11C16/0483
    • A low voltage of the order of or one to three volts instead of an intermediate VPASS voltage (e.g. of the order of five to ten volts) is applied to word line zero immediately adjacent to the source or drain side select gate of a NAND flash device to reduce or prevent the shifting of threshold voltage of the memory cells coupled to word line zero during the programming cycles of the different cells of the NAND strings. This may be implemented in any one of a variety of different self boosting schemes including erased areas self boosting and local self boosting schemes. In a modified erased area self boosting scheme, low voltages are applied to two or more word lines on the source side of the selected word line to reduce band-to-band tunneling and to improve the isolation between two boosted channel regions. In a modified local self boosting scheme, zero volt or low voltages are applied to two or more word lines on the source side and to two or more word lines on the drain side of the selected word line to reduce band-to-band tunneling and to improve the isolation of the channel areas coupled to the selected word line.
    • 代替中间VPASS电压(例如5至10伏的数量级)的一级或一到三伏的低电压被施加到紧邻NAND闪存器件的源极或漏极侧选择栅极的字线零点 以减少或防止在NAND串的不同单元的编程周期期间耦合到字线零的存储单元的阈值电压偏移。 这可以在各种不同的自增强方案中的任何一种中实现,包括擦除区域自增强和局部自增强方案。 在修改的擦除区域自增强方案中,将低电压施加到所选字线的源极侧上的两个或更多个字线,以减少带间隧穿并改善两个增强的通道区域之间的隔离。 在修改后的局部自增强方案中,将零电压或低电压施加到源极侧的两条或更多条字线和所选择的字线的漏极侧上的两条或多条字线,以减少带间隧穿和 以改善耦合到所选字线的通道区域的隔离。
    • 136. 发明申请
    • SYSTEMS FOR CONTROLLED BOOSTING IN NON-VOLATILE MEMORY SOFT PROGRAMMING
    • 用于在非易失性存储器软件编程中进行控制的系统
    • US20080117684A1
    • 2008-05-22
    • US11560751
    • 2006-11-16
    • Gerrit Jan Hemink
    • Gerrit Jan Hemink
    • G11C11/34
    • G11C16/0483G11C11/5628G11C16/3404
    • A soft programming pre-charge voltage provides boosting control during soft programming operations for non-volatile memory devices. A pre-charge voltage can be applied to the word lines of a block of memory cells to enable pre-charging of the channel region of a NAND string to be inhibited from soft programming. The level of boosting in the channel region of the inhibited NAND string is governed by the pre-charge voltage and the soft programming voltage. By controlling the pre-charge voltage, more reliable and consistent channel boosting can be achieved. In one embodiment, the pre-charge voltage is increased between applications of the soft programming voltage to reduce or eliminate a rise in the channel's boosted potential. In one embodiment, the soft programming pre-charge voltage level(s) is determined during testing that is performed as part of a manufacturing process.
    • 软编程预充电电压在非易失性存储器件的软编程操作期间提供升压控制。 可以将预充电电压施加到一块存储器单元的字线,以使得能够预先对NAND串的通道区进行预编程以禁止软编程。 被禁止的NAND串的通道区域中的升压电平由预充电电压和软编程电压控制。 通过控制预充电电压,可以实现更可靠和一致的通道增压。 在一个实施例中,在应用软编程电压之间增加预充电电压以减少或消除通道的升压电位的上升。 在一个实施例中,软编程预充电电压电平在作为制造过程的一部分执行的测试期间被确定。