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    • 132. 发明授权
    • Memory device constructions, memory cell forming methods, and semiconductor construction forming methods
    • 存储器件结构,存储单元形成方法和半导体构造形成方法
    • US09111788B2
    • 2015-08-18
    • US13418082
    • 2012-03-12
    • Jun Liu
    • Jun Liu
    • H01L45/00H01L27/102G11C13/00H01L27/24H01L29/872
    • H01L45/1608G11C13/003G11C2213/72H01L27/1021H01L27/24H01L27/2409H01L27/2463H01L29/6609H01L29/872
    • Memory device constructions include a first column line extending parallel to a second column line, the first column line being above the second column line; a row line above the second column line and extending perpendicular to the first column line and the second column line; memory material disposed to be selectively and reversibly configured in one of two or more different resistive states; a first diode configured to conduct a first current between the first column line and the row line via the memory material; and a second diode configured to conduct a second current between the second column line and the row line via the memory material. In some embodiments, the first diode is a Schottky diode having a semiconductor anode and a metal cathode and the second diode is a Schottky diode having a metal anode and a semiconductor cathode.
    • 存储器件结构包括平行于第二列线延伸的第一列线,第一列线在第二列线之上; 在第二列线上方的行线,并垂直于第一列线和第二列线延伸; 存储器材料,其设置成选择性地和可逆地配置为两种或更多种不同电阻状态之一; 第一二极管,被配置为经由所述存储材料在所述第一列线和所述行线之间传导第一电流; 以及第二二极管,被配置为经由存储器材料在第二列线和行线之间传导第二电流。 在一些实施例中,第一二极管是具有半导体阳极和金属阴极的肖特基二极管,第二二极管是具有金属阳极和半导体阴极的肖特基二极管。
    • 133. 发明授权
    • Luminescent material of gallium indium oxide and preparation method thereof
    • 镓铟氧化物的发光材料及其制备方法
    • US09068118B2
    • 2015-06-30
    • US13881161
    • 2010-12-20
    • Mingjie ZhouJun LiuWenbo Ma
    • Mingjie ZhouJun LiuWenbo Ma
    • C09K11/08C09K11/02C09K11/87C09K11/62
    • C09K11/873C09K11/621
    • A luminescent material of gallium indium oxide and preparation method thereof are provided. The luminescent material of gallium indium oxide has a chemical formula of GaInO3:zM, wherein, M is the metal nano-particle which is selected from one or two of Ag, Au, Pt and Pd, and z meets the condition of 1×10−5≦z≦0.02. The method for preparing the luminescent material comprises the following steps: (1) preparing the mixed solution containing indium ion and gallium ion; (2) adding chelator and crosslinking agent into the mixed solution to obtain a chelate solution; (3) adding M nano-particles sol which is surface treated into the chelate solution, heating by water-bath and stirring, drying to obtain the precursor of the luminescent material; (4) preheating the precursor, cooling, grinding, calcining, then cooling and grinding again to obtain the luminescent material.
    • 提供了一种铟镓铟的发光材料及其制备方法。 镓铟氧化物的发光材料具有GaInO 3:zM的化学式,其中M是选自Ag,Au,Pt和Pd中的一种或两种的金属纳米颗粒,z满足1×10 -5≦̸ z≦̸ 0.02。 制备发光材料的方法包括以下步骤:(1)制备含有铟离子和镓离子的混合溶液; (2)向混合溶液中加入螯合剂和交联剂,得到螯合溶液; (3)将表面处理的M纳米颗粒溶胶加入到螯合溶液中,通过水浴加热搅拌,干燥得到发光材料的前体; (4)预热前体,冷却,研磨,煅烧,然后再次冷却和研磨,得到发光材料。
    • 138. 发明授权
    • Integrated circuits with asymmetric pass transistors
    • 具有不对称传输晶体管的集成电路
    • US08921170B1
    • 2014-12-30
    • US13408959
    • 2012-02-29
    • Jun LiuAlbert RatnakumarMark T. ChanIrfan Rahim
    • Jun LiuAlbert RatnakumarMark T. ChanIrfan Rahim
    • H01L21/338
    • H01L21/823418H01L21/324H01L21/823814H01L27/082H01L27/088H01L29/1083H01L29/6653H01L29/66659
    • Asymmetric transistors such as asymmetric pass transistors may be formed on an integrated circuit. The asymmetric transistors may have gate structures. Symmetric pocket implants may be formed in source-drains on opposing sides of each transistor gate structure. Selective heating may be used to asymmetrically diffuse the implants. Selective heating may be implemented by patterning the gate structures on a semiconductor substrate so that the spacing between adjacent gate structures varies. A given gate structure may be located between first and second adjacent gate structures spaced at different respective distances from the given gate structure. A larger gate structure spacing leads to a greater substrate temperature rise than a smaller gate structure spacing. The pocket implant diffuses more in portions of the substrate with the greater temperature rise, producing asymmetric transistors. Asymmetric pass transistors may be controlled by static control signals from memory elements to implement circuits such as programmable multiplexers.
    • 不对称晶体管,例如不对称传输晶体管可以形成在集成电路上。 不对称晶体管可以具有栅极结构。 可以在每个晶体管栅极结构的相对侧上的源极漏极中形成对称的袋状植入物。 选择性加热可用于不对称地扩散植入物。 可以通过在半导体衬底上图案化栅极结构来实现选择性加热,使得相邻栅极结构之间的间隔变化。 给定的栅极结构可以位于与给定栅极结构不同的相应距离处间隔开的第一和第二相邻栅极结构之间。 较大的栅极结构间隔导致比较小栅极结构间隔更大的衬底温度升高。 在较大的温度上升的情况下,口袋植入物在衬底的部分扩散,产生不对称晶体管。 不对称传输晶体管可以由来自存储器元件的静态控制信号来控制,以实现诸如可编程多路复用器之类的电路。