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131. 发明授权

US07768096B2 System for fabricating semiconductor components with conductive interconnects 有权
标题翻译：用于制造具有导电互连的半导体部件的系统
公开(公告)号：US07768096B2
公开(公告)日：2010-08-03
申请号：US12114761
申请日：2008-05-03
申请人： Alan G. Wood , William M. Hiatt , David R. Hembree
发明人： Alan G. Wood , William M. Hiatt , David R. Hembree
IPC分类号： H01L21/00 , H01L21/76 , H01L21/44
CPC分类号： H01L21/76898 , H01L21/4885 , H01L21/6835 , H01L21/6836 , H01L23/3114 , H01L23/481 , H01L23/4951 , H01L23/4985 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/78 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/06102 , H01L2224/06136 , H01L2224/11003 , H01L2224/1131 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/2518 , H01L2224/45015 , H01L2224/451 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4813 , H01L2224/4824 , H01L2224/4845 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/78301 , H01L2224/8121 , H01L2224/81815 , H01L2224/85001 , H01L2224/851 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2225/06513 , H01L2225/06541 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/19042 , Y10T29/53187 , Y10T29/53209 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2224/83851 , H01L2224/05552
摘要： A system for fabricating semiconductor components includes a semiconductor substrate, a thinning system for thinning the semiconductor substrate, an etching system for forming the substrate opening, and a bonding system for bonding the conductive interconnect to the substrate contact. The semiconductor component can be used to form module components, underfilled components, stacked components, and image sensor semiconductor components.
摘要翻译：一种用于制造半导体元件的系统包括半导体衬底，用于减薄半导体衬底的薄化系统，用于形成衬底开口的蚀刻系统，以及用于将导电互连件接合到衬底触点的接合系统。半导体元件可用于形成模块组件，底部填充组件，堆叠组件和图像传感器半导体组件。

132. 发明授权

US07723741B2 Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers 有权
标题翻译：用于封装的微电子成像器的间隔器以及制造和使用间隔件用于成像器的晶片级封装的方法
公开(公告)号：US07723741B2
公开(公告)日：2010-05-25
申请号：US11451398
申请日：2006-06-13
申请人： Warren M. Farnworth , Alan G. Wood , James M. Wark , David R. Hembree , Rickie C. Lake
发明人： Warren M. Farnworth , Alan G. Wood , James M. Wark , David R. Hembree , Rickie C. Lake
IPC分类号： H01L21/00
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L27/14634 , H01L27/14683 , H01L2224/48227 , H01L2224/48091 , H01L2924/00014
摘要： Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can propagate. The imager dies include image sensors and integrated circuitry coupled to the image sensors. The method further includes providing a spacer having a web that includes an adhesive and has openings arranged to be aligned with the image sensors. For example, the web can be a film having an adhesive coating, or the web itself can be a layer of adhesive. The method continues by assembling the imager workpiece with the cover substrate such that (a) the spacer is between the imager workpiece and the cover substrate, and (b) the openings are aligned with the image sensors. The attached web is not cured after the imager workpiece and the cover substrate have both been adhered to the web. As such, the web does not outgas contaminants into the compartments in which the image sensors are housed.
摘要翻译：包装微电子成像仪和封装的微电子成像仪的方法。这种方法的实施例可以包括提供具有以模片图案布置的多个成像模具的成像工件，并提供覆盖基板，期望的辐射可以通过该基板传播。成像器裸片包括耦合到图像传感器的图像传感器和集成电路。该方法还包括提供具有包括粘合剂并具有布置成与图像传感器对准的开口的腹板的间隔件。例如，网可以是具有粘合剂涂层的膜，或者网本身可以是一层粘合剂。该方法通过将成像器工件与盖基板组装成使得（a）间隔件位于成像器工件和盖基板之间，并且（b）开口与图像传感器对准，该方法继续。在成像器工件和盖基板都已经粘附在卷材上之后，连接的卷材不固化。因此，纸幅不会将污染物排出到其中容纳图像传感器的隔室中。

133. 发明授权

US07683458B2 Through-wafer interconnects for photoimager and memory wafers 失效
标题翻译：用于光刻机和存储晶圆的透晶片互连
公开(公告)号：US07683458B2
公开(公告)日：2010-03-23
申请号：US11924781
申请日：2007-10-26
申请人： Salman Akram , Charles M. Watkins , William M. Hiatt , David R. Hembree , James M. Wark , Warren M. Farnworth , Mark E. Tuttle , Sidney B. Rigg , Steven D. Oliver , Kyle K. Kirby , Alan G. Wood , Lu Velicky
发明人： Salman Akram , Charles M. Watkins , William M. Hiatt , David R. Hembree , James M. Wark , Warren M. Farnworth , Mark E. Tuttle , Sidney B. Rigg , Steven D. Oliver , Kyle K. Kirby , Alan G. Wood , Lu Velicky
IPC分类号： H01L23/485
CPC分类号： H01L21/76877 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/45 , H01L27/14634 , H01L27/14636 , H01L2221/6834 , H01L2224/02166 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/48463 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
摘要翻译：公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

134. 发明授权

US07589010B2 Semiconductor devices with permanent polymer stencil and method for manufacturing the same 有权
标题翻译：具有永久聚合物模板的半导体器件及其制造方法
公开(公告)号：US07589010B2
公开(公告)日：2009-09-15
申请号：US11210606
申请日：2005-08-23
申请人： Warren M. Farnworth , Alan G. Wood , James M. Wark , David R. Hembree , Syed Sajid Ahmad , Michael E. Hess , John O. Jacobson
发明人： Warren M. Farnworth , Alan G. Wood , James M. Wark , David R. Hembree , Syed Sajid Ahmad , Michael E. Hess , John O. Jacobson
IPC分类号： H01L21/44
CPC分类号： H01L23/544 , B33Y30/00 , B33Y80/00 , H01L21/563 , H01L23/293 , H01L23/3157 , H01L24/81 , H01L24/83 , H01L2223/5448 , H01L2224/05571 , H01L2224/05573 , H01L2224/11005 , H01L2224/1147 , H01L2224/11472 , H01L2224/16 , H01L2224/293 , H01L2224/81011 , H01L2224/8121 , H01L2224/81815 , H01L2224/83851 , H01L2924/00014 , H01L2924/01078 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H01L2924/3512 , H01L2924/00 , H01L2224/05599
摘要： Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.
摘要翻译：使用具有孔的永久或临时聚合物层来制造半导体器件的方法来暴露接触焊盘并覆盖半导体器件的有源表面。

135. 发明申请

US20090191701A1 MICROELECTRONIC DEVICES AND METHODS FOR FORMING INTERCONNECTS IN MICROELECTRONIC DEVICES 有权
标题翻译：用于在微电子设备中形成互连的微电子器件和方法
公开(公告)号：US20090191701A1
公开(公告)日：2009-07-30
申请号：US12419029
申请日：2009-04-06
申请人： Kyle K. Kirby , Salman Akram , David R. Hembree , Sidney B. Rigg , Warren M. Farnworth , William M. Hiatt
发明人： Kyle K. Kirby , Salman Akram , David R. Hembree , Sidney B. Rigg , Warren M. Farnworth , William M. Hiatt
IPC分类号： H01L21/768
CPC分类号： H01L21/76898 , H01L23/481 , H01L24/48 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H05K1/0306 , H05K3/4038 , H05K3/422 , H05K3/423 , H05K2201/0305 , H05K2201/09827 , H05K2203/072 , H05K2203/1147 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.
摘要翻译：本文公开了微电子器件，用于封装微电子器件的方法，以及用于在微电子器件中形成互连的方法。在一个实施例中，一种方法包括提供具有正面和背面的微电子衬底。衬底具有包括集成电路的微电子管芯和可操作地耦合到集成电路的端子。该方法还包括至少部分地形成通过基底并且在基底的前侧和/或后侧具有开口的通道。该方法还包括用封闭通道一端的导电盖密封开口，同时通道的另一端保持打开。该方法然后包括用导电材料填充通道。

136. 发明授权

US07561938B2 Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs 失效
标题翻译：使用有关制造程序集成电路（ICS）的数据的方法已经进行了修复，以选择IC将经历的程序，例如额外修理
公开(公告)号：US07561938B2
公开(公告)日：2009-07-14
申请号：US11545067
申请日：2006-10-06
申请人： Salman Akram , Warren M. Farnworth , Derek J. Gochnour , David R. Hembree , Michael E. Hess , John O. Jacobson , James M. Wark , Alan G. Wood
发明人： Salman Akram , Warren M. Farnworth , Derek J. Gochnour , David R. Hembree , Michael E. Hess , John O. Jacobson , James M. Wark , Alan G. Wood
IPC分类号： G06F19/00
CPC分类号： G03F7/7065 , G06F11/006 , H01L2223/5444
摘要： An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on ICs at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a fuse ID of each of the ICs. The ID codes of the ICs are automatically read, for example, at an opens/shorts test during the manufacturing process. The data stored in association with the ID codes of the ICs is then accessed, and additional repair procedures the ICs may undergo are selected in accordance with the accessed data. Thus, for example, the accessed data may indicate that an IC is unrepairable, so the IC can proceed directly to a scrap bin without having to be queried to determine whether it is repairable, as is necessary in traditional IC manufacturing processes.
摘要翻译：在集成电路（IC）制造过程中的创造性方法，用于使用关于在探针上的IC进行的修复程序的数据，以确定是否在制造过程中稍后进行进一步的修理，包括将数据与每个的熔丝ID相关联地存储 IC。 IC的ID代码在制造过程中例如在打开/短路测试中自动读取。然后访问与IC的ID代码相关联存储的数据，并且根据所访问的数据选择IC可能经历的附加修复过程。因此，例如，访问的数据可以指示IC不可修复，因此IC可以直接进入废料仓，而不必被查询以确定其是否可修复，如在传统IC制造过程中所必需的。

137. 发明授权

US07488899B2 Compliant contact pin assembly and card system 失效
标题翻译：符合接触针组件和卡片系统
公开(公告)号：US07488899B2
公开(公告)日：2009-02-10
申请号：US11151925
申请日：2005-06-14
申请人： Kyle K. Kirby , Warren M. Farnworth , James M. Wark , William M. Hiatt , David R. Hembree , Alan G. Wood
发明人： Kyle K. Kirby , Warren M. Farnworth , James M. Wark , William M. Hiatt , David R. Hembree , Alan G. Wood
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： G01R1/0735 , G01R1/07314 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01R12/714 , H01R13/24 , H01R2201/20 , H05K3/326 , H05K7/1069 , H05K2201/0314 , H05K2201/09036 , H05K2201/10378 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599
摘要： A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.
摘要翻译：提供了柔性接触销组件和接触器卡系统。柔性接触销组件包括由基板的一部分形成的接触销，其中触头销顺从地保持通过柔性联接结构悬挂在基板内。衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

138. 发明授权

US07329943B2 Microelectronic devices and methods for forming interconnects in microelectronic devices 有权
标题翻译：用于在微电子器件中形成互连的微电子器件和方法
公开(公告)号：US07329943B2
公开(公告)日：2008-02-12
申请号：US11416824
申请日：2006-05-03
申请人： Kyle K. Kirby , Salman Akram , David R. Hembree , Sidney B. Rigg , Warren M. Farnworth , William M. Hiatt
发明人： Kyle K. Kirby , Salman Akram , David R. Hembree , Sidney B. Rigg , Warren M. Farnworth , William M. Hiatt
IPC分类号： H01L29/40
CPC分类号： H01L21/76898 , H01L23/481 , H01L24/48 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H05K1/0306 , H05K3/4038 , H05K3/422 , H05K3/423 , H05K2201/0305 , H05K2201/09827 , H05K2203/072 , H05K2203/1147 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.
摘要翻译：本文公开了微电子器件，用于封装微电子器件的方法，以及用于在微电子器件中形成互连的方法。在一个实施例中，一种方法包括提供具有正面和背面的微电子衬底。衬底具有包括集成电路的微电子管芯和可操作地耦合到集成电路的端子。该方法还包括至少部分地形成通过基底并且在基底的前侧和/或后侧具有开口的通道。该方法还包括用封闭通道一端的导电盖密封开口，同时通道的另一端保持打开。该方法然后包括用导电材料填充通道。

139. 发明授权

US07287326B2 Methods of forming a contact pin assembly 失效
标题翻译：形成接触销组件的方法
公开(公告)号：US07287326B2
公开(公告)日：2007-10-30
申请号：US11152496
申请日：2005-06-14
申请人： Kyle K. Kirby , Warren M. Farnworth , James M. Wark , William M. Hiatt , David R. Hembree , Alan G. Wood
发明人： Kyle K. Kirby , Warren M. Farnworth , James M. Wark , William M. Hiatt , David R. Hembree , Alan G. Wood
IPC分类号： H01R43/16 , H10R43/00
CPC分类号： G01R1/0735 , G01R1/07314 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01R12/714 , H01R13/24 , H01R2201/20 , H05K3/326 , H05K7/1069 , H05K2201/0314 , H05K2201/09036 , H05K2201/10378 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599
摘要： A compliant contact pin assembly method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.
摘要翻译：提供了一种用于制造的柔性接触销组装方法。柔性接触销组件包括由基板的一部分形成的接触销，其中触头销顺从地保持通过柔性联接结构悬挂在基板内。衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

140. 发明授权

US07282932B2 Compliant contact pin assembly, card system and methods thereof 失效
标题翻译：符合接触针组件，卡片系统及其方法
公开(公告)号：US07282932B2
公开(公告)日：2007-10-16
申请号：US10791195
申请日：2004-03-02
申请人： Kyle K. Kirby , Warren M. Farnworth , James M. Wark , William M. Hiatt , David R. Hembree , Alan G. Wood
发明人： Kyle K. Kirby , Warren M. Farnworth , James M. Wark , William M. Hiatt , David R. Hembree , Alan G. Wood
IPC分类号： G01R31/02
CPC分类号： G01R1/0735 , G01R1/07314 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01R12/714 , H01R13/24 , H01R2201/20 , H05K3/326 , H05K7/1069 , H05K2201/0314 , H05K2201/09036 , H05K2201/10378 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599
摘要： A compliant contact pin assembly, a contactor card, a testing system and methods for making and testing are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.
摘要翻译：提供了兼容的接触针组件，接触器卡，测试系统以及制造和测试方法。柔性接触销组件包括由衬底的一部分形成的接触针，其中触发销通过柔性耦合结构顺应地保持悬挂在衬底内。衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

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