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    • 131. 发明授权
    • OLED encapsulation method and OLED encapsulation structure
    • US10283730B2
    • 2019-05-07
    • US15514530
    • 2017-03-16
    • Shenzhen China Star Optoelectronics Technology Co., Ltd.
    • Youyuan Kuang
    • H01L51/00H01L51/52H01L51/56
    • The present invention provides an OLED encapsulation method and an OLED encapsulation structure. By arranging at least two loops of encapsulation resin frames around an outer circumference of the OLED device, the potential risk of external moisture and oxygen invading can be greatly reduce, and even one of the multiple loops of the encapsulation resin frames appears a defect spot, no influence would occur on the OLED device located internally. Further, by arranging a single or multiple encapsulation resin connection sections between two adjacent loops of the encapsulation resin frames, multiple discontinuous sealed and enclosed spaces are formed between two adjacent loops of the encapsulation resin frames so as to effectively block moisture and oxygen to flow among different ones of the sealed and enclosed spaces, whereby a defect spot occurring in any one of the encapsulation resin frames could only affect the sealed and enclosed space where the defect spot is located and would not affect the sealed and enclosed spaces of other sites so as to better block the invasion of external moisture and oxygen to the OLED device and thus improving encapsulation effectiveness of the OLED device. Based on the two features discussed above, the present invention may overcome the issue of invasion of moisture and oxygen resulting from defect spot caused by aging of an encapsulation resin frame and significantly improving light emission quality and service life of the OLED device.