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121. 发明授权

US07244159B2 Electromagnetic-shielding transparent window member and method for producing the same 有权
标题翻译：电磁屏蔽透明窗构件及其制造方法
公开(公告)号：US07244159B2
公开(公告)日：2007-07-17
申请号：US11103478
申请日：2005-04-12
申请人： Hidefumi Kotsubo
发明人： Hidefumi Kotsubo
IPC分类号： H01J9/12
CPC分类号： G02F1/136 , C23C18/1608 , C23C18/206 , C23C18/2066 , C23C18/30 , C23C18/405 , H05K3/182 , H05K9/0096 , H05K2201/0108 , H05K2203/0709
摘要： A method for producing an electromagnetic-shielding transparent window member including a transparent film and a patterned conductor disposed thereon includes the steps of applying a resin coating material containing a catalyst for electroless plating to the transparent film to form a patterned resin having the same pattern as the patterned conductor to be formed; and depositing a conductive material only on the patterned resin by electroless plating to form the patterned conductor.
摘要翻译：一种制造包括透明膜的电磁屏蔽透明窗构件的方法和其上布置的图案导体包括以下步骤：将含有用于化学镀的催化剂的树脂涂层材料涂覆到透明膜上以形成具有相同图案的图案化树脂要形成的图案化导体; 以及通过无电镀仅在图案化树脂上沉积导电材料以形成图案化的导体。

122. 发明申请

US20070160810A1 Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component 失效
标题翻译：图案化多孔成型体或无纺布的制造方法以及电路部件
公开(公告)号：US20070160810A1
公开(公告)日：2007-07-12
申请号：US10586341
申请日：2005-01-13
申请人： Fumihiro Hayashi , Yasuhito Masuda , Yasuhiro Okuda
发明人： Fumihiro Hayashi , Yasuhito Masuda , Yasuhiro Okuda
IPC分类号： B32B3/12 , B32B27/12 , B32B3/26
CPC分类号： B24C3/322 , B24C1/04 , B24C11/00 , C23C18/1605 , C23C18/1644 , C23C18/1651 , C23C18/1653 , C23C18/30 , H05K1/0284 , H05K3/107 , H05K3/182 , H05K3/184 , H05K2201/0116 , H05K2201/015 , H05K2201/0209 , H05K2201/0293 , H05K2201/09036 , H05K2201/09118 , H05K2203/025 , H05K2203/0565 , Y10T428/24479 , Y10T428/24496 , Y10T428/24612 , Y10T428/249953 , Y10T428/249987 , Y10T442/674
摘要： An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions. With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric. The invention provides a porous molded product or a nonwoven fabric in which a plated layer has been selectively formed on the surfaces of the through portions or the recessed portions, or both of these, an electric circuit component, or the like.
摘要翻译：本发明的一个目的是提供一种多孔材料的制造方法，其中图形化了复杂而精细的通过部分，凹陷部分等。提供一种图案化的多孔模制产品或非织造织物，其中已经在通孔部分和凹进部分的表面上选择性地形成镀层。通过本发明，将具有图案部分的面罩放置在多孔成型品或无纺布的至少一侧。含有磨粒的流体或流体从掩模上方喷射，从而形成通过部分或凹陷部分或两者，其中通过掩模的每个通过部分的开口形状被转移到多孔模制产品中或无纺布。本发明提供一种多孔成型体或非织造布，其中，在贯通部或凹部的表面，或这两者，电路部件等的表面上选择性地形成镀层。

123. 发明申请

US20070099425A1 METHOD FOR ETCHING NON-CONDUCTIVE SUBSTRATE SURFACES 有权
标题翻译：用于蚀刻非导电衬底表面的方法
公开(公告)号：US20070099425A1
公开(公告)日：2007-05-03
申请号：US11554100
申请日：2006-10-30
申请人： Mark Schildmann , Ulrich Prinz , Andreas Konigshofen
发明人： Mark Schildmann , Ulrich Prinz , Andreas Konigshofen
IPC分类号： H01L21/302
CPC分类号： C23C18/22 , C09K13/08 , C23C18/2086 , C23C18/24 , C23C18/30
摘要： An etching composition for non-conductive substrates such as polyester, polyether, polyimide, polyurethane, epoxy resin, polysulfone, polyethersulfone, polyetherimide, and polyamide, comprising a halogenide and/or nitrate of a metal selected from the group consisting of Na, Mg, Al, Si, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Ca, Zn, and combinations thereof such as FeCl3, FeCl2, TiCl3, CaCl2, CuCl2, CrCl3, ZnCl2, MgCl2, MnCl2, and Cr(NO3)3; and a related method for etching.
摘要翻译：一种用于非导电性基材例如聚酯，聚醚，聚酰亚胺，聚氨酯，环氧树脂，聚砜，聚醚砜，聚醚酰亚胺和聚酰胺的蚀刻组合物，其包含选自Na，Mg的卤化物和/或硝酸盐， Al，Si，Sc，Ti，V，Cr，Mn，Fe，Co，Ni，Cu，Ca，Zn及其组合，如FeCl 3，FeCl 2，，TiCl 3，CaCl 2，CuCl 2，CrCl 3，ZnCl 2，，MgCl 2，MnCl 2和Cr（NO 3 3）3; 和相关的蚀刻方法。

124. 发明申请

US20070059449A1 Plating method of metal film on the surface of polymer 审中-公开
标题翻译：聚合物表面镀金属膜的方法
公开(公告)号：US20070059449A1
公开(公告)日：2007-03-15
申请号：US11492195
申请日：2006-07-24
申请人： Seung-Kyun Ryu , Kon Su
发明人： Seung-Kyun Ryu , Kon Su
IPC分类号： B05D3/00 , H05H1/00
CPC分类号： C23C18/1653 , C23C18/2006 , C23C18/2086 , C23C18/285 , C23C18/30 , H05K3/381
摘要： The present invention relates to a method for plating the surface of polymer materials with a metal film by treating the surface of polymer materials with cold plasma method to introduce hydrophilic functional groups and then plating the surface of polymer materials with a metal film according to the electroless plating method. The cold plasma treatment reduces the contact angle of the surface of polymer materials to water by 5 to 60°. The surface of polymer materials can be more efficiently plated with the metal film by the additional step of either immersing the polymer material into an organic solvent for 0.1 to 5 minutes or washing the polymer material with ultrasonic washing machine after introducing the hydrophilic functional groups by treatment with cold plasma. The plating method according to the present invention is very stable and readily applicable and can endow new properties which are not possessed by the polymer material itself, including improved appearance quality, improved mechanical properties, improved heat resistance and durability, decrease of absorptivity, rendering the conductivity of heat and electric current, soldering ability and electromagnetic wave shielding effect, etc., to the polymer material. The polymer materials treated by the method according to the present invention have improved performance and can be used in various industrial fields for shielding electromagnetic wave generated from the information processing equipments, preparing printed circuit boards, various forms of electrodes, and antistatic boards and the like.
摘要翻译：本发明涉及一种通过用冷等离子体法处理聚合物材料的表面而用金属膜电镀表面的方法，以引入亲水性官能团，然后根据化学镀用金属膜对聚合物材料的表面进行镀覆电镀法。冷等离子体处理将聚合物材料表面与水的接触角降低5至60°。聚合物材料的表面可以通过将聚合物材料浸入有机溶剂中0.1至5分钟或者在通过处理引入亲水性官能团之后用超声波清洗机洗涤聚合物材料的附加步骤可更有效地镀金属膜用冷等离子体根据本发明的电镀方法非常稳定且易于应用，并且可以赋予聚合物材料本身不具有的新特性，包括改进的外观质量，改进的机械性能，改善的耐热性和耐久性，降低吸收性热电导率，焊接能力和电磁波屏蔽效果等，适用于聚合物材料。通过根据本发明的方法处理的聚合物材料具有改进的性能，可用于各种工业领域，用于屏蔽从信息处理设备产生的电磁波，制备印刷电路板，各种形式的电极和抗静电板等。

125. 发明申请

US20070003772A1 Method for metallizing a component comprising parts of different non-metallic materials 审中-公开
标题翻译：用于金属化包含不同非金属材料的部件的部件的方法
公开(公告)号：US20070003772A1
公开(公告)日：2007-01-04
申请号：US10575732
申请日：2004-10-18
申请人： Roland Tacken
发明人： Roland Tacken
IPC分类号： B05D3/10 , B05D3/04 , B32B15/04
CPC分类号： C23C18/1608 , C23C18/1639 , C23C18/1641 , C23C18/1889 , C23C18/208 , C23C18/285 , C23C18/30 , Y10T428/31678
摘要： Method for metallizing a component, comprising a first part (1), made of a first material (e.g. polymer), and a second part (2), made of a second material (e.g. polymer). A metallizing seed layer (6), e.g. catalytic to the subsequent chemical metallization process, is applied at the surface of the component, after which the surface of the component, including the metallizing seed layer, is exposed to a solvent (7) in which the surface of the first part (1) is, and the surface of the second part (2) is not soluble. In a following step the surface of the component is exposed to a metallizing environment (9) that, however, will only be metallized on the surface of the second component part.
摘要翻译：用于金属化部件的方法，包括由第一材料（例如聚合物）制成的第一部分（1）和由第二材料（例如聚合物）制成的第二部分（2）。金属化种子层（6），例如催化到后续的化学金属化过程被施加在部件的表面上，然后将包括金属化种子层的部件的表面暴露于其中第一部分（1）的表面的溶剂（7）并且第二部分（2）的表面是不溶的。在随后的步骤中，组件的表面暴露于金属化环境（9），然而，金属化环境（9）将仅在第二组分部分的表面上金属化。

126. 发明授权

US07144679B2 Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates 失效
标题翻译：聚酰亚胺树脂前体溶液，通过使用该溶液制备的电子部件的层压体和制造层压体的方法
公开(公告)号：US07144679B2
公开(公告)日：2006-12-05
申请号：US10450048
申请日：2001-12-28
申请人： Shinya Izumida , Koji Itoh , Minoru Oyama , Atsushi Suzuki
发明人： Shinya Izumida , Koji Itoh , Minoru Oyama , Atsushi Suzuki
IPC分类号： G03C1/725 , G03C1/735 , G03C1/74 , C08F2/46
CPC分类号： H05K3/387 , C08K5/0025 , C08K5/0091 , C09D179/08 , C23C18/1608 , C23C18/1612 , C23C18/2033 , C23C18/30 , H05K1/0346 , H05K3/181 , H05K3/185 , H05K3/386 , H05K2201/0154 , H05K2201/0236 , H05K2203/0709 , C08L79/04 , C08L79/08
摘要： Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.
摘要翻译：电子部件用层叠体通过在聚酰亚胺基板上涂布含有钯化合物的聚酰亚胺树脂前体溶液进行干燥而形成聚酰亚胺树脂前体层，在氢供体存在下照射紫外线，形成核用于底漆电镀，通过无电解电镀形成金属底漆层，并且在形成表面镀层之后或之后通过加热将聚酰亚胺树脂前体层转化成聚酰亚胺树脂层。本发明提供了电子部件的层叠体，其极大地改善了与金属层的粘附性，而不损害基板固有的特性，绝缘性能优异，并且用于制造层压体的聚酰亚胺树脂前体树脂溶液。

127. 发明申请

US20060260780A1 Use of an object as shaping tool 审中-公开
标题翻译：使用对象作为整形工具
公开(公告)号：US20060260780A1
公开(公告)日：2006-11-23
申请号：US10553242
申请日：2004-04-15
申请人： Hartmut Sauer
发明人： Hartmut Sauer
IPC分类号： B22D19/00
CPC分类号： C23C18/1662 , C23C18/1653 , C23C18/2013 , C23C18/22 , C23C18/285 , C23C18/30 , C25D5/14 , Y02T50/6765
摘要： Use of an article as moulding tool whose surface exhibits a composite material in full or in parts, the composite material consisting of a non-metallic substrate containing at least one polymer, and a metallic layer present thereon and deposited without external current, having an adhesive strength of at least 4 N/mm2.
摘要翻译：使用制品作为模制工具，其表面全部或部分地呈现复合材料，复合材料由含有至少一种聚合物的非金属基材和其上存在并沉积无外部电流的金属层组成，具有粘合剂至少4N / mm 2的强度。

128. 发明申请

US20060134442A1 Method for electroless plating 审中-公开
标题翻译：化学镀方法
公开(公告)号：US20060134442A1
公开(公告)日：2006-06-22
申请号：US10540451
申请日：2003-12-26
申请人： Minoru Sugiyama , Susumu Hara
发明人： Minoru Sugiyama , Susumu Hara
IPC分类号： B32B15/08
CPC分类号： C23C18/30 , C23C18/2066 , Y10T428/31678
摘要： A method for carrying out an electroless plating onto a polymer electrolyte, characterized in that it comprises a swelling step as a pre-treatment step of swelling the polymer electrolyte with a good solvent or a mixed solvent containing a good solvent, and the resultant swollen polymer electrolyte has a specific shape and a thickness 110% or more that of the polymer electrolyte in a dry state. The method allows the preparation of a laminate comprising a metal layer and a polymer electrolyte layer which can be used in an application field requiring a bending greater than that in a conventional field.
摘要翻译：一种用于在聚合物电解质上进行化学镀的方法，其特征在于，其包括作为预处理步骤的溶胀步骤，所述预处理步骤用良溶剂或含有良溶剂的混合溶剂使聚合物电解质溶胀，并将所得溶胀聚合物电解质在干燥状态下具有特定的形状和110％以上的聚合物电解质的厚度。该方法允许制备包含金属层和聚合物电解质层的层压体，其可用于需要弯曲的应用领域比常规领域更大。

129. 发明申请

US20060000720A1 Method for pretreating a surface of a non-conducting material to be plated 审中-公开
标题翻译：用于预处理要镀覆的非导电材料的表面的方法
公开(公告)号：US20060000720A1
公开(公告)日：2006-01-05
申请号：US10529467
申请日：2003-09-23
申请人： Per Moller
发明人： Per Moller
IPC分类号： C23C28/02
CPC分类号： C23C18/1889 , C23C18/208 , C23C18/285 , C23C18/30 , C25D5/54 , C25D5/56
摘要： A method for pretreating a surface of a non-conducting material to be plated through precipitation of metal where an adsorbing metal oxide is initially deposited, such as MnO2 or Fe2O3 on the surface, whereafter said surface is treated with a solution of transition metal ions, such as Sn++ ions, and then with a solution of metal ions of a catalytic metal catalyzing chemical plating, such as a metal of the platinum group. The transition metal ions used are selected among such ions that can reduce catalytic metal ions into catalytic metal. The method renders it possible to plate non-conducting materials, such as plastic materials, which cannot or only with great difficulty can be plated by a conventional activation by means of colloidal palladium.
摘要翻译：一种用于通过沉积首先沉积金属氧化物的金属沉淀的非导电材料的表面进行预处理的方法，例如MnO 2 2或Fe 2 O 2 在表面上，然后用过渡金属离子如Sn ++离子的溶液处理所述表面，然后用催化剂的金属离子溶液金属催化化学镀，如铂族金属。使用的过渡金属离子选自可以将催化金属离子还原成催化金属的离子。该方法使得可以对非导电材料（例如塑料材料）进行平板化，这些材料不能也不会很困难，可以通过胶体钯的常规活化来镀覆。

130. 发明申请

US20050233148A1 Metallised parts made from plastic material 审中-公开
标题翻译：由塑料制成的金属部件
公开(公告)号：US20050233148A1
公开(公告)日：2005-10-20
申请号：US10517041
申请日：2003-06-06
申请人： Antoine Fares-Karam
发明人： Antoine Fares-Karam
IPC分类号： C23C18/16 , C23C18/30 , H05K3/18 , H05K3/38 , B32B9/04
CPC分类号： C23C18/30 , C23C18/1607 , C23C18/1641 , C23C18/1653 , C23C18/2006 , C23C18/208 , C23C18/36 , C23C18/405 , H05K3/182 , Y10T428/31504 , Y10T428/31678
摘要： In order to metallise a support made from high temperature polymer, the melting temperature of which is higher than 180° C., it is shown that the stages of cleaning, plasma etching, grafting and then metallising in a metallisation bath can be applied. According to the invention, the metallisation bath is brought to a temperature between 50° C. and 70° C., the plasma being a nitrogenous plasma.
摘要翻译：为了对由高温聚合物制成的支撑体进行金属化，其熔化温度高于180℃，可以应用金属化浴中的清洗，等离子体蚀刻，接枝和金属化阶段。根据本发明，使金属化浴达到50℃和70℃之间的温度，等离子体是含氮等离子体。

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