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    • 125. 发明申请
    • Solid-State Imaging Device, Signal Processing Method, and Camera
    • 固态成像装置,信号处理方法和相机
    • US20090009621A1
    • 2009-01-08
    • US12160291
    • 2006-07-11
    • Takumi YamaguchiYuuichi InabaDaisuke UedaYoshiyuki Matsunaga
    • Takumi YamaguchiYuuichi InabaDaisuke UedaYoshiyuki Matsunaga
    • H04N5/228H04N5/335
    • H04N9/045H04N5/33H04N5/332
    • A solid-state imaging apparatus that performs color imaging using visible light and imaging using infrared light, the solid-state imaging apparatus including a plurality of two-dimensionally arranged pixel cells, in each of which a filter mainly transmits one of visible light and infrared light, wherein filters are arranged such that a first unit of arrangement where a plurality of filters that mainly transmit visible light are arranged and a second unit of arrangement where a filter that mainly transmits visible light and a filter that mainly transmits infrared light are arranged are alternately arranged in both a row direction and a column direction. Also, in the first unit of arrangement are arranged filters including three kinds of filters each transmitting one of red light, green light and blue light and in the second unit of arrangement are arranged four kinds of filters each transmitting one of red light, green light, blue light and infrared light.
    • 一种使用可见光进行彩色成像并使用红外光成像的固态成像装置,所述固态成像装置包括多个二维排列的像素单元,每个像素单元中的每一个主要透过可见光和红外线之一 光,其中滤光器被布置成使得布置有主要透射可见光的多个滤光器的第一布置单元和布置有主要透射可见光的滤光器的第二单元和布置有主要透射红外光的滤光器的布置的第二单元是布置的, 交替地排列在行方向和列方向上。 此外,在第一单元中布置有包括发射红光,绿光和蓝光中的一种的三种滤光器的滤色器,并且在第二种布置中布置了四种滤色片,每种滤色片透过红光,绿光 ,蓝光和红外灯。
    • 126. 发明申请
    • Feeding apparatus, and image forming apparatus incorporating feeding apparatus
    • 进料装置和包含进料装置的成像装置
    • US20080315511A1
    • 2008-12-25
    • US12222843
    • 2008-08-18
    • Daisuke UedaAkira KosugiShigeru OkazakiTakanori KandaKenichi Hosoi
    • Daisuke UedaAkira KosugiShigeru OkazakiTakanori KandaKenichi Hosoi
    • B65H7/02
    • B65H3/5261B65H3/0623B65H3/0669B65H2515/40B65H2220/01
    • A feeding apparatus including a feeding roller for conveying a sheet, a separation roller for conveying the sheet in a reverse direction, a transmission mechanism for transmitting the rotational force to the feeding roller, a limited force reverse transmission mechanism for transmitting the rotational force to the separation roller through a torque limiter, a forced reverse transmission mechanism for directly transmitting the rotational force to the separation roller, a temperature detector and a controller, wherein the controller controls the separation roller to receive rotational force through the forced reverse transmission mechanism after the limited force reverse transmission mechanism transmits the rotational force to the separation roller, then allows the limited force reverse transmission mechanism to transmit the rotational force to the separation roller, or to rotate the feeding via the transmission mechanism and the limited force transmission mechanism to transmit the rotational force to the separation roller.
    • 一种供给装置,包括用于输送片材的进给辊,用于沿相反方向输送片材的分离辊,用于将旋转力传递到进给辊的传动机构,用于将旋转力传递到 分离辊通过扭矩限制器,用于将旋转力直接传递到分离辊的强制反向传递机构,温度检测器和控制器,其中控制器控制分离辊以在限制后受到强制反向传递机构的旋转力 力反向传递机构将旋转力传递到分离辊,然后允许限制力反向传递机构将旋转力传递到分离辊,或者通过传动机构和限制力传递机构旋转进给,以传送旋转体 到分离辊的力。
    • 130. 发明申请
    • Via hole machining for microwave monolithic integrated circuits
    • 微波单片集成电路的通孔加工
    • US20070026676A1
    • 2007-02-01
    • US11194419
    • 2005-08-01
    • Ming LiXinbing LiuHiroyuki SakaiMasaaki NishijimaDaisuke Ueda
    • Ming LiXinbing LiuHiroyuki SakaiMasaaki NishijimaDaisuke Ueda
    • H01L21/302
    • B23K26/0624B23K26/40B23K2103/50
    • A method for forming a via in a sapphire substrate with a laser machining system that includes an ultrafast pulsed laser source. The sapphire substrate is provided. Pulses of laser light are substantially focused to a beam spot on the first surface of the sapphire substrate such that each focused pulse of laser light ablates a volume of the sapphire substrate having a depth less than the substrate thickness. The beam spot of the focused laser light pulses is scanned over a via portion of the first surface of the sapphire substrate. The sapphire substrate is moved in a direction substantially normal to the first surface to control the volume of the sapphire substrate ablated by each pulse of laser light to be substantially constant. The pulsing and scanning steps are repeated until the via is formed extending from the first surface to the second surface of the sapphire substrate.
    • 一种在具有包括超快脉冲激光源的激光加工系统的蓝宝石衬底中形成通孔的方法。 提供蓝宝石衬底。 激光的脉冲基本上聚焦到蓝宝石衬底的第一表面上的束斑上,使得每个聚焦的激光脉冲消除了具有小于衬底厚度的深度的蓝宝石衬底的体积。 聚焦激光脉冲的束斑在蓝宝石衬底的第一表面的通孔部分上扫描。 蓝宝石衬底沿着基本上垂直于第一表面的方向移动,以控制由每个激光脉冲消融的蓝宝石衬底的体积基本恒定。 重复脉冲和扫描步骤,直到形成从蓝宝石衬底的第一表面延伸到第二表面的通孔。