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    • 122. 发明授权
    • Label printer with selectible dispensible modes for peeling and non-peeling modes
    • 标签打印机具有可选择的剥离和非剥离模式的可分配模式
    • US07083344B2
    • 2006-08-01
    • US11176093
    • 2005-07-07
    • Masayo MiyasakaGo HiroikeKazuko FukanoToru TakamiKoji Yamada
    • Masayo MiyasakaGo HiroikeKazuko FukanoToru TakamiKoji Yamada
    • B41J11/42B41J13/26
    • B41J15/042B41J3/4075B41J11/0095
    • In a label printer in which either a peeling mode or non-peeling mode can be selected as the label dispensing mode, labels are printed and thus wasted when the operator loads the label paper into a transportation path that does not match the desired dispensing mode. This problem is solved by a label printer enabling selecting as the printing configuration either a peeling configuration for peeling printed labels from the web of label paper 11, or a non-peeling configuration in which the printed labels are not separated from the web of the label paper 11. A printing configuration selection unit 27 enables selecting which printing configuration to use. To operate in the non-peeling mode, the label paper 11 is loaded into a first paper transportation path A. To operate in the peeling mode, the label paper 11 is loaded to a second paper transportation path B. A cover unit 2 can be opened and closed to enable handling the label paper, and takes the label printer off-line when the cover unit 2 is opened. A mode selection switch 19 is accessible only when the cover unit is open and operating the mode selection switch causes the printing configuration selection unit 27 to change the printing configuration.
    • 在可以选择剥离模式或非剥离模式作为标签分配模式的标签打印机中,当操作者将标签纸装载到与所需分配模式不匹配的传送路径中时,打印标签并因此浪费。 该标签打印机能够通过标签打印机来解决打印配置,即从标签纸11的卷筒纸上剥离印刷标签的剥离构造,或者打印标签不与标签纸幅分离的非剥离构造 纸11。 打印配置选择单元27能够选择使用哪种打印配置。 为了在非剥离模式下操作,标签纸11被装载到第一纸张传送路径A中。为了在剥离模式下操作,标签纸11被装载到第二纸张传送路径B.盖单元2可以 打开和关闭,以便处理标签纸,并在盖子单元2打开时将标签打印机离线。 模式选择开关19仅在盖单元打开时才可访问,并且操作模式选择开关使打印配置选择单元27改变打印配置。
    • 125. 发明申请
    • Label printer
    • 标签打印机
    • US20060008311A1
    • 2006-01-12
    • US11176093
    • 2005-07-07
    • Masayo MiyasakaGo HiroikeKazuko FukanoToru TakamiKoji Yamada
    • Masayo MiyasakaGo HiroikeKazuko FukanoToru TakamiKoji Yamada
    • B41J15/04B41J15/16B41J29/42
    • B41J15/042B41J3/4075B41J11/0095
    • In a label printer in which either a peeling mode or non-peeling mode can be selected as the label dispensing mode, labels are printed and thus wasted when the operator loads the label paper into a transportation path that does not match the desired dispensing mode. This problem is solved by a label printer enabling selecting as the printing configuration either a peeling configuration for peeling printed labels from the web of label paper 11, or a non-peeling configuration in which the printed labels are not separated from the web of the label paper 11. A printing configuration selection unit 27 enables selecting which printing configuration to use. To operate in the non-peeling mode, the label paper 11 is loaded into a first paper transportation path A. To operate in the peeling mode, the label paper 11 is loaded to a second paper transportation path B. A cover unit 2 can be opened and closed to enable handling the label paper, and takes the label printer off-line when the cover unit 2 is opened. A mode selection switch 19 is accessible only when the cover unit is open and operating the mode selection switch causes the printing configuration selection unit 27 to change the printing configuration.
    • 在可以选择剥离模式或非剥离模式作为标签分配模式的标签打印机中,当操作者将标签纸装载到与所需分配模式不匹配的传送路径中时,打印标签并因此浪费。 该标签打印机能够通过标签打印机来解决打印配置,即从标签纸11的卷筒纸上剥离印刷标签的剥离构造,或者打印标签不与标签纸幅分离的非剥离构造 纸11。 打印配置选择单元27能够选择使用哪种打印配置。 为了在非剥离模式下操作,标签纸11被装载到第一纸张传送路径A中。为了在剥离模式下操作,标签纸11被装载到第二纸张传送路径B.盖单元2可以 打开和关闭,以便处理标签纸,并在盖子单元2打开时将标签打印机离线。 模式选择开关19仅在盖单元打开时才可访问,并且操作模式选择开关使打印配置选择单元27改变打印配置。
    • 128. 发明申请
    • Optical semiconductor device
    • 光半导体器件
    • US20050121687A1
    • 2005-06-09
    • US11000403
    • 2004-12-01
    • Koji Yamada
    • Koji Yamada
    • G02B6/42H01S5/00H01S5/02H01S5/022H01L33/00
    • G02B6/4201G02B6/4204H01S5/02252H01S5/02284H01S5/02288
    • An optical semiconductor device having high precision of optical coupling and fabricated at low cost. The device comprises a semiconductor chip used as light source 3, lens system 6 constituted from one or more resin lenses for converging light output from the semiconductor chip used as light source 3, a conductive base 2 for mounting the semiconductor chip 3 thereon, and lens support assembly 4 and 5 for maintaining a predetermined distance from the semiconductor chip 3 and supporting the resin lens 6. Deviation from the image point of the lens system 6 caused by change of the refractive index of the lens system 6 due to change in temperature is compensated for by change in the distance between the semiconductor chip 3 and the lens system 6, caused by thermal expansion of the electrically conductive base 2 and the lens support assembly 4 and 5.
    • 一种具有高精度的光耦合并以低成本制造的光学半导体器件。 该装置包括用作光源3的半导体芯片,由用于会聚从用作光源3的半导体芯片输出的光的一个或多个树脂透镜构成的透镜系统6,用于将半导体芯片3安装在其上的导电基座2和透镜 支撑组件4和5用于保持与半导体芯片3的预定距离并支撑树脂透镜6。 通过由于温度变化而导致的透镜系统6的折射率的变化引起的与透镜系统6的像点的偏离通过由热膨胀引起的半导体芯片3与透镜系统6之间的距离的变化来补偿 的导电基底2和透镜支撑组件4和5。
    • 129. 发明授权
    • Method of manufacturing a waveguide optical semiconductor device
    • 制造波导光半导体器件的方法
    • US06773945B2
    • 2004-08-10
    • US10212170
    • 2002-08-06
    • Koji Yamada
    • Koji Yamada
    • H01L2100
    • H01S5/0425H01S5/02276H01S5/0421H01S5/2081
    • A method of manufacturing a waveguide optical semiconductor device provides a semiconductor substrate including a lower clad layer, a core layer, an upper clad layer and a contact layer formed on the substrate in order. The contact layer and a part of the upper clad layer are removed by dry etching between a pair of parallel line patterns and at an independent rectangular pattern located near the line patterns. Then, the remaining upper clad layer is removed by wet etching so as to expose the core layer within the line patterns and the independent rectangular pattern. An insulating material is coated on the exposed core layer. The insulating material formed on the contact layer is removed within a region located between the pair of line patterns so that a part of the contact layer is exposed. An electrode layer is formed on the exposed contact layer. Finally, a bonding pad layer is formed over the independent rectangular pattern and a part of the electrode layer.
    • 制造波导光半导体器件的方法按顺序提供包括下覆盖层,芯层,上覆层和形成在基片上的接触层的半导体衬底。 通过在一对平行线图案之间的干蚀刻和位于线图案附近的独立矩形图案来去除接触层和上包层的一部分。 然后,通过湿蚀刻去除剩余的上包层,以便在线图案和独立矩形图案中露出芯层。 绝缘材料涂覆在暴露的芯层上。 形成在接触层上的绝缘材料在位于一对线图案之间的区域内被去除,使得接触层的一部分露出。 在暴露的接触层上形成电极层。 最后,在独立的矩形图案和电极层的一部分上形成接合焊盘层。