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    • 125. 发明授权
    • Thin film transistor panel and fabricating method thereof
    • 薄膜晶体管面板及其制造方法
    • US07968385B2
    • 2011-06-28
    • US12605566
    • 2009-10-26
    • Chang-Oh JeongDong-Hoon Lee
    • Chang-Oh JeongDong-Hoon Lee
    • H01L21/00
    • H01L27/12H01L27/124H01L29/41733H01L29/66765
    • A thin film transistor panel includes; an insulating substrate, a gate line including a gate electrode disposed on the insulating substrate, a gate insulating layer disposed on the gate electrode, a semiconductor layer disposed on the gate insulating layer, the semiconductor layer including a sidewall, a data line including a source electrode disposed on the semiconductor layer, a drain electrode disposed substantially opposite to and spaced apart from the source electrode, a first protective film disposed on the data line, the first protective film including a sidewall, a second protective film disposed on the first protective film and including a sidewall, and a pixel electrode electrically connected to the drain electrode, wherein the sidewall of the second protective film is disposed inside an area where the sidewall of the first protective film is disposed, and the source electrode and the drain electrode cover the sidewall of the semiconductor layer.
    • 薄膜晶体管面板包括: 绝缘基板,包括设置在绝缘基板上的栅电极的栅极线,设置在栅极上的栅极绝缘层,设置在栅极绝缘层上的半导体层,包括侧壁的半导体层,包括源极的数据线 设置在所述半导体层上的电极,与所述源极电极基本相对并间隔设置的漏电极,设置在所述数据线上的第一保护膜,所述第一保护膜包括侧壁,设置在所述第一保护膜上的第二保护膜 并且包括侧壁和与漏电极电连接的像素电极,其中第二保护膜的侧壁设置在设置有第一保护膜的侧壁的区域的内侧,源电极和漏电极覆盖 半导体层的侧壁。
    • 130. 发明授权
    • Wiring line assembly and method for manufacturing the same, and thin film transistor array substrate having the wiring line assembly and method for manufacturing the same
    • 配线组装及其制造方法以及具有布线组件的薄膜晶体管阵列基板及其制造方法
    • US07276731B2
    • 2007-10-02
    • US11053833
    • 2005-02-10
    • Chang-Oh JeongBong-Joo KangJae-Gab Lee
    • Chang-Oh JeongBong-Joo KangJae-Gab Lee
    • H01L29/04
    • G02F1/13458G02F1/136286G02F2001/13629G02F2001/136295H01L23/53242H01L27/12H01L27/124H01L27/1288H01L29/4908H01L2924/0002H01L2924/00
    • In a method for fabricating a thin film transistor array substrate, a glass substrate undergoes an oxygen plasma treatment. A silver or silver alloy-based conductive layer is deposited onto the substrate, and patterned to thereby form a gate line assembly proceeding in the horizontal direction. The gate line assembly includes gate lines, gate electrodes, and gate pads. Thereafter, a silicon nitride-based gate insulating layer is deposited onto the substrate, and a semiconductor layer and an ohmic contact layer are sequentially formed on the gate insulating layer. The semiconductor layer and the ohmic contact layer are HF-treated. A silver alloy-based conductive layer is deposited onto the substrate, and patterned to thereby form a data line assembly. The data line assembly includes data lines crossing over the gate lines, source electrodes, drain electrodes, and data pads. A protective layer based on silicon nitride or an organic material is deposited onto the substrate, and patterned through dry etching such that the protective layer bears contact holes exposing the drain electrodes, the gate pads and the data pads, respectively. An indium zinc oxide or indium tin oxide-based layer is deposited onto the substrate, and patterned to thereby form pixel electrodes, and subsidiary gate and data pads. The pixel electrodes are electrically connected to the drain electrodes, and the subsidiary gate and data pads to the gate and data pads.
    • 在制造薄膜晶体管阵列基板的方法中,玻璃基板进行氧等离子体处理。 将银或银合金基导电层沉积到衬底上,并被图案化,从而形成在水平方向上进行的栅极线组件。 栅极线组件包括栅极线,栅电极和栅极焊盘。 此后,在衬底上沉积氮化硅基栅极绝缘层,并且在栅极绝缘层上依次形成半导体层和欧姆接触层。 对半导体层和欧姆接触层进行HF处理。 将银合金基导电层沉积到衬底上,并被图案化从而形成数据线组件。 数据线组件包括跨越栅极线,源电极,漏电极和数据焊盘的数据线。 基于氮化硅或有机材料的保护层沉积到衬底上,并通过干蚀刻图案化,使得保护层分别暴露漏电极,栅极焊盘和数据焊盘的接触孔。 将氧化铟锌或铟锡氧化物基层沉积在衬底上,并被图案化,从而形成像素电极,以及辅助栅极和数据焊盘。 像素电极电连接到漏电极,辅助栅极和数据焊盘电连接到栅极和数据焊盘。